Patents by Inventor Yasuhiro Nishisaka

Yasuhiro Nishisaka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140332260
    Abstract: A method of manufacturing a ceramic electronic component prevents variations in characteristics even when the ceramic electronic component is embedded in a wiring board. Ceramic green sheets containing an organic binder having a degree of polymerization in a range from about 1000 to about 1500 are prepared. A first conductive paste layer is formed on a surface of each of the ceramic green sheets. The ceramic green sheets are laminated to form a raw ceramic laminated body. A second conductive paste layer is formed on a surface of the raw ceramic laminated body. The raw ceramic laminated body formed with the second conductive paste layer is fired.
    Type: Application
    Filed: July 24, 2014
    Publication date: November 13, 2014
    Inventors: Koji SATO, Yukio SANADA, Yasuhiro NISHISAKA
  • Publication number: 20140312743
    Abstract: A ceramic electronic component includes a ceramic base, first and second internal electrodes, and first and second external electrodes. The first external electrode is disposed at a first end portion of a first major surface in the longitudinal direction. The second external electrode is disposed at a second end portion of the first major surface in the longitudinal direction. A portion of each of the first and second external electrodes is opposed in the thickness direction to a region where the first and second internal electrodes are opposed to each other in the thickness direction. A condition ( 1/10)t0?t1 ?(?)t0 is satisfied, where to is the thickness of each of the first and second external electrodes and t1 is the thickness of a portion in which each of the first and second external electrodes is embedded in the first major surface.
    Type: Application
    Filed: July 1, 2014
    Publication date: October 23, 2014
    Inventors: Koji SATO, Yukio SANADA, Yasuhiro NISHISAKA, Masaki HIROTA
  • Publication number: 20140291000
    Abstract: A ceramic electronic component includes a ceramic body and an outer electrode. The ceramic body includes first and second principal surfaces, first and second lateral surfaces, and first and second end surfaces. The outer electrode is provided on the first principal surface. The outer electrode includes an underlying electrode layer containing Cu and glass, and a Cu plating layer. The underlying electrode layer is disposed on the first principal surface. The Cu plating layer is disposed on the underlying electrode layer. The Cu plating layer is thicker than the underlying electrode layer.
    Type: Application
    Filed: March 24, 2014
    Publication date: October 2, 2014
    Applicant: MURATA MANUFACTURING CO., LTD.
    Inventors: Yasuhiro NISHISAKA, Satoshi MATSUNO, Akihiro YOSHIDA, Yasunori TASEDA
  • Publication number: 20140292142
    Abstract: A ceramic electronic component includes a ceramic body, a glass coating layer, and terminal electrodes. End portions of inner electrodes are exposed at a surface of the ceramic body. The glass coating layer covers portions of the ceramic body in which the inner electrodes are exposed. The terminal electrodes are disposed directly above the glass coating layer and are each constituted by a plating film. The glass coating layer includes a glass medium and metal powder particles that are dispersed in the glass medium and define conductive paths which electrically connect the inner electrodes and the terminal electrodes. The metal powder particles include first metal powder particles and second metal powder particles. The first metal powder particles are flat or substantially flat powder particles. The second metal powder particles are spherical or substantially spherical powder particles.
    Type: Application
    Filed: February 27, 2014
    Publication date: October 2, 2014
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Yasuhiro NISHISAKA, Satoshi MATSUNO, Tetsuya KISUMI, Yoko OKABE
  • Publication number: 20140292141
    Abstract: A ceramic electronic component includes a ceramic body, inner electrodes, a glass coating layer, and outer electrodes. The glass coating layer extends from an exposed portion of one of the inner electrodes at a first end surface to a first principal surface. The outer electrodes are each constituted by a plating film disposed directly above the glass coating layer. The glass coating layer includes a glass medium and metal powder particles that define conductive paths. The metal powder particles have an elongated or substantially elongated shape and are dispersed in the glass medium. The dimension of a portion of the glass coating layer located on the first principal surface in the length direction, is larger than that of a portion of the glass coating layer located on the first end surface in the thickness direction.
