Patents by Inventor Yasuji Hiramatsu

Yasuji Hiramatsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8614898
    Abstract: A printed wiring board includes an insulating resinous substrate having an aperture unit, a first terminal unit and a second terminal unit consisting of a conductor and formed on top of the resinous substrate, and a fuse unit that electrically couples the first terminal unit and the second terminal unit to each other. At least a part of the fuse unit is disposed over the aperture unit, and in addition, is covered by a porous inorganic covering material having insulating properties.
    Type: Grant
    Filed: June 9, 2011
    Date of Patent: December 24, 2013
    Assignee: Ibiden Co., Ltd.
    Inventors: Yasuji Hiramatsu, Yuki Terada, Tetsuya Muraki
  • Publication number: 20120181560
    Abstract: An LED wiring board includes an insulator layer, a conductor layer (a wiring pattern layer) formed on the insulator layer, and a white reflective film which is formed on the insulator layer and which includes a white colorant and a binder thereof. The conductor layer includes a first wiring pattern and a second wiring pattern, and the white reflective film has a portion which is between the first wiring pattern and the second wiring pattern and which is thinner than both of the first wiring pattern and the second wiring pattern.
    Type: Application
    Filed: January 13, 2012
    Publication date: July 19, 2012
    Applicant: IBIDEN CO., LTD.
    Inventors: Yasuji HIRAMATSU, Yoshiyuki Ido, Wataru Furuichi
  • Publication number: 20110304997
    Abstract: A printed wiring board includes an insulating resinous substrate having an aperture unit, a first terminal unit and a second terminal unit consisting of a conductor and formed on top of the resinous substrate, and a fuse unit that electrically couples the first terminal unit and the second terminal unit to each other. At least a part of the fuse unit is disposed over the aperture unit, and in addition, is covered by a porous inorganic covering material having insulating properties.
    Type: Application
    Filed: June 9, 2011
    Publication date: December 15, 2011
    Applicant: IBIDEN CO., LTD.
    Inventors: Yasuji Hiramatsu, Yuki Terada, Tetsuya Muraki
  • Patent number: 7761984
    Abstract: A multi-layer printed wiring board includes a board covered with a conductor layer, an interlayer insulating resin layer, an etched metal film on the interlayer insulating resin layer, and a via hole. The interlayer insulating resin layer has a fibrous substrate. The via hole has an electrolytic plated film and an electrolessly plated film and connects the conductor layer of the board and the etched metal film.
    Type: Grant
    Filed: March 21, 2008
    Date of Patent: July 27, 2010
    Assignee: IBIDEN Co., Ltd.
    Inventors: Yasuji Hiramatsu, Motoo Asai, Naohiro Hirose, Takashi Kariya
  • Patent number: 7732732
    Abstract: There is provided a laser processing apparatus, a multilayer printed wiring board manufacturing apparatus, and a manufacturing method to form via holes of ultra-fine diameter. The laser beam from the CO2 laser oscillator (60) is converted to the shortened wavelength beam by a tellurium crystal (94) to control diffraction of the laser beam. Simultaneously, when the laser beam is condensed, a limit value of the condensation limit is reduced. Thereby, the spot diameter of laser beam is reduced and a hole for via hole is bored on the interlayer insulation resin on a substrate (10). Therefore, even when the laser beam output is raised to form a deeper hole, the hole diameter is not widened and thereby a hole for a small diameter via hole can be formed.
    Type: Grant
    Filed: June 9, 2004
    Date of Patent: June 8, 2010
    Assignee: Ibiden Co., Ltd.
    Inventor: Yasuji Hiramatsu
  • Patent number: 7721427
    Abstract: Holes (40a) are formed with a laser beam through an insulating substrate (40) on which a metallic layer (42) is formed and via holes (36a) are formed by filling up the holes (40a) with a metal (46). After the via holes (36a) are formed, a conductor circuit (32a) is formed by etching the metallic layer (42) and a single-sided circuit board (30A) is formed by forming projecting conductors (38a) on the surfaces of the via holes (36a). The projecting conductors (38a) on the circuit board (30A) are put on the conductor circuit (32b) of another single-sided circuit board (30B) with adhesive layers (50) composed of an uncured resin in-between and heated and pressed against the circuit (32b). The projecting conductors (38a) get in the uncured resin by pushing aside the resin and are electrically connected to the circuit (32b).
    Type: Grant
    Filed: October 6, 2005
    Date of Patent: May 25, 2010
    Assignee: Ibiden Co., Ltd.
