Patents by Inventor Yasuhiro Okada

Yasuhiro Okada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20180128686
    Abstract: An annealing object is held at a position on which a laser beam output from a laser light source is incident. An infrared detector detects heat radiation light from the annealing object. An optical element which does not allow light having a wavelength shorter than 1 ?m to be incident on the infrared detector is disposed in a pathway of the heat radiation light from the annealing object to the infrared detector.
    Type: Application
    Filed: November 8, 2016
    Publication date: May 10, 2018
    Inventors: Naoki Wakabayashi, Masafumi Yorozu, Yasuhiro Okada, Takaomi Suzuki, Sadahiko Kimura, Masaki Sakamoto
  • Publication number: 20180076501
    Abstract: A connector device according to the present disclosure includes a first connector section and a second connector section. The first connector section includes a waveguide for transmitting a high-frequency signal. The second connector section includes a waveguide for transmitting a high-frequency signal, a yoke disposed to cover the waveguide, and a magnet forming a magnetic circuit with the yoke, and is couplable to the first connector section by the attractive force of the magnet. A communication system according to the present disclosure includes two communication devices and a connector device. The connector device has the above-described configuration and transmits a high-frequency signal between the two communication devices.
    Type: Application
    Filed: January 19, 2016
    Publication date: March 15, 2018
    Inventors: ISAO MATSUMOTO, TAKAYUKI MOGI, KENICHI KAWASAKI, TETSUYA MAKITA, TATSUHITO AONO, YU SHIGETA, SHINTARO NONAKA, TAKAHIRO TAKEDA, YASUHIRO OKADA, HIROYUKI YAMAGISHI
  • Patent number: 9866272
    Abstract: Provided is a connector system including a first waveguide having a first opening terminal and a second waveguide having a second opening terminal. The first and second waveguides transmit a high-frequency signal when the first opening terminal is in contact with or in the vicinity of the second opening terminal. A dielectric plate is provided on an opening terminal surface of at least one of the first and second opening terminals.
    Type: Grant
    Filed: February 27, 2015
    Date of Patent: January 9, 2018
    Assignee: Sony Semiconductor Solutions Corporation
    Inventor: Yasuhiro Okada
  • Publication number: 20180005355
    Abstract: An image processing device includes a parameter processing circuit and an image correction circuit. The image processing device rearrange a plurality of parameters in order of a plurality of reference image data items written to an image memory. The image correction circuit includes a parameter memory, a pixel calculation circuit, an acquisition circuit, a comparison circuit, and a logic circuit. The image correction circuit reads one of one of the plurality of reference image data items from the image memory storing input image data and perform image correction on the one of the plurality of reference image data items to generate an output image corresponding to one of a plurality of output image areas.
    Type: Application
    Filed: June 15, 2017
    Publication date: January 4, 2018
    Inventor: Yasuhiro OKADA
  • Patent number: 9742743
    Abstract: A management server (110) encrypts storage target data and transmits the encrypted storage target data to mobile terminals (120a, 120b). Thereafter, the management server (110) receives and decrypts the encrypted storage target data stored in the mobile terminals (120a, 120b).
    Type: Grant
    Filed: February 21, 2014
    Date of Patent: August 22, 2017
    Assignee: NS SOLUTIONS CORPORATION
    Inventors: Munehiko Sawafuji, Yasuhiro Okada
  • Patent number: 9728834
    Abstract: A connector apparatus includes a first connector unit provided at an end section of a waveguide cable and a second connector unit that is provided at a terminal section of a transmission wire formed on a print substrate and is detachable from the first connector unit, the second connector unit being structured to perform a signal transmission with the first connector unit by an electromagnetic induction.
    Type: Grant
    Filed: March 27, 2014
    Date of Patent: August 8, 2017
    Assignee: Sony Semiconductor Solutions Corporation
    Inventors: Takahiro Takeda, Yasuhiro Okada
  • Patent number: 9728833
    Abstract: The present invention includes a first connector unit, a second connector unit, and a joining unit. The first connector unit is provided at an end section of a feeder cable formed on a circuit substrate. The second connector unit is provided at an end section of a waveguide cable through which a high-frequency signal is transmitted. The joining unit includes a hollow waveguide interposed between the first connector unit and the second connector unit, the joining unit being capable of detachably joining the first connector unit and the second connector unit.