    Type: Application
    Filed: February 27, 2014
    Publication date: October 2, 2014
    Applicant: MURATA MANUFACTURING CO., LTD.
    Inventors: Yasuhiro NISHISAKA, Satoshi MATSUNO, Tetsuya KISUMI, Yoko OKABE
  • Patent number: 8819932
    Abstract: A method of manufacturing a ceramic electronic component prevents variations in characteristics even when the ceramic electronic component is embedded in a wiring board. Ceramic green sheets containing an organic binder having a degree of polymerization in a range from about 1000 to about 1500 are prepared. A first conductive paste layer is formed on a surface of each of the ceramic green sheets. The ceramic green sheets are laminated to form a raw ceramic laminated body. A second conductive paste layer is formed on a surface of the raw ceramic laminated body. The raw ceramic laminated body formed with the second conductive paste layer is fired.
    Type: Grant
    Filed: July 18, 2011
    Date of Patent: September 2, 2014
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Koji Sato, Yukio Sanada, Yasuhiro Nishisaka
  • Patent number: 8804302
    Abstract: A ceramic electronic component includes a ceramic base, first and second internal electrodes, and first and second external electrodes. The first external electrode is disposed at a first end portion of a first major surface in the longitudinal direction. The second external electrode is disposed at a second end portion of the first major surface in the longitudinal direction. A portion of each of the first and second external electrodes is opposed in the thickness direction to a region where the first and second internal electrodes are opposed to each other in the thickness direction. A condition ( 1/10)t0?t1?(?)t0 is satisfied, where t0 is the thickness of each of the first and second external electrodes and t1 is the thickness of a portion in which each of the first and second external electrodes is embedded in the first major surface.
    Type: Grant
    Filed: July 21, 2011
    Date of Patent: August 12, 2014
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Koji Sato, Yukio Sanada, Yasuhiro Nishisaka, Masaki Hirota
  • Patent number: 8754335
    Abstract: A ceramic electronic component includes a ceramic element body having a substantially rectangular parallelepiped shape, and first and second external electrodes. The first and second external electrodes are provided on a first principal surface. Portions of the first and second external electrodes project further than the other portions in a thickness direction. A projecting portion of the first external electrode is provided at one end of the first external electrode in a length direction and a second projecting portion of the second external electrode is provided at another end of the second external electrode in the length direction. Thus, a concave portion is provided between the projecting portions, and a portion of the first principal surface provided between the first and second external electrodes is exposed.
    Type: Grant
    Filed: July 8, 2011
    Date of Patent: June 17, 2014
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Koji Sato, Yukio Sanada, Yasuhiro Nishisaka
  • Patent number: 8721820
    Abstract: A method for manufacturing a multilayer ceramic electronic component significantly reduces and prevents swelling or distortion when a conductive paste is applied to a green ceramic element body. A ceramic green sheet used in the method satisfies 180.56?A/B wherein A is a polymerization degree of an organic binder contained in the ceramic green sheet, and B is a volume content of a plasticizer contained in the ceramic green sheet.
    Type: Grant
    Filed: September 4, 2012
    Date of Patent: May 13, 2014
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Koji Sato, Yukio Sanada, Yasuhiro Nishisaka
  • Publication number: 20140127493
    Abstract: A ceramic electronic component includes a ceramic element assembly and external electrodes. The external electrodes are disposed on the ceramic element assembly. The external electrodes include an underlying electrode layer and a first Cu plating film. The underlying electrode layer is disposed on the ceramic element assembly. The first Cu plating film is disposed on the underlying electrode layer. The underlying electrode layer includes a metal that is diffusible in Cu and a ceramic bonding material. The metal that is diffusible in Cu is diffused in at least a surface layer in the underlying electrode layer side of the first Cu plating film.
