Abstract: A performing device of an impulse-like gesture recognition system executes an impulse-like gesture recognition method. A performing procedure of the impulse-like gesture recognition method includes steps of: receiving a sensing signal from a sensing unit; determining a prediction with at least one impulse-like label according to the sensing frames by a deep learning-based model; and classifying at least one gesture event according to the prediction. The gesture event is classified to determine the motion of the user. Since the at least one impulse-like label is used to label at least one detection score of the deep learning-based model, the detection score is non-decreasing, reaction time of the at least one gesture event for an incoming gesture is fast, rapid consecutive gestures are easily decomposed, and an expensive post-processing is not needed.

Abstract: A backlight module is applied to providing light to a plurality of keyswitches of a keyboard. Each keyswitch has a keycap and an elastic member abutting against the keycap. The backlight module includes a membrane circuit board and a light guide plate. The membrane circuit board has a light emitting diode corresponding to the keyswitch. The light emitting diode is located at a side of the elastic member and emits light to the keycap. The light guide plate is disposed on the membrane circuit board. The light guide plate has a slot hole for containing the light emitting diode and has a hole corresponding to the elastic member. An optical microstructure is formed on the light guide plate for guiding light of the light emitting diode to be incident to the keycap. The elastic member passes through the hole to be disposed on the membrane circuit board.

Abstract: A fiber optic adapter includes an outer housing, a receiving seat, and a blocking mechanism. The outer housing defines two connection slots. The receiving seat is connected detachably to the outer housing, and defines two through grooves respectively in spatial communication with the connection slots. The blocking mechanism includes a pivot shaft, a torsion spring sleeved on the pivot shaft, and two cover plates connected pivotally to the pivot shaft and respectively connected to two opposite ends of the torsion spring. When each cover plate is in a blocking position, the cover plate blocks a respective connection slot, and is inclined relative to a central axis of the respective connection slot with a free end thereof being more towards the rear than the pivot shaft, and with an angle that is defines between the cover plate and the central axis being not a right angle.

Abstract: A method includes forming a reconstructed wafer, which includes placing a plurality of package components over a carrier, forming an interconnect structure over and electrically interconnecting the plurality of package components, forming top electrical connectors over and electrically connecting to the interconnect structure, and forming alignment marks at a same level as the top electrical connectors. Probe pads in the top electrical connectors are probed, and the probing is performed using the alignment marks for aligning to the probe pads. An additional package component is bonded to the reconstructed wafer through solder regions. The solder regions are physically joined to the top electrical connectors.

Abstract: A system and method for forming pixels in an image sensor is provided. In an embodiment, a semiconductor device includes an image sensor including a first pixel region and a second pixel region in a substrate, the first pixel region being adjacent to the second pixel region. A first anti-reflection coating is over the first pixel region, the first anti-reflection coating reducing reflection for a first wavelength range of incident light. A second anti-reflection coating is over the second pixel region, the second anti-reflection coating reducing reflection for a second wavelength range of incident light that is different from the first wavelength range.

Abstract: An apparatus for detecting unsupported utterances in natural language understanding, includes a memory storing instructions, and at least one processor configured to execute the instructions to classify a feature that is extracted from an input utterance of a user, as one of in-domain and out-of-domain (OOD) for a response to the input utterance, obtain an OOD score of the extracted feature, and identify whether the feature is classified as OOD. The at least one processor is further configured to executed the instructions to, based on the feature being identified to be classified as in-domain, identify whether the obtained OOD score is greater than a predefined threshold, and based on the OOD score being identified to be greater than the predefined threshold, re-classify the feature as OOD.

Abstract: A power adapter assembly structure is disclosed and includes a circuit board, a socket and at least one elastic element. The socket is disposed adjacent to the circuit board. The circuit board and the socket are configured to collaboratively form at least one abutting surface and at least one fixing surface. The elastic element is connected between the circuit board and the socket, and includes a main body, a fixed portion and a hanging arm. The fixed portion and the hanging arm are disposed at two opposite ends of the main body, the fixed portion spatially corresponds to the fixing surface, and the hanging arm constantly abuts the abutting surface. A height is formed between the main body of the at least one elastic element and the at least one abutting surface, and less than a length of the hanging arm extended from the main body.

Abstract: There is provided a smoke detector including a light source, a reflective surface, a light sensor and a processor. The light sensor receives reflected light when the light source emits light toward the reflective surface, and generates a reference detection signal when there is no smoke. The processor receives the detection signal from the light sensor, and automatically selects a set of predetermined condition thresholds according to a profile of the detection signal to be compared with the detection signal thereby determining whether to generate an alarm according to the comparison result.

Abstract: A method of manufacturing a heart valve prosthesis includes cutting a flat sheet of a valve material into a single-piece valve pattern having two or more valve leaflet regions and a valve skirt region. The method also includes arranging the two or more valve leaflet regions of the single-piece valve pattern into a mold for forming a leaflet belly for each of the two or more valve leaflet regions. Further, the method includes fixing, while arranged in the mold, a shape of the leaflet belly of each of two or more valve leaflet regions of the single piece-valve pattern. The method additionally includes creating a side seam by attaching two longitudinal edges of the single-piece valve pattern, to thereby form a tubular valve subassembly with two or more valve leaflets. The method includes attaching the tubular valve subassembly within a tubular frame to form a heart valve prosthesis.

