Abstract: A component crimping apparatus control method which enables a measuring tool to directly measure a temperature of a part pressed by a pressing head. The component crimping apparatus control method is applied to a component crimping apparatus which crimps a component onto a plate-shaped workpiece, and causes a measuring tool shaped identically as the workpiece to measure a temperature or a pressure of a pressed part in a pressing process of pressing a component onto the workpiece using a heated pressing head. The method includes acquiring information indicating whether or not the measuring tool is held in the component crimping apparatus, and, in the case where the information indicating that the measuring tool is held is acquired, positioning the measuring tool identically as the workpiece, and executing the pressing process on the component to be attached to the measuring tool after the positioning.

Abstract: Provided is an in-millimeter wave dielectric transmission device including a first signal processing board for processing a millimeter wave signal, a second signal processing board signal-coupled to the first signal processing board to receive the millimeter wave signal and perform signal processing with respect to the millimeter wave signal, and a viscoelastic member provided between the first signal processing board and the second signal processing board and having a predetermined relative dielectric constant and a predetermined dielectric dissipation factor. The viscoelastic member constitutes a dielectric transmission path.

Abstract: An electronic device provided with a plurality of circuit boards uses a support member for supporting the circuit boards as the transmission path of a wireless signal. For example, the electronic device is provided with a first printed circuit board for processing a millimeter-wave signal, a second printed circuit board which is signal-coupled to the printed circuit board and receives the millimeter-wave signal to subject the received signal to signal processing, and a waveguide which is disposed with a predetermined dielectric constant between the printed circuit boards, wherein the waveguide constitutes the dielectric transmission path, and the waveguide supports the printed circuit boards. This configuration makes it possible to receive the electromagnetic wave based on a millimeter-wave signal radiated from one end of the waveguide constituting the dielectric transmission path, at the other end thereof.

Abstract: Disclosed herein is a wireless transmission system, including: a plurality of systems of millimeter wave signal transmission lines capable of individually transmitting information in a millimeter waveband independently of each other; a sending section disposed on one end side of each of the plural systems of millimeter wave signal transmission lines; and a reception section disposed on the other end side of each of the plural systems of millimeter wave signal transmission lines. The sending section is adapted to convert a signal of an object of transmission into a millimeter wave signal and supply the millimeter wave signal to the millimeter signal transmission line. The reception section is adapted to receive the millimeter wave signal transmitted thereto through the millimeter wave signal transmission line and convert the received millimeter wave signal into the signal of the object of transmission.

Abstract: Disclosed herein is a radio communicating device including: a first communicating block; a second communicating block rotatable about an axis of rotation relative to the first communicating block; and a radio signal transmission line capable of information transmission by radio between the first communicating block and the second communicating block; wherein between the first communicating block and the second communicating block, a signal to be transmitted is converted into a radio signal of a circularly polarized wave, and the radio signal of the circularly polarized wave is transmitted via the radio signal transmission line.

Abstract: An adhesive tape applying apparatus includes a stage on which a terminal end portion of a first tape member and a leading end portion of a second tape member are placed so as to be superimposed on each other, an ultrasonic tool in which a plurality of protruding portions are provided on its contact surface that is to be put into contact with the leading end portion or terminal end portion of the superposed tape members, an ultrasonic vibration generator for applying ultrasonic vibrations in a tape's thicknesswise direction to the ultrasonic tool, and a pressing device for making a stage-directed pressing force act on the ultrasonic tool. As a result, the terminal end portion of the in-use first tape member and the leading end portion of the second tape member rolled out from a new reel can be spliced together with a simple, low-cost construction while the possibility of occurrence of trouble in tape feed is eliminated.