    Type: Grant
    Filed: March 27, 2014
    Date of Patent: August 8, 2017
    Assignee: Sony Semiconductor Solutions Corporation
    Inventor: Yasuhiro Okada
  • Patent number: 9705202
    Abstract: A millimeter-wave dielectric transmission device. The millimeter-wave dielectric transmission device includes a semiconductor chip provided on one interposer substrate and capable of millimeter-wave dielectric transmission, an antenna structure connected to the semiconductor chip, two semiconductor packages including a molded resin configured to cover the semiconductor chip and the antenna structure, and a dielectric transmission path provided between the two semiconductor packages to transmit a millimeter wave signal. The semiconductor packages are mounted such that the antenna structures thereof are arranged with the dielectric transmission path interposed therebetween.
    Type: Grant
    Filed: January 30, 2015
    Date of Patent: July 11, 2017
    Assignee: SONY CORPORATION
    Inventors: Hirofumi Kawamura, Yasuhiro Okada
  • Patent number: 9698460
    Abstract: Provided is a signal transmission device including a high-frequency signal waveguide that transmits a high-frequency signal emitted from an electronic device. When the electronic device is arranged close to the high-frequency signal waveguide, the high-frequency signal is transmitted via the high-frequency signal waveguide.
    Type: Grant
    Filed: December 18, 2015
    Date of Patent: July 4, 2017
    Assignee: SONY CORPORATION
    Inventors: Takahiro Takeda, Kenji Komori, Sho Ohashi, Yasuhiro Okada
  • Patent number: 9673165
    Abstract: A component mounting apparatus includes a tape attaching unit, a component mounting unit and a component compression unit provided in this order. A time measuring unit measures time having passed after completion of predetermined work performed on all the substrates transferred to the tape attaching unit, the component mounting unit, and the component compression unit, respectively. When preparation for transferring the substrates to the tape attaching unit is not completed within a predetermined time after the start of measurement performed by the time measuring unit, the respective substrates, which wait in the tape attaching unit, the component mounting unit, and the component compression unit, are forcibly transferred to the downstream sides and predetermined work is performed on the respective substrates that are forcibly transferred to the component mounting unit and the component compression unit.
    Type: Grant
    Filed: August 29, 2014
    Date of Patent: June 6, 2017
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Yasuhiro Okada, Chihiro Igarashi, Toshihiko Tsujikawa
  • Patent number: 9647311
    Abstract: A millimeter wave transmission device, the millimeter wave transmission device having (a) a first signal processing board for processing a millimeter wave signal; (b) a second signal processing board signal-coupled to the first signal processing board to receive the millimeter wave signal and perform signal processing with respect to the millimeter wave signal; and (c) a viscoelastic member provided between the first signal processing board and the second signal processing board and having a predetermined relative dielectric constant and a predetermined dielectric dissipation factor. The member constitutes a dielectric transmission path via which the millimeter wave signal is transmitted between the first signal processing board and the signal processing board.
    Type: Grant
    Filed: April 13, 2016
    Date of Patent: May 9, 2017
    Assignee: SONY CORPORATION
    Inventors: Hirofumi Kawamura, Yasuhiro Okada
  • Patent number: 9628143
    Abstract: A waveguide includes: a dielectric including two surfaces, an electric field intersecting with the two surfaces; metal-plating layers coating the two surfaces of the dielectric, the electric field intersecting with the two surfaces; and a protective layer coating a periphery of the dielectric including the two surfaces coated with the metal-plating layers. A wireless transmission system includes: a sender configured to send a high-frequency signal; and a receiver configured to receive the high-frequency signal. The waveguide is used as a waveguide configured to transmit the high-frequency signal between the sender and the receiver in the wireless transmission system.
    Type: Grant
    Filed: March 12, 2014
    Date of Patent: April 18, 2017
    Assignee: Sony Semiconductor Solutions Corporation
    Inventor: Yasuhiro Okada
  • Patent number: 9547190
    Abstract: A component mounting apparatus includes a tape attaching unit, a component mounting unit and a component compression unit provided in this order. A time measuring unit measures time having passed after attachment of the adhesive tape in the tape attaching unit. When a predetermined time has passed after the start of measurement performed by the time measuring unit, the substrate, to which the adhesive tape of a measuring target is attached, is forcibly transferred to the downstream side, and the component is compressed to the substrate in the component compression unit.
    Type: Grant
    Filed: August 28, 2014
    Date of Patent: January 17, 2017
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Yasuhiro Okada, Chihiro Igarashi, Toshihiko Tsujikawa
  • Publication number: 20160226121
    Abstract: A millimeter wave transmission device, the millimeter wave transmission device having (a) a first signal processing board for processing a millimeter wave signal; (b) a second signal processing board signal-coupled to the first signal processing board to receive the millimeter wave signal and perform signal processing with respect to the millimeter wave signal; and (c) a viscoelastic member provided between the first signal processing board and the second signal processing board and having a predetermined relative dielectric constant and a predetermined dielectric dissipation factor. The member constitutes a dielectric transmission path via which the millimeter wave signal is transmitted between the first signal processing board and the signal processing board.
