Abstract: Outer electrodes include end-surface outer electrodes arranged on end surfaces of a ceramic multilayer body, and side-surface outer electrodes on side surfaces of the ceramic multilayer body, the side-surface outer electrodes being electrically connected to the end-surface outer electrodes. Sputtered electrode layers of the side-surface outer electrodes in contact with the ceramic multilayer body are composed of a material containing a metal with a standard redox potential of about ?2.36 V to about ?0.74 V, the proportion of the metal in the material being about 3% by mass or more. Sputtered outermost electrode layers serving as the outermost layers of the side-surface outer electrodes are composed of a metal or an alloy in which the heat of solution of hydrogen is about 23.8 kJ/molH or more.

Abstract: An outer electrode includes sintered layers each containing a sintered metal, an electrically insulating glass layer, and metal layers each containing at least one of Sn and Cu. Each sintered layer covers a respective end surface of a body and extends from the end surface to at least one main surface of the body. The glass layer is directly provided on the sintered layers located on the end surfaces of the body, extends in a direction perpendicular or substantially perpendicular to side surfaces of the body, and defines a portion of a surface of the outer electrode. Each metal layer covers a portion of one of the sintered layers other than a portion of the corresponding sintered layer that is covered with the glass layer, and defines another portion of the surface of the outer electrode.

Abstract: A multilayer ceramic capacitor contains Ni in internal electrodes, and includes a sintered metal layer containing Cu in external electrodes. At a joined portion between each internal electrode and each external electrode, mutual diffusion layers of Cu and Ni extend across the internal and external electrodes. On each internal electrode, a mutual diffusion layer is present with a thickness t1, which is defined by a dimension from a first end surface or a second end surface to an interior end in a longitudinal direction, not smaller than about 0.5 ?m and not greater than about 5 ?m. On each external electrode, a mutual diffusion layer is present with a thickness t2, which is defined by a dimension from the first end surface or the second end surface to an exterior end in the longitudinal direction, not smaller than about 2.5% and not greater than about 33.3% of a thickness t0 of a sintered metal layer.

Abstract: A ceramic electronic component includes a ceramic element assembly and external electrodes. The external electrodes are disposed on the ceramic element assembly. The external electrodes include an underlying electrode layer and a first Cu plating film. The underlying electrode layer is disposed on the ceramic element assembly. The first Cu plating film is disposed on the underlying electrode layer. The underlying electrode layer includes a metal that is diffusible in Cu and a ceramic bonding material. The metal that is diffusible in Cu is diffused in at least a surface layer in the underlying electrode layer side of the first Cu plating film.

Abstract: A ceramic electronic component includes a ceramic base, first and second internal electrodes, and first and second external electrodes. The first external electrode is disposed at a first end portion of a first major surface in the longitudinal direction. The second external electrode is disposed at a second end portion of the first major surface in the longitudinal direction. A portion of each of the first and second external electrodes is opposed in the thickness direction to a region where the first and second internal electrodes are opposed to each other in the thickness direction. A condition ( 1/10)t0?t1 ?(?)t0 is satisfied, where to is the thickness of each of the first and second external electrodes and t1 is the thickness of a portion in which each of the first and second external electrodes is embedded in the first major surface.

Abstract: A ceramic electronic component includes a ceramic element assembly and external electrodes. The external electrodes are disposed on the ceramic element assembly. The external electrodes include an underlying electrode layer and a first Cu plating film. The underlying electrode layer is disposed on the ceramic element assembly. The first Cu plating film is disposed on the underlying electrode layer. The underlying electrode layer includes a metal that is diffusible in Cu and a ceramic bonding material. The metal that is diffusible in Cu is diffused in at least a surface layer in the underlying electrode layer side of the first Cu plating film.

Abstract: A ceramic electronic component includes a ceramic body, a glass coating layer, and an electrode terminal. The ceramic body includes a plurality of internal electrodes whose ends are exposed on the surface of the ceramic body. The glass coating layer covers a portion of the ceramic body on which the internal electrodes are exposed. The electrode terminal is provided directly on the glass coating layer. The electrode terminal includes a plating film. The glass coating layer is made of a glass medium in which metal powder particles are dispersed. The metal powder particles define conduction paths that electrically connect the internal electrodes with the electrode terminal.

Abstract: A ceramic electronic component includes a ceramic body, a glass coating layer, and terminal electrodes. End portions of inner electrodes are exposed at a surface of the ceramic body. The glass coating layer covers portions of the ceramic body in which the inner electrodes are exposed. The terminal electrodes are disposed directly above the glass coating layer and are each constituted by a plating film. The glass coating layer includes a glass medium and metal powder particles that are dispersed in the glass medium and define conductive paths which electrically connect the inner electrodes and the terminal electrodes. The metal powder particles include first metal powder particles and second metal powder particles. The first metal powder particles are flat or substantially flat powder particles. The second metal powder particles are spherical or substantially spherical powder particles.

Abstract: A multilayer ceramic capacitor includes an external electrode that is unlikely to be peeled. First and second external electrodes each include base layers provided over a ceramic body and including a metal and glass, and Cu plated layers provided over the base layers. The multilayer ceramic capacitor includes a reactive layer. The reactive layer contains about 5 atomic % to about 15 atomic % of Ti, about 5 atomic % to about 15 atomic % of Si, and about 2 atomic % to about 10 atomic % of V.

