Abstract: A computer network includes a camera node, a network access node, a verification node, and a display node. Video content recorded by a camera at the camera node is transmitted to the display node and to the verification node for verification. The video content is verified at the display node and at the verification node. Recording metadata of the video content is stored in a distributed ledger and retrieved by the display node to verify the video content. The verification node receives, from the network access node, verification data for verifying the video content.

Abstract: A voltage regulation circuit includes a voltage regulator that is configured to provide a stable output voltage based on an input voltage; and a control circuit, coupled to the voltage regulator, and configured to provide an injection current to maintain the stable output voltage in response to an enable signal provided at an input of the control circuit transitioning to a predetermined state and cease providing the injection current when the control circuit detects that a voltage level of the output voltage is higher than a pre-defined voltage level.

Abstract: A power regulation system including a reference generator, a temperature compensation circuit coupled to the reference generator, and a low-dropout (LDO) regulator circuit coupled to the temperature compensation circuit, wherein the temperature compensation circuit provides a reference voltage to the LDO regulator circuit at least based on a ratio of a first current and a second current.

Abstract: A light guide plate, a backlight module and a display device are provided. The light guide plate includes a main body and an optical layer. The main body has a light-incident surface, a side surface and an optical surface. The light-incident surface and the side surface are respectively connected to the optical surface. The optical layer is correspondingly disposed on the side surface of the main body. In a reflectance characteristic of the optical layer, a total reflectance of the reflectance characteristic is composed of the diffuse reflectance and the parallel reflectance. The percentage value of the parallel reflectance to the total reflectance is less than 45 and larger than 25, including the end point.

Abstract: A semiconductor package includes a substrate, a semiconductor device over the substrate and a plurality of solder joint structures bonded between the semiconductor device and the substrate, wherein each of the plurality of solder joint structures includes, by weight percent, 2% to 23% of Indium (In).

Abstract: A method for forming a semiconductor device is provided. In some embodiments, the method includes forming a target layer over a semiconductor substrate, forming a carbon-rich hard masking layer over the target layer, patterning features in the carbon-rich hard masking layer using an etching process, performing a directional ion beam trimming process on the features patterned in the carbon-rich hard masking layer, and patterning the target layer using the carbon-rich hard masking layer as a mask.

Abstract: A semiconductor device comprises: a SiC epitaxial layer and a first recess. The SiC epitaxial layer has: a p-type well region; a heavily doped n-type region on a surface of the p-type well region; and a heavily doped p-type region below the heavily doped n-type region and within the p-type well region. The first recess is formed in the heavily doped p-type region and the heavily doped n-type region, wherein a depth of the first recess exceeds a depth of the heavily doped n-type region.

Abstract: There is provided a force sensor including a substrate and a polymer material layer. The substrate has a circuit layout that includes a first electrode and a second electrode configured to form a capacitor therebetween. The polymer material layer covers at least on a space between the first electrode and the second electrode, and is used to change capacitance of the capacitor while being pressed. The force sensor is arranged inside a stem of an earphone for detecting the user input.

Abstract: A device and method for fabricating the same is disclosed. For example, the device includes a sensor having a front side and a back side, a metal interconnect layer formed on the front side of the sensor, an anti-reflective coating formed on the back side of the sensor, a composite etch stop mask layer formed on the anti-reflective coating wherein the composite etch stop mask layer includes a hydrogen rich layer and a compressive high density layer, and a light filter formed on the composite etch stop mask layer.

Abstract: A curved panel includes a first curved substrate, a second curved substrate, a curved coverlens, and an adhesive structure. The first curved substrate and the second curved substrate are overlapped with each other. First to fourth sidewalls of the first curved substrate correspond to fifth to eighth sidewalls of the second curved substrate, respectively. The first to third sidewalls of the first curved substrate extend beyond the fifth to seventh sidewalls of the second curved substrate, respectively. The second curved substrate is located between the curved coverlens and the first curved substrate. The second curved substrate is bonded to the curved coverlens through an adhesive layer. The adhesive structure is located between the first curved substrate and the curved coverlens and is laterally located between the first sidewall and the fifth sidewall, between the second sidewall and the sixth sidewall, and between the third sidewall and the seventh sidewall.

Abstract: An isolation structure can be formed between adjacent and/or non-adjacent pixel regions (e.g., between diagonal or cross-road pixel regions), of an image sensor, to reduce and/or prevent optical crosstalk. The isolation structure may include a deep trench isolation (DTI) structure or another type of trench that is partially filled with a material such that an air gap is formed therein. The DTI structure having the air gap formed therein may reduce optical crosstalk between pixel regions. The reduced optical crosstalk may increase spatial resolution of the image sensor, may increase overall sensitivity of the image sensor, may decrease color mixing between pixel regions of the image sensor, and/or may decrease image noise after color correction of images captured using the image sensor.

