Patents by Inventor Yasushi Takahashi

Yasushi Takahashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Keyword creation method and its apparatus
    Patent number: 7412648
    Abstract: A keyword creation method and its apparatus to simply create keywords in user's retrieving a desired item of information from a vast amount of information. The habitual situation characteristics and the degree of typical liking tendency of a user are calculated on the basis of answers on daily items of the user, typical situation dependent keyword(s) of the user in one or more individual typical situations previously prepared is(are) created in accordance with the degree of typical liking tendency of the user and typical situation dependent keyword(s) is(are) revised in accordance with the habitual situation characteristics of the user, so that keyword(s) according to the actual situation of the user can be created.
    Type: Grant
    Filed: July 15, 2002
    Date of Patent: August 12, 2008
    Assignee: Sony Corporation
    Inventors: Kimiyoshi Yoshida, Yasushi Takahashi, Yoshihito Fujiwara
  • SEMICONDUCTOR DEVICE
    Publication number: 20080169537
    Abstract: A semiconductor device, wherein a first metallic member is bonded to a first electrode of a semiconductor element via a first metallic body containing a first precious metal, and a second metallic member is bonded to a second electrode via a second metallic body containing a second precious metal.
    Type: Application
    Filed: March 12, 2008
    Publication date: July 17, 2008
    Inventors: Ryoichi KAJIWARA, Masahiro Koizumi, Toshiaki Morita, Kazuya Takahashi, Munehisa Kishimoto, Shigeru Ishii, Toshinori Hirashima, Yasushi Takahashi, Toshiyuki Hata, Hiroshi Sato, Keiichi Ookawa
  • MOSFET package
    Patent number: 7400002
    Abstract: A semiconductor device, wherein a first metallic member is bonded to a first electrode of a semiconductor element via a first metallic body containing a first precious metal, and a second metallic member is bonded to a second electrode via a second metallic body containing a second precious metal.
    Type: Grant
    Filed: October 31, 2006
    Date of Patent: July 15, 2008
    Assignees: Renesas Technology Corp., Hitachi Tohbu Semiconductor, Ltd.
    Inventors: Ryoichi Kajiwara, Masahiro Koizumi, Toshiaki Morita, Kazuya Takahashi, Munehisa Kishimoto, Shigeru Ishii, Toshinori Hirashima, Yasushi Takahashi, Toshiyuki Hata, Hiroshi Sato, Keiichi Ookawa
  • MOSFET package
    Patent number: 7394146
    Abstract: A semiconductor device, wherein a first metallic member is bonded to a first electrode of a semiconductor element via a first metallic body containing a first precious metal, and a second metallic member is bonded to a second electrode via a second metallic body containing a second precious metal.
    Type: Grant
    Filed: October 31, 2006
    Date of Patent: July 1, 2008
    Assignees: Renesas Tehcnology Corp., Hitachi Tohbu Semiconductor, Ltd.
    Inventors: Ryoichi Kajiwara, Masahiro Koizumi, Toshiaki Morita, Kazuya Takahashi, Munehisa Kishimoto, Shigeru Ishii, Toshinori Hirashima, Yasushi Takahashi, Toshiyuki Hata, Hiroshi Sato, Keiichi Ookawa
  • Semiconductor device and a method of manufacturing the same
    Patent number: 7385279
    Abstract: A semiconductor device and method having high output and having reduced external resistance is reduced and improved radiating performance. A MOSFET (70) has a connecting portion for electrically connecting a surface electrode of a semiconductor pellet and a plurality of inner leads, a resin encapsulant (29), a plurality of outer leads (37), (38) protruding in parallel from the same lateral surface of the resin encapsulant (29) and a header (28) bonded to a back surface of the semiconductor pellet and having a header protruding portion (28c) protruding from a lateral surface of the resin encapsulant (29) opposite to the lateral surface from which the outer leads protrude, wherein the header (28) has an exposed surface (28b) exposed from the resin encapsulant (29); the outer leads (37), (38) are bent; and the exposed of the outer leads (37), (38) are provided at substantially the same height.
