Abstract: The present invention relates to a learning and creation system based on social network, comprising: a central server installed with a social network based learning creation computer program product comprising a concept map collaborative module and an instant messaging module; and a plurality of user devices, each of which the plurality of user devices executes an internet browser, in communication with the central server through an internet, and accesses the social network based learning creation computer program product through the internet browser and provides the concept map collaborative module and the instant messaging module for a user to operate in response to an operation from the user, wherein the concept map collaborative module is configured to provide a plurality of graphical objects based on a graphical concept map for a plurality of the users to perform a co-construction for the same concept and provide for the plurality of the users to engage an instant messaging by enabling the instant messag

Abstract: A manufacturing method of a chip package includes forming a temporary bonding layer on a carrier; forming an encapsulation layer on a top surface of a wafer or on the temporary bonding layer; bonding the carrier to the wafer, in which the encapsulation layer covers a sensor and a conductive pad of the wafer; patterning a bottom surface of the wafer to form a through hole, in which the conductive pad is exposed through the through hole; forming an isolation layer on the bottom surface of the wafer and a sidewall of the through hole; forming a redistribution layer on the isolation layer and the conductive pad that is in the through hole; forming a passivation layer on the isolation layer and the redistribution layer; and removing the temporary bonding layer and the carrier.

Abstract: A linkage brick assembly, comprising: a least one first linkage brick, at least one second linkage brick and at least one third linkage brick, each linkage brick comprising a top face, a bottom face and four side faces between the top face and the bottom face. Each of the side faces of the first linkage brick forms a traverse engaging groove extending laterally. Each of two opposite side faces of the four side faces of the second linkage brick forms a traverse engaging protrusion extending laterally and each of the other two opposite side faces forms a vertical engaging portion extending vertically. Each of the side faces of the third linkage brick forms a vertical engaging groove extending vertically. Each of the traverse engaging grooves of the first linkage brick is used to engage with each of the traverse engaging protrusions of the second linkage brick through lateral sliding.

Abstract: An anti-reflective integrated touch display panel includes an anti-reflective structure and touch electrodes. The anti-reflective structure includes a first insulating layer, a second insulating layer disposed on the first insulating layer, a conducting layer disposed on the second insulating layer, a third insulating layer disposed on the second insulating layer, and a fourth insulating layer disposed on the third insulating layer. The first insulating layer includes silicon oxide or silicon nitride, and has a thickness of 0.1 to 2 micrometers. The second insulating layer includes silicon oxide or strontium oxide, and has a thickness of 0.001 to 0.1 micrometer. The conducting layer includes molybdenum, and has a thickness of 0.01 to 0.05 micrometer. The fourth insulating layer includes silicon nitride, and has a thickness of 0.001 to 0.3 micrometer. The touch electrodes are disposed between the third insulating layer and the fourth insulating layer.

Abstract: A mouse roller module includes a roller, a sensing unit, an electromagnet and a control unit. The roller includes a ring-shaped magnet and a rotating shaft. The rotating shaft is extended along a first direction. When an external force is exerted on the roller, the ring-shaped magnet is rotated about the rotating shaft. The sensing unit is located near the roller to sense a pole of the ring-shaped magnet. The roller is arranged between the electromagnet and the sensing unit. The electromagnet and the ring-shaped magnet interact with each other to generate a magnetic force. The control unit is electrically connected with the sensing unit and the electromagnet. The control unit controls the electromagnet and the ring-shaped magnet of the roller to generate the magnetic force according to a result of sensing the pole of the ring-shaped magnet by the sensing unit.

Abstract: A mouse roller module includes a roller, a sensing unit, an electromagnet and a control unit. The roller includes a ring-shaped magnet and a rotating shaft. The rotating shaft is extended along a first direction. When an external force is exerted on the roller, the ring-shaped magnet is rotated about the rotating shaft. The sensing unit is located near the roller to sense a pole of the ring-shaped magnet. The roller is arranged between the electromagnet and the sensing unit. The electromagnet and the ring-shaped magnet interact with each other to generate a magnetic force. The control unit is electrically connected with the sensing unit and the electromagnet. The control unit controls the electromagnet and the ring-shaped magnet of the roller to generate the magnetic force according to a result of sensing the pole of the ring-shaped magnet by the sensing unit.