    Inventors: Ryo Enomoto, Yasuji Hiramatsu
  • Patent number: 7712212
    Abstract: A printed circuit board is by formed by laminating an interlaminar insulating layer on a conductor circuit of a substrate, in which the conductor circuit is comprised of an electroless plated film and an electrolytic plated film and a roughened layer is formed on at least a part of the surface of the conductor circuit.
    Type: Grant
    Filed: September 19, 2006
    Date of Patent: May 11, 2010
    Assignee: IBIDEN Co., Ltd.
    Inventors: Motoo Asai, Yasuji Hiramatsu
  • Patent number: 7667160
    Abstract: There is provided a laser processing apparatus, a multilayer printed wiring board manufacturing apparatus, and a manufacturing method to form via holes of ultra-fine diameter. The laser beam from the CO2 laser oscillator (60) is converted to the shortened wavelength beam by a tellurium crystal (94) to control diffraction of the laser beam. Simultaneously, when the laser beam is condensed, a limit value of the condensation limit is reduced. Thereby, the spot diameter of laser beam is reduced and a hole for via hole is bored on the interlayer insulation resin on a substrate (10). Therefore, even when the laser beam output is raised to form a deeper hole, the hole diameter is not widened and thereby a hole for a small diameter via hole can be formed.
    Type: Grant
    Filed: February 17, 2006
    Date of Patent: February 23, 2010
    Assignee: Ibiden Co., Ltd
    Inventor: Yasuji Hiramatsu
  • Patent number: 7615162
    Abstract: A printed circuit board is by formed by laminating an interlaminar insulating layer on a conductor circuit of a substrate, in which the conductor circuit is comprised of an electroless plated film and an electrolytic plated film and a roughened layer is formed on at least a part of the surface of the conductor circuit.
    Type: Grant
    Filed: September 19, 2006
    Date of Patent: November 10, 2009
    Assignee: IBIDEN Co., Ltd.
    Inventors: Motoo Asai, Yasuji Hiramatsu, Yoshinori Wakihara, Kazuhito Yamada
  • Publication number: 20090025216
    Abstract: A multi-layer printed wiring board includes a board covered with a conductor layer, an interlayer insulating resin layer, an etched metal film on the interlayer insulating resin layer, and a via hole. The interlayer insulating resin layer has a fibrous substrate. The via hole has an electrolytic plated film and an electrolessly plated film and connects the conductor layer of the board and the etched metal film.
    Type: Application
    Filed: March 21, 2008
    Publication date: January 29, 2009
    Applicant: IBIDEN CO., LTD.
    Inventors: Yasuji HIRAMATSU, Motoo Asai, Naohiro Hirose, Takashi Kariya
  • Patent number: 7462801
    Abstract: There is provided a laser processing apparatus, a multilayer printed wiring board manufacturing apparatus, and a manufacturing method to form via holes of ultra-fine diameter. The laser beam from the CO2 laser oscillator (60) is converted to the shortened wavelength beam by a tellurium crystal (94) to control diffraction of the laser beam. Simultaneously, when the laser beam is condensed, a limit value of the condensation limit is reduced. Thereby, the spot diameter of laser beam is reduced and a hole for via hole is bored on the interlayer insulation resin on a substrate (10). Therefore, even when the laser beam output is raised to form a deeper hole, the hole diameter is not widened and thereby a hole for a small diameter via hole can be formed.
    Type: Grant
    Filed: November 14, 1997
    Date of Patent: December 9, 2008
    Assignee: Ibiden Co., Ltd.
    Inventor: Yasuji Hiramatsu
  • Patent number: 7462802
    Abstract: There is provided a laser processing apparatus, a multilayer printed wiring board manufacturing apparatus, and a manufacturing method to form via holes of ultra-fine diameter. The laser beam from the CO2 laser oscillator (60) is converted to the shortened wavelength beam by a tellurium crystal (94) to control diffraction of the laser beam. Simultaneously, when the laser beam is condensed, a limit value of the condensation limit is reduced. Thereby, the spot diameter of laser beam is reduced and a hole for via hole is bored on the interlayer insulation resin on a substrate (10). Therefore, even when the laser beam output is raised to form a deeper hole, the hole diameter is not widened and thereby a hole for a small diameter via hole can be formed.
    Type: Grant
    Filed: February 17, 2006
    Date of Patent: December 9, 2008
    Assignee: Ibiden Co., Ltd.