    Type: Grant
    Filed: December 21, 2006
    Date of Patent: June 10, 2008
    Assignee: Renesas Technology Corp.
    Inventors: Toshinori Hirashima, Munehisa Kishimoto, Toshiyuki Hata, Yasushi Takahashi
  • Disposition structure of heat exchanger in motorcycle
    Patent number: 7377350
    Abstract: A disposition structure of a heat exchanger (oil cooler) in a motorcycle mounted in the central part in front of the upper part of the crankcase of an internal combustion engine E mounted on the motorcycle. When viewed from the front of the motorcycle, the oil cooler is located between the front forks. The oil cooler is disposed so that the fin surface of the cooling fins of the heat exchanger are perpendicular or substantially perpendicular to an air flow that goes between the front forks and above the front wheel. In the disposition structure so configured, cooling efficiency of the heat exchanger is improved.
    Type: Grant
    Filed: December 22, 2004
    Date of Patent: May 27, 2008
    Assignee: Honda Motor Co., Ltd.
    Inventors: Yoshitsugu Gokan, Yasushi Takahashi
  • Method of Manufacturing a Ignition Device and a Semiconductor Device
    Publication number: 20080116671
    Abstract: A semiconductor device has the package structure which used the lead frame, a communication device (semiconductor chip) is arranged to the main surface side of a supporting body, and the condenser for firing is arranged to the back side of the opposite side to the main surface of said supporting body. By having such structure, a miniaturization, the reduction of a manufacturing cost, and high reliability of a semiconductor device and an ignition device can be aimed at.
    Type: Application
    Filed: December 6, 2004
    Publication date: May 22, 2008
    Inventor: Yasushi Takahashi
  • Keyword creation method and its apparatus
    Patent number: 7373589
    Abstract: A keyword creation method and its apparatus to simply create keywords in user's retrieving a desired item of information from a vast amount of information. The habitual situation characteristics and the degree of typical liking tendency of a user are calculated on the basis of answers on daily items of the user, typical situation dependent keyword(s) of the user in one or more individual typical situations previously prepared is (are) created in accordance with the degree of typical liking tendency of the user and typical situation dependent keyword(s) is (are) revised in accordance with the habitual situation characteristics of the user, so that keyword(s) according to the actual situation of the user can be created.
    Type: Grant
    Filed: March 17, 2005
    Date of Patent: May 13, 2008
    Assignee: Sony Corporation
    Inventors: Kimiyoshi Yoshida, Yasushi Takahashi, Yoshihito Fujiwara
  • Information retrieval method and apparatus
    Patent number: 7343616
    Abstract: Based on a user's own basic selection tastes, the priority order of the information is determined, so that an information retrieval method and the apparatus which can retrieve the information desired by the user easily among from a huge amount of programs can be realized.
    Type: Grant
    Filed: May 14, 1998
    Date of Patent: March 11, 2008
    Assignee: Sony Corporation
    Inventors: Yasushi Takahashi, Yoshihito Fujiwara, Kimiyoshi Yoshida
  • MOSFET package
    Patent number: 7342267
    Abstract: A semiconductor device, wherein a first metallic member is bonded to a first electrode of a semiconductor element via a first metallic body containing a first precious metal, and a second metallic member is bonded to a second electrode via a second metallic body containing a second precious metal.
    Type: Grant
    Filed: May 2, 2006
    Date of Patent: March 11, 2008
    Assignees: Renesas Technology Corp., Hitachi Tohbu Semiconductor, Ltd.