Abstract: An adhesive tape applying apparatus includes a stage on which a terminal end portion of a first tape member and a leading end portion of a second tape member are placed so as to be superimposed on each other, an ultrasonic tool in which a plurality of protruding portions are provided on its contact surface that is to be put into contact with the leading end portion or terminal end portion of the superposed tape members, an ultrasonic vibration generator for applying ultrasonic vibrations in a tape's thicknesswise direction to the ultrasonic tool, and a pressing device for making a stage-directed pressing force act on the ultrasonic tool. As a result, the terminal end portion of the in-use first tape member and the leading end portion of the second tape member rolled out from a new reel can be spliced together with a simple, low-cost construction while the possibility of occurrence of trouble in tape feed is eliminated.

Abstract: To provide a component crimping apparatus control method which enables a measuring tool to directly measure a temperature of a part pressed by a pressing head. The component crimping apparatus control method is applied to a component crimping apparatus which crimps a component onto a plate-shaped work, and causes a measuring tool shaped identically as the work to measure a temperature or a pressure of a pressed part in a pressing process of pressing a component onto the work using a heated pressing head. The method includes acquiring information indicating whether or not the measuring tool is held in the component crimping apparatus, and, in the case where the information indicating that the measuring tool is held is acquired, positioning the measuring tool identically as the work, and executing the pressing process on the component to be attached to the measuring tool after the positioning.

Abstract: A semiconductor device includes first and second semiconductor chips formed with electrodes on front and reverse sides, a first bus bar on which the first semiconductor chip is mounted so as the reverse side electrode to be connected thereto, a second bus bar, arranged parallel with the first bus bar, on which the second semiconductor chip is mounted so as the reverse side electrode to be connected thereto, a third bus bar that is press-connected to the front side electrode of the first semiconductor chip, a fourth bus bar that is press-connected to the front side electrode of the second semiconductor chip, and a connecting section that electrically connects the first bus bar and the fourth bus bar.

Abstract: A mobile-terminal-type image processing system provides highly convenient translation function using images photographed by a camera of the mobile terminal. The mobile-terminal-type image processing system includes: a mobile terminal 101 for sending data that includes images photographed by the camera of the mobile terminal 101, keywords inputted through a input key unit 103, types of processing service, or information related to the mobile terminal; and server 109 for translating a plurality of extracted character strings corresponding to one character string included in the received images by a recognizing unit 114 and a in-image character string translating unit 115, or translating generated relevant text corresponding to received keywords and sending to the mobile terminal 101 results of translating.

Abstract: A machine having a vertical main spindle include a bed having a bottom portion and a pair of walls arranged uprightly from both ends of the bottom portion, the sidewalls having horizontal upper mounting surfaces thereon. A first slider is slidably horizontally mounted on the upper mounting surfaces for movement along a first axis. A second slider is slidably horizontally mounted on the first slider and guided by a pair of guide rails arranged on the first slider for movement along a second axis perpendicular to the first axis. A jig apparatus is mounted on the bed for clamping a workpiece at a position lower than the first slider. A spindle head that vertically supports a main spindle is mounted on the second slider so that the main spindle is moved along the third axis perpendicular to the fist and second axes between the guide rails.

Abstract: A horizontal machine tool has a spindle head which supports a horizontal tool spindle. The spindle head is guided on a top surface portion of a base such that the spindle head is movable in two horizontal directions X and Z. A workpiece support for supporting a workpiece on its upper end is guided on the vertical front face portion of the base for movement in a vertical direction Y. When the spindle head is located at a machining position at the center in the X direction, a pair of guide portions of each of a front/back guide mechanism for the spindle head and a vertical guide mechanism for the workpiece support body take symmetrical positions with respect to a vertical plane including the axis of the tool spindle. A first index member and a second index member for supporting the workpiece are provided on the workpiece support body. Therefore, all surfaces of the workpiece excepting an attachment surface can be machined while being directed to a tool on the tool spindle.

Abstract: A system for assisting in management of a packaging plant, according to which such information as on packaging cost, machine characteristics and surface packaging method is transformed into database, whereby the packaging cost calculation, production capacity calculation, line arrangement method, packaging method, and packaging arrangement investigation method are translated into numeral equations or software. With this system, highly accurate investigation results can be output in a short time period, thereby assisting in making an optimum management decision.