    Type: Application
    Filed: January 14, 2014
    Publication date: May 8, 2014
    Applicant: MURATA MANUFACTURING CO., LTD.
    Inventors: Yasuhiro NISHISAKA, Yukio SANADA, Koji SATO, Seiichi MATSUMOTO
  • Publication number: 20140125195
    Abstract: A ceramic electronic component includes a ceramic base body and first and second outer electrodes. The ceramic base body includes first and second primary surfaces, first and second side surfaces, and first and second end surfaces. The first and second outer electrodes are arranged on the ceramic base body so that front end portions of the outer electrodes face each other. The first and the second outer electrodes include outermost layers each containing Cu. Outermost layers of the facing front end portions of the first and the second outer electrodes are more oxidized than outermost layers of the other portions of the first and the second outer electrodes.
    Type: Application
    Filed: October 31, 2013
    Publication date: May 8, 2014
    Applicant: MURATA MANUFACTURING CO., LTD.
    Inventors: Akira ISHIZUKA, Yasuhiro NISHISAKA
  • Publication number: 20140049873
    Abstract: A ceramic electronic component includes a ceramic element assembly and external electrodes. The external electrodes are disposed on the ceramic element assembly. The external electrodes include an underlying electrode layer and a first Cu plating film. The underlying electrode layer is disposed on the ceramic element assembly. The first Cu plating film is disposed on the underlying electrode layer. The underlying electrode layer includes a metal that is diffusible in Cu and a ceramic bonding material. The metal that is diffusible in Cu is diffused in at least a surface layer in the underlying electrode layer side of the first Cu plating film.
    Type: Application
    Filed: November 5, 2013
    Publication date: February 20, 2014
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Yasuhiro NISHISAKA, Yukio SANADA, Koji SATO, Seiichi MATSUMOTO
  • Patent number: 8587925
    Abstract: A ceramic electronic component includes a ceramic element assembly and external electrodes. The external electrodes are disposed on the ceramic element assembly. The external electrodes include an underlying electrode layer and a first Cu plating film. The underlying electrode layer is disposed on the ceramic element assembly. The first Cu plating film is disposed on the underlying electrode layer. The underlying electrode layer includes a metal that is diffusible in Cu and a ceramic bonding material. The metal that is diffusible in Cu is diffused in at least a surface layer in the underlying electrode layer side of the first Cu plating film.
    Type: Grant
    Filed: June 21, 2013
    Date of Patent: November 19, 2013
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Yasuhiro Nishisaka, Yukio Sanada, Koji Sato, Seiichi Matsumoto
  • Publication number: 20130279073
    Abstract: A ceramic electronic component includes a ceramic element assembly and external electrodes. The external electrodes are disposed on the ceramic element assembly. The external electrodes include an underlying electrode layer and a first Cu plating film. The underlying electrode layer is disposed on the ceramic element assembly. The first Cu plating film is disposed on the underlying electrode layer. The underlying electrode layer includes a metal that is diffusible in Cu and a ceramic bonding material. The metal that is diffusible in Cu is diffused in at least a surface layer in the underlying electrode layer side of the first Cu plating film.
    Type: Application
    Filed: June 21, 2013
    Publication date: October 24, 2013
    Inventors: Yasuhiro NISHISAKA, Yukio SANADA, Koji SATO, Seiichi MATSUMOTO
  • Patent number: 8564931
    Abstract: A ceramic electronic component includes a ceramic element assembly and external electrodes. The external electrodes are disposed on the ceramic element assembly. The external electrodes include an underlying electrode layer and a first Cu plating film. The underlying electrode layer is disposed on the ceramic element assembly. The first Cu plating film is disposed on the underlying electrode layer. The underlying electrode layer includes a metal that is diffusible in Cu and a ceramic bonding material. The metal that is diffusible in Cu is diffused in at least a surface layer in the underlying electrode layer side of the first Cu plating film.