    Inventors: Ryoichi Kajiwara, Masahiro Koizumi, Toshiaki Morita, Kazuya Takahashi, Munehisa Kishimoto, Shigeru Ishii, Toshinori Hirashima, Yasushi Takahashi, Toshiyuki Hata, Hiroshi Sato, Keiichi Ookawa
  • MOSFET package
    Patent number: 7332757
    Abstract: A semiconductor device, wherein a first metallic member is bonded to a first electrode of a semiconductor element via a first metallic body containing a first precious metal, and a second metallic member is bonded to a second electrode via a second metallic body containing a second precious metal.
    Type: Grant
    Filed: May 2, 2006
    Date of Patent: February 19, 2008
    Assignees: Renesas Technology Corp., Hitachi Tohbu Semiconductor, Ltd.
    Inventors: Ryoichi Kajiwara, Masahiro Koizumi, Toshiaki Morita, Kazuya Takahashi, Munehisa Kishimoto, Shigeru Ishii, Toshinori Hirashima, Yasushi Takahashi, Toshiyuki Hata, Hiroshi Sato, Keiichi Ookawa
  • Semiconductor device and a method of manufacturing the same
    Publication number: 20070158819
    Abstract: A semiconductor device and method having high output and having reduced external resistance is reduced and improved radiating performance. A MOSFET (70) has a connecting portion for electrically connecting a surface electrode of a semiconductor pellet and a plurality of inner leads, a resin encapsulant (29), a plurality of outer leads (37), (38) protruding in parallel from the same lateral surface of the resin encapsulant (29) and a header (28) bonded to a back surface of the semiconductor pellet and having a header protruding portion (28c) protruding from a lateral surface of the resin encapsulant (29) opposite to the lateral surface from which the outer leads protrude, wherein the header (28) has an exposed surface (28b) exposed from the resin encapsulant (29); the outer leads (37), (38) are bent; and the exposed of the outer leads (37), (38) are provided at substantially the same height.
    Type: Application
    Filed: December 21, 2006
    Publication date: July 12, 2007
    Inventors: Toshinori Hirashima, Munehisa Kishimoto, Toshiyuki Hata, Yasushi Takahashi
  • Semiconductor devices and manufacturing method thereof
    Publication number: 20070126086
    Abstract: A semiconductor device is provided with a semiconductor substrate having circuit elements formed therein, and an insulating protective film formed on the semiconductor substrate. Hydroxyl groups (OH) are attached to a surface of the protective film. As a result, the contact angle between surface of the protective film and a water droplet is less than or equal to 40 degrees.
    Type: Application
    Filed: December 1, 2006
    Publication date: June 7, 2007
    Inventors: Tetsuya Kanata, Shinichi Umekawa, Koji Terada, Yasushi Takahashi
  • Semiconductor device and a memory system including a plurality of IC chips in a common package
    Patent number: 7227251
    Abstract: A semiconductor device is formed by laminating two semiconductor chips with the rear surfaces thereof provided face to face. Each semiconductor chip is provided with an outer lead for clock enable to which the clock enable signal and chip select signal are individually input. On the occasion of making access to one semiconductor chip, the other semiconductor chip is set to the low power consumption mode by setting the clock enable signal and chip select signal to the non-active condition.
    Type: Grant
    Filed: April 26, 2005
    Date of Patent: June 5, 2007
    Assignee: Elpida Memory, Inc.
    Inventors: Kazuki Sakuma, Masayasu Kawamura, Yasushi Takahashi, Masachika Masuda, Tamaki Wada, Michiaki Sugiyama, Hirotaka Nishizawa, Toshio Sugano
  • Video information editing method and editing device
    Publication number: 20070067724
    Abstract: A regular edition video of a video title is split into shots or scenes with time codes, and provided information, which is the semantic evaluation of the story, is added to the respective scenes to organize the scene score. Necessary scenes for each purpose are extracted on the basis of the scene score and a threshold value (process Pr14). Video characteristic evaluation information is added for each shot constituting each of the extracted scenes so as to organize the shot score (process Pr16). Optimum shots for each of the extracted scenes are selected on the basis of a predetermined rule suitable for the purpose (process Pr16). The optimum shots are sequentially cut out from the regular edition video (process Pr21), thus automatically organizing a preview video suitable for the purpose (process Pr22).