    Type: Application
    Filed: April 13, 2016
    Publication date: August 4, 2016
    Inventors: Hirofumi Kawamura, Yasuhiro Okada
  • Publication number: 20160204495
    Abstract: A connector apparatus of the present disclosure is configured to include: a waveguide cable; a substrate including a waveguide structure; and a coupling section configured to electromagnetically couple an end portion of the waveguide cable to the waveguide structure. Furthermore, a communication system of the present disclosure is a communication system including: a transmitter configured to transmit high-frequency signals; a receiver configured to receive high-frequency signals; a waveguide cable configured to transmit high-frequency signals between the transmitter and the receiver; and a connector apparatus configured to connect between at least one of the transmitter and the receiver to the waveguide cable. A connector apparatus having the above-mentioned configuration is used as the connector apparatus.
    Type: Application
    Filed: August 20, 2014
    Publication date: July 14, 2016
    Applicant: SONY CORPORATION
    Inventors: TAKAHIRO TAKEDA, YASUHIRO OKADA
  • Patent number: 9344197
    Abstract: A millimeter wave transmission device, the millimeter wave transmission device with (a) a first signal processing board for processing a millimeter wave signal; (b) a second signal processing board signal-coupled to the first signal processing board to receive the millimeter wave signal and perform signal processing with respect to the millimeter wave signal; and (c) a member provided between the first signal processing board and the second signal processing board and having a predetermined relative dielectric constant and a predetermined dielectric dissipation factor. The member constitutes a dielectric transmission path via which the millimeter wave signal is transmitted between the first signal processing board and the signal processing board.
    Type: Grant
    Filed: May 26, 2015
    Date of Patent: May 17, 2016
    Assignee: SONY CORPORATION
    Inventors: Hirofumi Kawamura, Yasuhiro Okada
  • Publication number: 20160111766
    Abstract: Provided is a signal transmission device including a high-frequency signal waveguide that transmits a high-frequency signal emitted from an electronic device. When the electronic device is arranged close to the high-frequency signal waveguide, the high-frequency signal is transmitted via the high-frequency signal waveguide.
    Type: Application
    Filed: December 18, 2015
    Publication date: April 21, 2016
    Inventors: Takahiro Takeda, Kenji Komori, Sho Ohashi, Yasuhiro Okada
  • Publication number: 20160073936
    Abstract: The present invention has an objective of evaluating a motor function of a subject with a neurodegenerative disease with high accuracy using a motor function analysis system that utilizes a wrist joint movement of the subject. The motor function analysis system 1 of the present invention comprises: a display unit 3 for displaying image information including a moving target image and a cursor image 11 for tracking the target image; a moving unit 4 used by the subject to move the cursor image 11; and an analyzer 7 for detecting the tracking status of the target image tracked by the cursor image and analyzing the frequency of the movement components contained in the tracking status.
    Type: Application
    Filed: April 30, 2014
    Publication date: March 17, 2016
    Inventors: Shinji Kakei, Jongho Lee, Satoshi Orimo, Akira Inaba, Yasuhiro Okada
  • Publication number: 20160072174
    Abstract: A connector apparatus includes a first connector unit provided at an end section of a waveguide cable and a second connector unit that is provided at a terminal section of a transmission wire formed on a print substrate and is detachable from the first connector unit, the second connector unit being structured to perform a signal transmission with the first connector unit by an electromagnetic induction.
    Type: Application
    Filed: March 27, 2014
    Publication date: March 10, 2016
    Inventors: Takahiro TAKEDA, Yasuhiro OKADA
  • Publication number: 20160056860
    Abstract: A waveguide includes: a dielectric including two surfaces, an electric field intersecting with the two surfaces; metal-plating layers coating the two surfaces of the dielectric, the electric field intersecting with the two surfaces; and a protective layer coating a periphery of the dielectric including the two surfaces coated with the metal-plating layers. A wireless transmission system includes: a sender configured to send a high-frequency signal; and a receiver configured to receive the high-frequency signal. The waveguide is used as a waveguide configured to transmit the high-frequency signal between the sender and the receiver in the wireless transmission system.
    Type: Application
    Filed: March 12, 2014
    Publication date: February 25, 2016
    Inventor: Yasuhiro OKADA