Abstract: A linkage brick assembly, comprising: a least one first linkage brick, at least one second linkage brick and at least one third linkage brick, each linkage brick comprising a top face, a bottom face and four side faces between the top face and the bottom face. Each of the side faces of the first linkage brick forms a traverse engaging groove extending laterally. Each of two opposite side faces of the four side faces of the second linkage brick forms a traverse engaging protrusion extending laterally and each of the other two opposite side faces forms a vertical engaging portion extending vertically. Each of the side faces of the third linkage brick forms a vertical engaging groove extending vertically. Each of the traverse engaging grooves of the first linkage brick is used to engage with each of the traverse engaging protrusions of the second linkage brick through lateral sliding.

Abstract: An electronic system is provided, which includes a mainboard, a pointing stick and a touchpad module, a first transmission path and a second transmission path. The mainboard is disposed with a first connecting unit. The pointing stick is connected to the first connecting unit through a transmission line. The touchpad module includes a circuit board, a second connecting unit and a controller. The circuit board includes a touch sensor. The first transmission path and the second transmission path are connected between the first connecting unit and the second connecting unit. The sensing signal outputted by the pointing stick is transmitted to the controller through the transmission line, the first connecting unit, the first transmission path and the second connecting unit. The output signal of the controller is transmitted to the mainboard through the second connecting unit, the second transmission path and the first connecting unit.

Abstract: A vacuum plastic molding machine includes a heating device, a plurality of upright posts, a carrier assembly, and a demolding mechanism. The carrier assembly includes an upper carrier and a lower carrier. The upper carrier includes an upper frame, multiple upper movement structures, at least one rotation plate, at least one driving member, and at least one linking mechanism. An adjusting space is defined between the at least one rotation plate and the at least one linking mechanism. The lower carrier includes a lower frame, multiple lower movement structures, and at least one locking tenon. The locking tenon is placed into the adjusting space. The at least one driving member is rotated to change the position of the at least one locking tenon in the adjusting space, and to adjust the distance between the upper carrier and the lower carrier.

Abstract: An anti-reflective integrated touch display panel includes an anti-reflective structure and touch electrodes. The anti-reflective structure includes a first insulating layer, a second insulating layer disposed on the first insulating layer, a conducting layer disposed on the second insulating layer, a third insulating layer disposed on the second insulating layer, and a fourth insulating layer disposed on the third insulating layer. The first insulating layer includes silicon oxide or silicon nitride, and has a thickness of 0.1 to 2 micrometers. The second insulating layer includes silicon oxide or strontium oxide, and has a thickness of 0.001 to 0.1 micrometer. The conducting layer includes molybdenum, and has a thickness of 0.01 to 0.05 micrometer. The fourth insulating layer includes silicon nitride, and has a thickness of 0.001 to 0.3 micrometer. The touch electrodes are disposed between the third insulating layer and the fourth insulating layer.

Abstract: A linkage brick assembly, comprising: a least one first linkage brick, at least one second linkage brick and at least one third linkage brick, each linkage brick comprising a top face, a bottom face and four side faces between the top face and the bottom face. Each of the side faces of the first linkage brick forms a traverse engaging groove extending laterally. Each of two opposite side faces of the four side faces of the second linkage brick forms a traverse engaging protrusion extending laterally and each of the other two opposite side faces forms a vertical engaging portion extending vertically. Each of the side faces of the third linkage brick forms a vertical engaging groove extending vertically. Each of the traverse engaging grooves of the first linkage brick is used to engage with each of the traverse engaging protrusions of the second linkage brick through lateral sliding.

Abstract: A method for manufacturing a semiconductor structure includes the following steps. A first carrier is adhered to a first surface of a wafer by a first temporary bonding layer. A second surface of the wafer facing away from the first carrier is etched to form at least one through hole and at least one trench, in which a conductive pad of the wafer is exposed through the through hole. An isolation layer is formed on the second surface of the wafer, a sidewall of the through hole, and a sidewall of the trench. A second carrier is adhered to the second surface of the wafer by a second temporary bonding layer, and thus the through hole and the trench are covered by the second carrier. The first carrier and the first temporary bonding layer are removed.

