Abstract: The present invention includes a first connector unit, a second connector unit, and a joining unit. The first connector unit is provided at an end section of a feeder cable formed on a circuit substrate. The second connector unit is provided at an end section of a waveguide cable through which a high-frequency signal is transmitted. The joining unit includes a hollow waveguide interposed between the first connector unit and the second connector unit, the joining unit being capable of detachably joining the first connector unit and the second connector unit.

Abstract: A signal transmission device comprises a high-frequency signal waveguide. The high-frequency signal waveguide is configured to transmit a high-frequency signal emitted from an electronic device. When the electronic device is at least proximate to a flat surface of the high-frequency signal waveguide, the high-frequency signal is directly coupled from the electronic device to the high-frequency signal waveguide and transmitted via the high-frequency signal waveguide.

Abstract: A management server (110) encrypts storage target data and transmits the encrypted storage target data to mobile terminals (120a, 120b). Thereafter, the management server (110) receives and decrypts the encrypted storage target data stored in the mobile terminals (120a, 120b).

Abstract: Provided is a connector system including a first waveguide having a first opening terminal and a second waveguide having a second opening terminal. The first and second waveguides transmit a high-frequency signal when the first opening terminal is in contact with or in the vicinity of the second opening terminal. A dielectric plate is provided on an opening terminal surface of at least one of the first and second opening terminals.

Abstract: A millimeter wave transmission device, the millimeter wave transmission device with (a) a first signal processing board for processing a millimeter wave signal; (b) a second signal processing board signal-coupled to the first signal processing board to receive the millimeter wave signal and perform signal processing with respect to the millimeter wave signal; and (c) a member provided between the first signal processing board and the second signal processing board and having a predetermined relative dielectric constant and a predetermined dielectric dissipation factor. The member constitutes a dielectric transmission path via which the millimeter wave signal is transmitted between the first signal processing board and the signal processing board.

Abstract: A method for manufacturing a solar cell element is disclosed. The method includes two different etching processes followed by forming a semiconductor layer. A semiconductor substrate having a first conductor type is etched by using a first acid aqueous solution containing hydrofluoric acid, nitric acid, and sulfuric acid. Then, the semiconductor substrate is etched by using a second acid aqueous solution containing hydrofluoric acid and nitric acid with substantially no sulfuric acid to make an uneven surface. A semiconductor layer of second conductivity type different from the first conductivity type is formed on at least a part of the uneven surface of the semiconductor substrate.

Abstract: A millimeter wave transmission device, the millimeter wave transmission device with (a) a first signal processing board for processing a millimeter wave signal; (b) a second signal processing board signal-coupled to the first signal processing board to receive the millimeter wave signal and perform signal processing with respect to the millimeter wave signal; and (c) a member provided between the first signal processing board and the second signal processing board and having a predetermined relative dielectric constant and a predetermined dielectric dissipation factor. The member constitutes a dielectric transmission path via which the millimeter wave signal is transmitted between the first signal processing board and the signal processing board.

Abstract: A millimeter-wave dielectric transmission device. The millimeter-wave dielectric transmission device includes a semiconductor chip provided on one interposer substrate and capable of millimeter-wave dielectric transmission, an antenna structure connected to the semiconductor chip, two semiconductor packages including a molded resin configured to cover the semiconductor chip and the antenna structure, and a dielectric transmission path provided between the two semiconductor packages to transmit a millimeter wave signal. The semiconductor packages are mounted such that the antenna structures thereof are arranged with the dielectric transmission path interposed therebetween.

Abstract: Signal distribution, signal switching, and signal collection are performed with a simple configuration. An electronic device comprises a transmission unit (108) for transmitting, as a wireless signal, a signal to be transmitted and a reception unit (208) for receiving the wireless signal transmitted from the transmission unit. In the electronic device, a plurality of pairs of wireless signal transmission points in the transmission unit and wireless signal reception points in the reception unit can be formed. Using the pairs of transmission points and reception points make it possible to execute at least either one of signal distribution in which the same signal to be transmitted from a transmission point is transmitted to the multiple reception points and signal switching in which a signal to be transmitted from a transmission point is selectively transmitted to any of the multiple reception points. The signal to be transmitted is transmitted as a wireless signal.

Abstract: A component mounting apparatus includes a tape attaching unit, a component mounting unit and a component compression unit provided in this order. A time measuring unit measures time having passed after completion of predetermined work performed on all the substrates transferred to the tape attaching unit, the component mounting unit, and the component compression unit, respectively. When preparation for transferring the substrates to the tape attaching unit is not completed within a predetermined time after the start of measurement performed by the time measuring unit, the respective substrates, which wait in the tape attaching unit, the component mounting unit, and the component compression unit, are forcibly transferred to the downstream sides and predetermined work is performed on the respective substrates that are forcibly transferred to the component mounting unit and the component compression unit.

Abstract: A component mounting apparatus includes a tape attaching unit, a component mounting unit and a component compression unit provided in this order. A time measuring unit measures time having passed after attachment of the adhesive tape in the tape attaching unit. When a predetermined time has passed after the start of measurement performed by the time measuring unit, the substrate, to which the adhesive tape of a measuring target is attached, is forcibly transferred to the downstream side, and the component is compressed to the substrate in the component compression unit.