Abstract: A multilayer ceramic capacitor that includes a layered body in which dielectric layers and internal electrode layers are layered alternately, an external electrode on a surface of the layered body and a plating layer on a surface of the external electrode. The external electrode contains Cu, and a protective layer containing Cu2O is provided at a joining portion between the external electrode and the plating layer. When heat is applied to the layered body after the external electrode is removed, a ratio of an arithmetic mean value Xa of a quantity of hydrogen generated per unit temperature in a range higher than or equal to 350° C. with respect to an arithmetic mean value Y of a quantity of hydrogen generated per unit temperature in a range higher than or equal to 230° C. and lower than or equal to 250° C. (Xa/Y) is less than or equal to 0.66.

Abstract: A multilayer ceramic capacitor that contains at least one kind of a first element that forms a covalent hydride with hydrogen (except for an element generating a hydride having a boiling point of less than 125° C.) and a second element that forms a hydride in a boundary region with hydrogen between an outermost plating layer constituting an external electrode and a dielectric layer constituting a ceramic element body.

Abstract: A ceramic electronic component includes a ceramic body, a glass coating layer, and an electrode terminal. The ceramic body includes a plurality of internal electrodes whose ends are exposed on the surface of the ceramic body. The glass coating layer covers a portion of the ceramic body on which the internal electrodes are exposed. The electrode terminal is provided directly on the glass coating layer. The electrode terminal includes a plating film. The glass coating layer is made of a glass medium in which metal powder particles are dispersed. The metal powder particles define conduction paths that electrically connect the internal electrodes with the electrode terminal.

Abstract: A ceramic electronic component includes a ceramic body; a plurality of internal electrodes provided in the ceramic body and including ends exposed on a surface of the ceramic body; a coating layer covering a surface portion of the ceramic body on which the internal electrodes are exposed, the coating layer being made of a glass or resin medium in which metal powder particles are dispersed; and an electrode terminal provided directly on the coating layer and including a plating film. The metal powder particles define conduction paths electrically connecting the internal electrodes with the electrode terminal and have an elongated shape in cross section along a thickness direction of the coating layer. The metal powder particles defining the conduction paths have a maximum diameter not smaller than the thickness of the coating layer.

Abstract: A ceramic electronic component includes a ceramic body, a plurality of internal electrodes provided in the ceramic body and including ends exposed on a surface of the ceramic body; a glass coating layer covering a portion of the surface of the ceramic body on which the internal electrodes are exposed; and an electrode terminal provided directly on the glass coating layer and including a plating film. The glass coating layer is made of a glass medium in which metal powder particles are dispersed. The internal electrodes project from the surface of the ceramic body into the glass coating layer without passing through the glass coating layer. The metal powder particles define conduction paths electrically connecting the internal electrodes with the electrode terminal.

Abstract: A multilayer ceramic electronic component having outer electrodes that each include an end-face outer electrode disposed on an end face of a ceramic multilayer body and side-face outer electrodes formed by a sputtering method on side faces of the ceramic multilayer body and electrically connected to the end-face outer electrode. A sputtering electrode layer of each of the side-face outer electrodes in contact with the ceramic multilayer body is composed of a material containing 3% by mass or more of a metal having a standard oxidation-reduction potential of ?2.36 to ?0.74 V, and an outermost sputtering electrode layer which is an outermost layer of each of the side-face outer electrodes is composed of at least one of Sn and Bi or an alloy containing 5% by mass or more of at least one of Sn and Bi.

Abstract: A first outer electrode and first inner electrodes are supplied with an anode potential and a second outer electrode and second inner electrodes are supplied with a cathode potential when a monolithic ceramic capacitor is mounted and in use. The first outer electrode supplied with the anode potential has a thickness that is greater than a thickness of the second outer electrode supplied with the cathode potential.

Abstract: Outer electrodes include end-surface outer electrodes arranged on end surfaces of a ceramic multilayer body, and side-surface outer electrodes on side surfaces of the ceramic multilayer body, the side-surface outer electrodes being electrically connected to the end-surface outer electrodes. Sputtered electrode layers of the side-surface outer electrodes in contact with the ceramic multilayer body are composed of a material containing a metal with a standard redox potential of about ?2.36 V to about ?0.74 V, the proportion of the metal in the material being about 3% by mass or more. Sputtered outermost electrode layers serving as the outermost layers of the side-surface outer electrodes are composed of a metal or an alloy in which the heat of solution of hydrogen is about 23.8 kJ/molH or more.

Abstract: A ceramic electronic component includes a ceramic body and an outer electrode. The ceramic body includes first and second principal surfaces, first and second lateral surfaces, and first and second end surfaces. The outer electrode is provided on the first principal surface. The outer electrode includes an underlying electrode layer containing Cu and glass, and a Cu plating layer. The underlying electrode layer is disposed on the first principal surface. The Cu plating layer is disposed on the underlying electrode layer. The Cu plating layer is thicker than the underlying electrode layer.

Abstract: A ceramic electronic component includes a ceramic base body and first and second outer electrodes. The ceramic base body includes first and second primary surfaces, first and second side surfaces, and first and second end surfaces. The first and second outer electrodes are arranged on the ceramic base body so that front end portions of the outer electrodes face each other. The first and the second outer electrodes include outermost layers each containing Cu. Outermost layers of the facing front end portions of the first and the second outer electrodes are more oxidized than outermost layers of the other portions of the first and the second outer electrodes.

Abstract: A method of manufacturing a ceramic electronic component prevents variations in characteristics even when the ceramic electronic component is embedded in a wiring board. Ceramic green sheets containing an organic binder having a degree of polymerization in a range from about 1000 to about 1500 are prepared. A first conductive paste layer is formed on a surface of each of the ceramic green sheets. The ceramic green sheets are laminated to form a raw ceramic laminated body. A second conductive paste layer is formed on a surface of the raw ceramic laminated body. The raw ceramic laminated body formed with the second conductive paste layer is fired.