Abstract: An electronic system is provided, which includes a mainboard, a pointing stick and a touchpad module, a first transmission path and a second transmission path. The mainboard is disposed with a first connecting unit. The pointing stick is connected to the first connecting unit through a transmission line. The touchpad module includes a circuit board, a second connecting unit and a controller. The circuit board includes a touch sensor. The first transmission path and the second transmission path are connected between the first connecting unit and the second connecting unit. The sensing signal outputted by the pointing stick is transmitted to the controller through the transmission line, the first connecting unit, the first transmission path and the second connecting unit. The output signal of the controller is transmitted to the mainboard through the second connecting unit, the second transmission path and the first connecting unit.

Abstract: A chip package including a substrate having an upper surface, a lower surface, and a sidewall surface that is at the edge of the substrate is provided. The substrate includes a sensor device therein and adjacent to the upper surface thereof. The chip package further includes light-shielding layer disposed over the sidewall surface of the substrate and extends along the edge of the substrate to surround the sensor device. The chip package further includes a cover plate disposed over the upper surface of the substrate and a spacer layer disposed between the substrate and the cover plate. A method of forming the chip package is also provided.

Abstract: A chip package includes a chip, a sidewall structure that has a first light-shielding layer, a second light-shielding layer, and a cover. The chip has a light emitter and a light receiver that are located on a top surface of the chip. The sidewall structure is located on the top surface of the chip and has two aperture areas. The light emitter and the light receiver are respectively located in the two aperture areas. The sidewall structure surrounds the light emitter and the light receiver, and at least one surface of the sidewall structure has the first light-shielding layer. The second light-shielding layer is located between the chip and the sidewall structure. The cover is located on a surface of the sidewall structure facing away from the chip, and at least covers the light receiver and the sidewall structure that surrounds the light receiver.

Abstract: A wafer coating system includes a wafer chuck, a flowing insulating material sprayer and a wafer tilting lifting pin. The wafer chuck has a carrier part and a rotating part, which the carrier part is mounted on the rotating part to carry a wafer, and the rotating part is configured to rotate with a predetermined axis. The flowing insulating material sprayer is above the wafer chuck and configured to spray a flowing insulating material to the wafer, and the wafer tilting lifting pin is configured to form a first acute angle between the wafer and direction of gravity.

Abstract: This invention provides a touch panel-sensing chip package module complex, comprising: a touch panel with a first top surface and a first bottom surface opposite to each other, wherein the first bottom surface having a first cavity with a bottom wall surrounded by a sidewall; a color layer formed on the bottom wall and the first bottom surface adjacent to the cavity; and a chip scale sensing chip package module bonded to the cavity by the color layer formed on the bottom wall of the cavity.

Abstract: A chip package includes a chip, an isolation layer, a redistribution layer, a passivation layer, and an encapsulation layer. The chip has a sensor, a conductive pad, a through hole, a top surface, and a bottom surface that is opposite the top surface. The sensor and the conductive pad are located on the top surface, and the conductive pad is in the through hole. The isolation layer is located on the bottom surface of the chip and a sidewall that surrounds the through hole. The redistribution layer is located on the isolation layer, and is in electrical contact with the conductive pad. The passivation layer is located on the isolation layer and the redistribution layer. The encapsulation layer is located on the top surface of the chip and covers the sensor and the conductive pad, and has a flat surface facing away from the chip.

Abstract: A chip package including a substrate that has a first surface and a second surface opposite thereto is provided. The substrate includes a chip region and a scribe line region that extends along the edge of the chip region. The chip package further includes a dielectric layer disposed on the first surface of the substrate. The dielectric layer corresponding to the scribe line region has a through groove that extends along the extending direction of the scribe line region. A method of forming the chip package is also provided.

Abstract: This present invention provides a chip scale sensing chip package, comprising a sensing chip having a first top surface and a first bottom surface opposite to each other, a touch plate having a second top surface and a second bottom surface opposite to each other, formed above the sensing chip, and a color layer, sandwiched between the sensing chip and the touch plate, wherein the sensing chip comprises a sensing device formed nearby the first top surface and a plurality of conductive pads formed nearby the first top surface and adjacent to the sensing device, a plurality of through silicon vias exposing their corresponding conductive pads formed on the first bottom surface, a plurality of conductive structures formed on the first bottom surface, and a re-distribution layer overlaying the first bottom surface and each through silicon via to electrically connect each conductive pad and each conductive structure.