Abstract: Double refresh executing means is changed in accordance with a manner (distributed refresh or burst refresh) of a refresh command so as to suppress a drop of internal power supply that occurs upon double refresh.

Abstract: There are provided are a plurality of memory mats, a sub-word driver that accesses a normal memory cell irrespective of whether a row address to which access is requested is a defective address, a sub-word driver that accesses a redundant memory cell belonging to a memory mat different from the normal memory cell indicated by the row address, when the row address is a defective address. According to the present invention, the normal memory cell and a redundant memory cell belong to memory mats different to each other, and thus the normal memory cell can be accessed concurrently with determining operation of the repair determining circuit.

Abstract: Double refresh executing means is changed in accordance with a manner (distributed refresh or burst refresh) of a refresh command so as to suppress a drop of internal power supply that occurs upon double refresh.

Abstract: A semiconductor memory device is comprised of a refresh counter for sequentially generating a count value indicating one or more row addresses corresponding to one or more word lines to be refreshed when receiving a refresh request at a predetermined interval in normal operation, in which the refresh counter includes n+1 stage counters assigned to n bits included in the row address and a dummy bit not included in the row address, and a counter portion from the least significant bit to the dummy bit forms an N-ary counter, so as to control whether or not refresh is performed in response to a value of the dummy bit when receiving the refresh request.

Abstract: In a semiconductor memory device provided with a redundancy circuit for conducting a repair of defective memory cells, the memory cell defects which are unevenly distributed can be efficiently repaired. The semiconductor memory device has a plurality of memory blocks, and the memory block includes a plurality of segments. A redundancy memory block which substitutes for defective data of a segment is physically provided to each of the plurality of memory blocks. A block address of the redundancy memory block is logically allocated to the plurality of memory blocks in common.

Abstract: In a semiconductor memory device provided with a redundancy circuit for conducting a repair of defective memory cells, the memory cell defects which are unevenly distributed can be efficiently repaired. The semiconductor memory device has a plurality of memory blocks, and the memory block includes a plurality of segments. A redundancy memory block which substitutes for defective data of a segment is physically provided to each of the plurality of memory blocks. A block address of the redundancy memory block is logically allocated to the plurality of memory blocks in common.

Abstract: A semiconductor memory device includes first and second bus regions, a third bus region laid out along a center line, a first cell region laid out between a first side and the first bus region, a second cell region laid out between a second side and the second bus region, third and fourth cell regions laid out between the first and second bus regions and laid out toward a third side and a fourth side respectively seen from the third bus region, and a data input/output pad string laid out along the third bus region.

Abstract: Disclosed is a circuit for deciding whether or not a plural number of redundancy ROM circuits have been programmed in a preset order, with regards to addresses. In at least one of first to n-th redundancy memory circuits, an address to be substituted by a redundant address is recorded and a redundancy selection signal is output when an access address is coincident with the programmed address. It is presupposed that repair addresses are programmed from the first to the n-th redundancy ROM circuits in an ascending order with regards to address. If it is detected under this condition that a redundancy selection signal has been output from the i+1'st redundancy memory circuit while no redundancy selection signal is being output from the i-th redundancy memory circuit, an SR flip-flop is set and the sequence of the substitution decision outputs is decided to be a reversed sequence.

Abstract: A semiconductor memory device includes a first refresh cycle changing circuit that changes a refresh cycle according to an auto-refresh mode, without giving influence to a refresh cycle according to a self-refresh mode, and a second refresh cycle changing circuit that changes a refresh cycle according to the self-refresh mode, without giving influence to a refresh cycle according to the auto-refresh mode. In this way, according to the present invention, the refresh cycle according to the auto-refresh mode and the refresh cycle according to the self-refresh mode can be controlled independently. Therefore, refresh operation considering the characteristic of each mode can be executed.

Abstract: A semiconductor device is configured to prevent misprogramming of fuse circuits therein. The semiconductor device includes the following elements. A group of fuse element circuits 911 is configured to store a first data defining the circuit configuration. A fuse element circuit 913 is configured to store a second data representing inhibition of programming the group of fuse element circuits. A control logic circuit 140 is configured to program the first and the second data on the fuse element circuits. An AND gate circuit 914 is configured to inhibit the control logic circuit 140 from programming the group of fuse element circuits 911 on condition that the fuse element circuit 913 has been programmed.