    Type: Grant
    Filed: May 25, 2011
    Date of Patent: October 22, 2013
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Yasuhiro Nishisaka, Yukio Sanada, Koji Sato, Seiichi Matsumoto
  • Patent number: 8465830
    Abstract: A ceramic electronic component includes a ceramic body having a substantially rectangular parallelpiped shape. The ceramic body includes a central portion in which first and second internal electrodes are arranged, and first and second end portions in which the first and second internal electrodes are not arranged. The ceramic electronic component satisfies Expressions (1) and (2) below: W1>T??(1) W2>T??(2) where T denotes the dimension of the ceramic body in a thickness direction, W1 denotes the dimension of the first end portion in a width direction, and W2 denotes the dimension of the second end portion in the width direction.
    Type: Grant
    Filed: May 31, 2011
    Date of Patent: June 18, 2013
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Koji Sato, Yukio Sanada, Kosuke Onishi, Yasuhiro Nishisaka
  • Publication number: 20130056133
    Abstract: A method for manufacturing a multilayer ceramic electronic component significantly reduces and prevents swelling or distortion when a conductive paste is applied to a green ceramic element body. A ceramic green sheet used in the method satisfies 180.56?A/B wherein A is a polymerization degree of an organic binder contained in the ceramic green sheet, and B is a volume content of a plasticizer contained in the ceramic green sheet.
    Type: Application
    Filed: September 4, 2012
    Publication date: March 7, 2013
    Applicant: MURATA MANUFACTURING CO., LTD.
    Inventors: Koji SATO, Yukio SANADA, Yasuhiro NISHISAKA
  • Patent number: 8319594
    Abstract: A ceramic electronic component includes a ceramic body, a first external electrode, and a second external electrode. The first and second external electrodes are disposed on a principal surface, which is directed to the mounting surface side, of the ceramic body so as to face each other with a predetermined gap region therebetween. The external electrodes each include a base layer and a Cu plating layer which covers the base layer. In each of the first and second external electrodes, an expression 0.1?t/d?0.5 is satisfied, where t is a thickness of the Cu plating layer at an end of the base layer on a gap region side, and d is a distance from the end of the base layer on the gap region side to an end of the Cu plating layer on the gap region side.
    Type: Grant
    Filed: January 20, 2012
    Date of Patent: November 27, 2012
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Koji Sato, Yukio Sanada, Makoto Ogawa, Yasuhiro Nishisaka
  • Patent number: 8259433
    Abstract: In a ceramic electronic component having a thin structure, the occurrence of cracks due to stress applied when the ceramic component is being mounted or in a mounted state are prevented. Each of first and second external terminal electrodes has a substantially rectangular region on a principal surface of a ceramic element body, the principal surface being directed to the mounting surface side. An end of the first external terminal electrode, which is arranged in contact with a gap region, and an end of the second external terminal electrode, which is positioned in contact with the gap region, each preferably have a concave-convex shape on the principal surface.
    Type: Grant
    Filed: November 13, 2009
    Date of Patent: September 4, 2012
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Yasuhiro Nishisaka, Yukio Sanada, Koji Sato, Kosuke Onishi
  • Publication number: 20120188682
    Abstract: A ceramic electronic component includes a ceramic body, a first external electrode, and a second external electrode. The first and second external electrodes are disposed on a principal surface, which is directed to the mounting surface side, of the ceramic body so as to face each other with a predetermined gap region therebetween. The external electrodes each include a base layer and a Cu plating layer which covers the base layer. In each of the first and second external electrodes, an expression 0.1?t/d?0.5 is satisfied, where t is a thickness of the Cu plating layer at an end of the base layer on a gap region side, and d is a distance from the end of the base layer on the gap region side to an end of the Cu plating layer on the gap region side.
    Type: Application
    Filed: January 20, 2012
    Publication date: July 26, 2012
    Applicant: MURATA MANUFACTURING CO., LTD.
    Inventors: Koji SATO, Yukio SANADA, Makoto OGAWA, Yasuhiro NISHISAKA