    Type: Application
    Filed: November 21, 2006
    Publication date: March 22, 2007
    Inventors: Yasushi Takahashi, Kazuo Sugiyama, Makoto Watanabe
  • Screen control method
    Patent number: 7185283
    Abstract: A feature video image vdt and a thumbnail picture sdt read from a receiving section C10 are recorded onto a mass storage medium M1, and meta information mdt is recorded into a high-speed storage unit C12. Semantic browser means C1 extracts a partial video image from the feature video image on the basis of the meta information mdt so as to organize a preview video image, and also displays a semantic graph and a current position on the screen on the basis of the meta information and replays the feature video image or the preview video image from that position when there is a position designation input. Furthermore, when there is a browsing instruction input, the semantic browser means C1 carries out browsing between the feature video image and the preview video image, or browsing within the feature video image or within the preview video image. An accounting section C18 carries out accounting processing.
    Type: Grant
    Filed: February 24, 2000
    Date of Patent: February 27, 2007
    Assignee: Sony Corporation
    Inventor: Yasushi Takahashi
  • Semiconductor device
    Publication number: 20070040250
    Abstract: A semiconductor device, wherein a first metallic member is bonded to a first electrode of a semiconductor element via a first metallic body containing a first precious metal, and a second metallic member is bonded to a second electrode via a second metallic body containing a second precious metal.
    Type: Application
    Filed: October 31, 2006
    Publication date: February 22, 2007
    Inventors: Ryoichi Kajiwara, Masahiro Koizumi, Toshiaki Morita, Kazuya Takahashi, Munehisa Kishimoto, Shigeru Ishii, Toshinori Hirashima, Yasushi Takahashi, Toshiyuki Hata, Hiroshi Sato, Keiichi Ookawa
  • Semiconductor device
    Publication number: 20070040248
    Abstract: A semiconductor device, wherein a first metallic member is bonded to a first electrode of a semiconductor element via a first metallic body containing a first precious metal, and a second metallic member is bonded to a second electrode via a second metallic body containing a second precious metal.
    Type: Application
    Filed: October 31, 2006
    Publication date: February 22, 2007
    Inventors: Ryoichi Kajiwara, Masahiro Koizumi, Toshiaki Morita, Kazuya Takahashi, Munehisa Kishimoto, Shigeru Ishii, Toshinori Hirashima, Yasushi Takahashi, Toshiyuki Hata, Hiroshi Sato, Keiichi Ookawa
  • Semiconductor device
    Publication number: 20070040249
    Abstract: A semiconductor device, wherein a first metallic member is bonded to a first electrode of a semiconductor element via a first metallic body containing a first precious metal, and a second metallic member is bonded to a second electrode via a second metallic body containing a second precious metal.
    Type: Application
    Filed: October 31, 2006
    Publication date: February 22, 2007
    Inventors: Ryoichi Kajiwara, Masahiro Koizumi, Toshiaki Morita, Kazuya Takahashi, Munehisa Kishimoto, Shigeru Ishii, Toshinori Hirashima, Yasushi Takahashi, Toshiyuki Hata, Hiroshi Sato, Keiichi Ookawa
  • Semiconductor device
    Publication number: 20070029540
    Abstract: A semiconductor device, wherein a first metallic member is bonded to a first electrode of a semiconductor element via a first metallic body containing a first precious metal, and a second metallic member is bonded to a second electrode via a second metallic body containing a second precious metal.
    Type: Application
    Filed: October 5, 2006
    Publication date: February 8, 2007
    Inventors: Ryoichi Kajiwara, Masahiro Koizumi, Toshiaki Morita, Kazuya Takahashi, Munehisa Kishimoto, Shigeru Ishii, Toshinori Hirashima, Yasushi Takahashi, Toshiyuki Hata, Hiroshi Sato, Keiichi Ookawa