Abstract: In a semiconductor device, an internally-generated power supply voltage VPP is monitored. If the internally-generated power supply voltage VPP is lower than a lower limit voltage, serial refresh is selected as a double refresh operation mode. In the serial refresh, double refresh for a pair address is inserted in a next refresh cycle. By the serial refresh, decrease of the internally-generated power supply voltage VPP is suppressed.

Abstract: A semiconductor memory device is comprised of a refresh counter for sequentially generating a count value indicating one or more row addresses corresponding to one or more word lines to be refreshed when receiving a refresh request at a predetermined interval in normal operation, in which the refresh counter includes n+1 stage counters assigned to n bits included in the row address and a dummy bit not included in the row address, and a counter portion from the least significant bit to the dummy bit forms an N-ary counter, so as to control whether or not refresh is performed in response to a value of the dummy bit when receiving the refresh request.

Abstract: A semiconductor memory device includes a refresh counter that outputs an address of a word line to be refreshed, a ROM circuit that stores a relevant address related to a refresh defective address, and a multiple refresh control circuit that simultaneously or continuously activates the refresh defective address and the relevant address within one refresh cycle in response to a fact that the ROM circuit detects the relevant address. The multiple refresh control circuit excludes a pattern having a risk that a power supply potential or a ground potential varies greatly such as a pattern that the multiple refresh occurs continuously. With this arrangement, a refresh defective cell can be saved while restricting the variation in the power supply potential or the ground potential.

Abstract: At first, failed cells are repaired using row redundancy or column redundancy as done in the past and then, for the remaining failed cells that cannot be repaired by row or column redundancy, by increasing the number of refreshes greater than that of normal cells, it is possible to repair more failed cells.

Abstract: In a semiconductor device, an internally-generated power supply voltage VPP is monitored. If the internally-generated power supply voltage VPP is lower than a lower limit voltage, serial refresh is selected as a double refresh operation mode. In the serial refresh, double refresh for a pair address is inserted in a next refresh cycle. By the serial refresh, decrease of the internally-generated power supply voltage VPP is suppressed.

Abstract: Double refresh executing means is changed in accordance with a manner (distributed refresh or burst refresh) of a refresh command so as to suppress a drop of internal power supply that occurs upon double refresh.

Abstract: In a semiconductor memory device provided with a redundancy circuit for conducting a repair of defective memory cells, the memory cell defects which are unevenly distributed can be efficiently repaired. The semiconductor memory device has a plurality of memory blocks, and the memory block includes a plurality of segments. A redundancy memory block which substitutes for defective data of a segment is physically provided to each of the plurality of memory blocks. A block address of the redundancy memory block is logically allocated to the plurality of memory blocks in common.

Abstract: A semiconductor memory device includes a refresh counter that outputs an address of a word line to be refreshed, a ROM circuit that stores a relevant address related to a refresh defective address, and a multiple refresh control circuit that simultaneously or continuously activates the refresh defective address and the relevant address within one refresh cycle in response to a fact that the ROM circuit detects the relevant address. The multiple refresh control circuit excludes a pattern having a risk that a power supply potential or a ground potential varies greatly such as a pattern that the multiple refresh occurs continuously. With this arrangement, a refresh defective cell can be saved while restricting the variation in the power supply potential or the ground potential.

Abstract: A semiconductor storage device in which the chip area is prevented from increasing to reduce the leakage current during low power (power down) time caused by shorting across bit and word lines due to crossing failure. There are provided precharge equalizing NMOS transistors the gates of which are supplied with a control signal (BLEQT). These precharge equalizing NMOS transistors are connected across a power supply line (VNLR), supplying a precharge potential to the bit line, and the bit line. At the time of low power operation, a potential (0.7 to 1.4V) lower than the potential VPP (e.g. 3.2V) applied during the precharge operation of the normal operation is supplied to the gate terminals of the transistors to reduce the leakage current caused by shorting across the bit and word lines caused in turn by crossing failure.

Abstract: A semiconductor memory device includes a pair of memory sub arrays and a control signal generating circuit. The pair of memory sub arrays shares a sense amplifier, and each of the pair of memory sub arrays has a plurality of memory cells arranged in a matrix. Each of columns of the matrix is connected to a pair of bit lines, and each of rows of the matrix is connected to a word line. The control signal generating circuit sequentially outputs first and second refresh start signals within an operation time to an external refresh command in response to an internal refresh command. A first refreshing operation is carried out to first memory cells connected to a first word line of one of the memory sub arrays in response to the first refresh start signal, and a second refreshing operation is carried out to second memory cells connected to a second word line different from the first word line in the memory sub array in response to the second refresh start signal.