    Inventor: Yasuji Hiramatsu
  • Patent number: 7456372
    Abstract: There is provided a laser processing apparatus, a multilayer printed wiring board manufacturing apparatus, and a manufacturing method to form via holes of ultra-fine diameter. The laser beam from the CO2 laser oscillator (60) is converted to the shortened wavelength beam by a tellurium crystal (94) to control diffraction of the laser beam. Simultaneously, when the laser beam is condensed, a limit value of the condensation limit is reduced. Thereby, the spot diameter of laser beam is reduced and a hole for via hole is bored on the interlayer insulation resin on a substrate (10). Therefore, even when the laser beam output is raised to form a deeper hole, the hole diameter is not widened and thereby a hole for a small diameter via hole can be formed.
    Type: Grant
    Filed: August 23, 2004
    Date of Patent: November 25, 2008
    Assignee: Ibiden Co., Ltd.
    Inventor: Yasuji Hiramatsu
  • Patent number: 7385146
    Abstract: A printed circuit board is by formed by laminating an interlaminar insulating layer on a conductor circuit of a substrate, in which the conductor circuit is comprised of an electroless plated film and an electrolytic plated film and a roughened layer is formed on at least a part of the surface of the conductor circuit.
    Type: Grant
    Filed: September 19, 2006
    Date of Patent: June 10, 2008
    Assignee: IBIDEN Co., Ltd.
    Inventors: Motoo Asai, Yasuji Hiramatsu
  • Patent number: 7375289
    Abstract: A multi-layer printed wiring board includes a board covered with a conductor layer, an interlayer insulating resin layer, an etched metal film on the interlayer insulating resin layer, and a via hole. The interlayer insulating resin layer has a fibrous substrate. The via hole has an electrolytic plated film and an electrolessly plated film and connects the conductor layer of the board and the etched metal film.
    Type: Grant
    Filed: January 13, 2006
    Date of Patent: May 20, 2008
    Assignee: IBIDEN Co., Ltd.
    Inventors: Yasuji Hiramatsu, Motoo Asai, Naohiro Hirose, Takashi Kariya
  • Patent number: 7361849
    Abstract: A printed circuit board is by formed by laminating an interlaminar insulating layer on a conductor circuit of a substrate, in which the conductor circuit is comprised of an electroless plated film and an electrolytic plated film and a roughened layer is formed on at least a part of the surface of the conductor circuit.
    Type: Grant
    Filed: September 19, 2006
    Date of Patent: April 22, 2008
    Assignee: Ibiden Co., Ltd.
    Inventors: Motoo Asai, Yasuji Hiramatsu
  • Publication number: 20070062729
    Abstract: A printed circuit board is by formed by laminating an interlaminar insulating layer on a conductor circuit of a substrate, in which the conductor circuit is comprised of an electroless plated film and an electrolytic plated film and a roughened layer is formed on at least a part of the surface of the conductor circuit.
    Type: Application
    Filed: September 19, 2006
    Publication date: March 22, 2007
    Applicant: IBIDEN CO., LTD.
    Inventors: Motoo Asai, Yasuji Hiramatsu
  • Publication number: 20070062724
    Abstract: A printed circuit board is by formed by laminating an interlaminar insulating layer on a conductor circuit of a substrate, in which the conductor circuit is comprised of an electroless plated film and an electrolytic plated film and a roughened layer is formed on at least a part of the surface of the conductor circuit.
    Type: Application
    Filed: September 19, 2006
    Publication date: March 22, 2007
    Applicant: IBIDEN CO., LTD.
    Inventors: Motoo Asai, Yasuji Hiramatsu
  • Publication number: 20070051695
    Abstract: A printed circuit board is by formed by laminating an interlaminar insulating layer on a conductor circuit of a substrate, in which the conductor circuit is comprised of an electroless plated film and an electrolytic plated film and a roughened layer is formed on at least a part of the surface of the conductor circuit.
    Type: Application
    Filed: September 19, 2006
    Publication date: March 8, 2007
    Applicant: IBIDEN CO., LTD.
    Inventors: Motoo Asai, Yasuji Hiramatsu
  • Patent number: RE43509
    Abstract: A printed circuit board is by formed by laminating an interlaminar insulating layer on a conductor circuit of a substrate, in which the conductor circuit is comprised of an electroless plated film and an electrolytic plated film and a roughened layer is formed on at least a part of the surface of the conductor circuit.
    Type: Grant
    Filed: December 18, 1997
    Date of Patent: July 17, 2012
    Assignee: Ibiden Co., Ltd.
    Inventors: Motoo Asai, Yasuji Hiramatsu, Yoshinori Wakihara, Kazuhito Yamada