Abstract: A system for stateful detection of cyberattacks includes an endpoint computer and a backend computer system. The endpoint computer monitors for cyberattacks and sends out queries for detected security events. The backend computer system stores observation data that are included in the queries. The backend computer system combines current observation data from a current query, relevant observation data from previous queries, and relevant cybersecurity data. The combined data are evaluated for cyberattacks.

Abstract: A smoke detection device includes a housing, a smoke collector, an optical detector and a cover plate. The housing has a piercing hole. The smoker collector has a smoke hole, and position of the smoke hole is close to position of the piercing hole. The optical detector is disposed inside the smoke collector and adapted to detect gaseous concentration inside the smoke collector. The cover plate is disposed between the housing and the smoke collector, and used to set a channel from the piercing hole to the smoke hole, so that gaseous matter flows from outside the smoke detection device into the smoke collector through the piercing hole and the smoke hole.

Abstract: A chip package structure includes an interposer structure that contains a package-side redistribution structure, an interposer core assembly, and a die-side redistribution structure. The interposer core assembly includes at least one silicon substrate interposer, and each of the at least one silicon substrate interposer includes a respective silicon substrate, a respective set of through-silicon via (TSV) structures vertically extending through the respective silicon substrate, a respective set of interconnect-level dielectric layers embedding a respective set of metal interconnect structures, and a respective set of metal bonding structures that are electrically connected to the die-side redistribution structure. The chip package structure includes at least two semiconductor dies that are attached to the die-side redistribution structure, and an epoxy molding compound (EMC) multi-die frame that laterally encloses the at least two semiconductor dies.

Abstract: A fiber optic adaptor includes a main shell body and an outer cover. The main shell body has a first end portion and a second end portion. The first end portion defines a first opening and is formed with two engaging grooves. The outer cover is removably disposed on and covering the first end portion, and has a cover body portion, two locking clips, and an identifier portion. The two locking clips protrudes from the cover and respectively engage the engaging grooves. The identifier portion is disposed on the cover body portion. The locking clips are operable to be removed respectively from the engaging grooves. The cover body portion defines a port outer opening, and a port key portion.

Abstract: A power regulation system including a reference generator, a temperature compensation circuit coupled to the reference generator, and a low-dropout (LDO) regulator circuit coupled to the temperature compensation circuit, wherein the temperature compensation circuit provides a reference voltage to the LDO regulator circuit at least based on a ratio of a first current and a second current.

Abstract: A semiconductor package includes a lower semiconductor device, a plurality of conductive pillars, an upper semiconductor device, an encapsulating material, and a redistribution structure. The plurality of conductive pillars are disposed on the lower semiconductor device along a direction parallel to a side of the lower semiconductor device. The upper semiconductor device is disposed on the lower semiconductor device and reveals a portion of the lower semiconductor device where the plurality of conductive pillars are disposed, wherein the plurality of conductive pillars disposed by the same side of the upper semiconductor device and the upper semiconductor device comprises a cantilever part cantilevered over the at least one lower semiconductor device. The encapsulating material encapsulates the lower semiconductor device, the plurality of conductive pillars, and the upper semiconductor device. The redistribution structure is disposed over the upper semiconductor device and the encapsulating material.

Abstract: A power adapter assembly structure is disclosed and includes a housing, a circuit board, a socket and an elastic element. The circuit board including a first abutting surface and the socket including a second abutting surface are fastened in the housing. The elastic element connected between the circuit board and the socket includes a main body, a first hanging arm and a second hanging arm. The first hanging arm and the second hanging arm are disposed at two opposite ends of the main body, and constantly abuts the first abutting surface and the second abutting surface, respectively. A first gap is formed between the main body and the first abutting surface, and less than a first length of the first hanging arm. A second gap is formed between the main body and the second abutting surface, and less than a second length of the second hanging arm.

Abstract: A game board device is provided for carrying and identifying game pieces that are divided into different piece types. The game board device includes a board, a plurality of optically identifying modules, and a processing module electrically coupled to the optically identifying modules. The optically identifying modules respectively correspond in position to detection regions of the board. Each of the optically identifying modules includes a light emitter that can emit light toward the corresponding detection region and a light receiver that can receive light reflected by the corresponding detection region. When any one of the detection regions is in an unoccupied mode, the corresponding optically identifying module can emit an unoccupied signal. When any one of the detection regions is in an occupied mode, the corresponding optically identifying module enables an identification signal that corresponds to the piece type of the corresponding game piece to be emitted therefrom.

Abstract: There is provided a smoke detector including a light source, a reflective surface, a light sensor and a processor. The light sensor receives reflected light when the light source emits light toward the reflective surface, and generates a reference detection signal when there is no smoke. The processor receives the detection signal from the light sensor, and automatically selects a set of predetermined condition thresholds according to a profile of the detection signal to be compared with the detection signal thereby determining whether to generate an alarm according to the comparison result.