Abstract: A method for forming a semiconductor device is provided. In some embodiments, the method includes forming a target layer over a semiconductor substrate, forming a carbon-rich hard masking layer over the target layer, patterning features in the carbon-rich hard masking layer using an etching process, performing a directional ion beam trimming process on the features patterned in the carbon-rich hard masking layer, and patterning the target layer using the carbon-rich hard masking layer as a mask.

Abstract: A semiconductor structure includes a semiconductor wafer, a first surface mount component, a second surface mount component and a first barrier structure. The first surface mount component is disposed on the semiconductor wafer, and electrically connected to the semiconductor wafer through a plurality of first electrical connectors. The second surface mount component is disposed on the semiconductor wafer, and electrically connected to the semiconductor wafer through a plurality of second electrical connectors, wherein an edge of the second surface mount component is overhanging a periphery of the semiconductor wafer. The first barrier structure is disposed on the semiconductor wafer in between the second electrical connectors and the edge of the second surface mount component, wherein a first surface of the first barrier structure is facing the second electrical connectors, and a second surface of the first barrier structure is facing away from the second electrical connectors.

Abstract: The present invention generally relates to a hydroponic culture medium and a hydroponic planting system, more particularly to a Houttuynia cordata hydroponic culture medium, a Houttuynia cordata hydroponic planting system, Houttuynia cordata extracts, a method, and applications thereof.

Abstract: A spark plug wrench is provided, including: a tubular body, including a working portion configured to be connected with a driving tool and a driving portion including a connection hole, the working portion including an assembling hole in communication with the connection hole; a socket base, disposed in the assembling hole, including a large diameter section radially abutted within the assembling hole, a small diameter section, a receiving hole configured for insertion of a spark plug, and receiving portions; and a plurality of positioning units, each of the plurality of positioning units including an elastic member and a positioning member, the elastic member and the positioning member being received in the receiving portion, the elastic member urging the positioning member so that the positioning member at least partially projects within the receiving hole for being engaged within a grooved portion of the spark plug.

Abstract: A voltage regulation circuit includes a voltage regulator that is configured to provide a stable output voltage based on an input voltage; and a control circuit, coupled to the voltage regulator, and configured to provide an injection current to maintain the stable output voltage in response to an enable signal provided at an input of the control circuit transitioning to a predetermined state and cease providing the injection current when the control circuit detects that a voltage level of the output voltage is higher than a pre-defined voltage level.

Abstract: A semiconductor process system includes an ion source configured to bombard with a photoresist structure on a wafer. The semiconductor process system reduces a width of the photoresist structure by bombarding the photoresist structure with ions in multiple distinct ion bombardment steps having different characteristics.

Abstract: A semiconductor package includes a first package component comprising: an integrated circuit die; an encapsulant surrounding the integrated circuit die; and a fan-out structure electrically connected to the integrated circuit die, wherein a first opening extends completely through the fan-out structure and at least partially through the encapsulant in a cross-sectional view, and wherein the encapsulant at least completely surrounds the first opening in a top-down view. The semiconductor package further includes a package substrate bonded to the first package component.

Abstract: There is provided a force sensor including a substrate and a polymer material layer. The substrate has a circuit layout that includes a first electrode and a second electrode configured to form a capacitor therebetween. The polymer material layer covers at least on a space between the first electrode and the second electrode, and is used to change capacitance of the capacitor while being pressed. The force sensor is arranged inside a stem of an earphone for detecting the user input.

Abstract: A device and method for fabricating the same is disclosed. For example, the device includes a sensor having a front side and a back side, a metal interconnect layer formed on the front side of the sensor, an anti-reflective coating formed on the back side of the sensor, a composite etch stop mask layer formed on the anti-reflective coating. wherein the composite etch stop mask layer includes a silicon nitride layer and a stressed layer. A percentage of Si—H bonds in the silicon nitride layer is greater than a percentage of Si—H bonds in the stressed layer.

Abstract: A display system includes a camera, a processor and a display. The camera is configured to shoot a first image and a second image in order. The processor is configured to generate a third image when a difference between the first image and the second image is larger than or equal to a preset difference value. The display is configured to display the first image and the third image in order when the difference is larger than or equal to the preset difference value. A display method and an image capture device are also disclosed herein.

Abstract: An operation method of a detachable camera, wherein the detachable camera includes a camera body, a camera holder, a driving element and a control circuit, the driving element is controlled by the driving element to control the camera holder, and the operation method, performed by the control circuit, includes: triggered by a trigger signal to determine whether the camera body is on the camera holder, setting a driving current of the driving element as a first current if the camera body is on the camera holder, and setting the driving current of the driving element as a second current if the camera body is not on the camera holder, wherein the second current is lower than the first current.