Abstract: A motor drive apparatus used in a motor for controlling a rotor therein to rotate in regular and reverse directions includes a rotating direction detecting circuit for detecting a first direction in which rotor is rotating. A comparator compares a command signal with a reference signal to detect a second direction in which the rotor should rotate. A motor driver comprised of buffer amplifiers and power supply circuits is provided to rotate the rotor based on the command signal. A command signal generator produces a drive signal which is transferred to the power supply circuits through a switch when the first and second directions are both identical to the reverse direction.

Abstract: A voltage step-up circuit includes a voltage detecting circuit for generating a discriminating signal when a stepped-up voltage is lower than a previously set value, an oscillating circuit responding to the discriminating signal to oscillate to generate an oscillation signal, a plurality of control circuits receiving the discriminating signal and the oscillation signal in a phase different from one control circuit to another, and a plurality of charge pump circuits independently controlled by the plurality of control circuits, respectively.

Abstract: The silver halide photosensitive material of the invention comprises a support, at least one photosensitive silver halide emulsion layer provided on the support and a protective layer provided on the photosensitive silver halide emulsion layer. The protective layer contains agglomerate particles each of which is formed from plural primary particles having a particle diameter smaller than the thickness of the protective layer. For example, agglomerate particles having a mean particle diameter of 0.2 to 30 .mu.m composed of primary particles having a mean particle diameter of 0.01 to 10 .mu.m are contained in the protective layer having a thickness of 0.1 to 10 .mu.m. By the use of such agglomerate particles as matting agent particles, pin-holes caused by sinking of the matting agent can be inhibited and the Bekk second can be made not longer than 2,000 seconds. Moreover, this matting agent has good affinity for gelatin and is almost free from powder-dropping.

Abstract: A feedome is disposed on the side of an opening of a radiator main body, and comprises a dielectric board having a thickness sufficiently smaller than the wavelength of radio wave, and a dielectric protrusion fixedly mounted to the dielectric board substantially in the center of the inner side thereof, and having a height approximately equal to integral number times (1/2).multidot..lambda. where the wavelength of radio wave is .lambda., and a diameter approximately equal to the height of the dielectric protrusion.

Abstract: An automatic transfer apparatus includes a plurality of transfer units which are disposed to face machining units aligned with spacing. Each transfer unit comprises a support base having a workpiece supporting surface and a workpiece positioning mechanism provided on the workpiece supporting surface, an elevation member supported by the support base for vertical movement, an elevating mechanism for lifting and lowering the elevation member between first and second positions, a transfer member supported on the elevation member for movement in a transfer direction and having a workpiece supporting portion, and a reciprocating mechanism for reciprocating the transfer member.

Abstract: A production system for mounting components on circuit boards includes a solder printing unit having a solder printing device for printing solder onto lands of a circuit board and a solder printing inspecting device for inspecting a printing state the solder, a component mounting unit having a component mounting device for mounting a component to a predetermined position of the printed solder on the circuit board and a component mounting inspecting device for inspecting a mounting state of the component, and a soldering unit having a soldering device for melting and hardening the printed solder and a soldering inspecting device for inspecting a soldering state of the soldering.

Abstract: A speed control system for brushless DC motors which maintains the rotational speed of the motor substantially constant even when the motor load and/or supply voltage fluctuates. Furthermore, by including a negative-resistance temperature coefficient thermistor in the speed control system, the rotational speed of the brushless DC motor may be varied as a function of ambient temperature. Thus, if the brushless DC motor is part of a motor fan and there is an increase in the ambient temperature, the rotational speed of the motor will increase to provide additional cooling. In contrast, if the ambient temperature decreases, the rotational speed of the brushless DC motor will be reduced thereby resulting in quieter operation of the motor.