Abstract: Provided is an in-millimeter-wave dielectric transmission device. The in-millimeter-wave dielectric transmission device includes a semiconductor chip provided on one interposer substrate and capable of in-millimeter-wave dielectric transmission, an antenna structure connected to the semiconductor chip, two semiconductor packages including a molded resin configured to cover the semiconductor chip and the antenna structure, and a dielectric transmission path provided between the two semiconductor packages to transmit a millimeter wave signal. The semiconductor packages are mounted such that the antenna structures thereof are arranged with the dielectric transmission path interposed therebetween.

Abstract: An electronic device provided with a plurality of circuit boards uses a support member for supporting the circuit boards as the transmission path of a wireless signal. For example, the electronic device is provided with a first printed circuit board for processing a millimeter-wave signal, a second printed circuit board which is signal-coupled to the printed circuit board and receives the millimeter-wave signal to subject the received signal to signal processing, and a waveguide which is disposed with a predetermined dielectric constant between the printed circuit boards, wherein the waveguide constitutes the dielectric transmission path, and the waveguide supports the printed circuit boards. This configuration makes it possible to receive the electromagnetic wave based on a millimeter-wave signal radiated from one end of the waveguide constituting the dielectric transmission path, at the other end thereof.

Abstract: Disclosed herein is a radio communicating device including: a first communicating block; a second communicating block rotatable about an axis of rotation relative to the first communicating block; and a radio signal transmission line capable of information transmission by radio between the first communicating block and the second communicating block; wherein between the first communicating block and the second communicating block, a signal to be transmitted is converted into a radio signal of a circularly polarized wave, and the radio signal of the circularly polarized wave is transmitted via the radio signal transmission line.

Abstract: Provided is an in-millimeter wave dielectric transmission device including a first signal processing board for processing a millimeter wave signal, a second signal processing board signal-coupled to the first signal processing board to receive the millimeter wave signal and perform signal processing with respect to the millimeter wave signal, and a viscoelastic member provided between the first signal processing board and the second signal processing board and having a predetermined relative dielectric constant and a predetermined dielectric dissipation factor. The viscoelastic member constitutes a dielectric transmission path.

Abstract: A millimeter wave transmission device, the millimeter wave transmission device with (a) a first signal processing board for processing a millimeter wave signal; (b) a second signal processing board signal-coupled to the first signal processing board to receive the millimeter wave signal and perform signal processing with respect to the millimeter wave signal; and (c) a member provided between the first signal processing board and the second signal processing board and having a predetermined relative dielectric constant and a predetermined dielectric dissipation factor. The member constitutes a dielectric transmission path via which the millimeter wave signal is transmitted between the first signal processing board and the signal processing board.

Abstract: Disclosed herein is a wireless transmission system, including: a plurality of systems of millimeter wave signal transmission lines capable of individually transmitting information in a millimeter waveband independently of each other; a sending section disposed on one end side of each of the plural systems of millimeter wave signal transmission lines; and a reception section disposed on the other end side of each of the plural systems of millimeter wave signal transmission lines. The sending section is adapted to convert a signal of an object of transmission into a millimeter wave signal and supply the millimeter wave signal to the millimeter signal transmission line. The reception section is adapted to receive the millimeter wave signal transmitted thereto through the millimeter wave signal transmission line and convert the received millimeter wave signal into the signal of the object of transmission.

Abstract: A method for manufacturing a solar cell element is disclosed. The method includes two different etching processes followed by forming a semiconductor layer. A semiconductor substrate having a first conductor type is etched by using a first acid aqueous solution containing hydrofluoric acid, nitric acid, and sulfuric acid. Then, the semiconductor substrate is etched by using a second acid aqueous solution containing hydrofluoric acid and nitric acid with substantially no sulfuric acid to make an uneven surface. A semiconductor layer of second conductivity type different from the first conductivity type is formed on at least a part of the uneven surface of the semiconductor substrate.

Abstract: Signal distribution, signal switching, and signal collection are performed with a simple configuration. An electronic device comprises a transmission unit (108) for transmitting, as a wireless signal, a signal to be transmitted and a reception unit (208) for receiving the wireless signal transmitted from the transmission unit. In the electronic device, a plurality of pairs of wireless signal transmission points in the transmission unit and wireless signal reception points in the reception unit can be formed. Using the pairs of transmission points and reception points make it possible to execute at least either one of signal distribution in which the same signal to be transmitted from a transmission point is transmitted to the multiple reception points and signal switching in which a signal to be transmitted from a transmission point is selectively transmitted to any of the multiple reception points. The signal to be transmitted is transmitted as a wireless signal.

Abstract: Provided is an in-millimeter-wave dielectric transmission device. The in-millimeter-wave dielectric transmission device includes a semiconductor chip provided on one interposer substrate and capable of in-millimeter-wave dielectric transmission, an antenna structure connected to the semiconductor chip, two semiconductor packages including a molded resin configured to cover the semiconductor chip and the antenna structure, and a dielectric transmission path provided between the two semiconductor packages to transmit a millimeter wave signal. The semiconductor packages are mounted such that the antenna structures thereof are arranged with the dielectric transmission path interposed therebetween.