Patents by Inventor Yen-Hao Chen

Yen-Hao Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200163202
    Abstract: A noise suppression circuit device includes a baseboard, a decoupling capacitor set, a power bus structure, a band-stop filter unit and an electromagnetic band-gap structure. The decoupling capacitor set is disposed on the baseboard for isolating noise of a first frequency band. The power bus structure is disposed on the baseboard for isolating noise of a second frequency band. The band-stop filter unit is disposed on the baseboard for isolating at least a portion of noise of a third frequency band. The electromagnetic band-gap structure is disposed on the baseboard for isolating noise of a fourth frequency band.
    Type: Application
    Filed: December 17, 2018
    Publication date: May 21, 2020
    Inventors: Yen-Hao Chen, Lin-Zong Zheng, Ding-Bing Lin, Min-Hung Hsieh
  • Publication number: 20200161764
    Abstract: A dual-band antenna is provided. The dual-band antenna includes a first antenna, a second antenna, and a grounding component. The first antenna has a first feed point for transceiving a first signal. The second antenna has a second feed point. The grounding component is electrically coupled to the first feed point and the second feed point, wherein the grounding component forms a first path and a second path between the first feed point and the second feed point, wherein a first path length of the first path and a second path length of the second path are integer multiples of a first wavelength of the first signal.
    Type: Application
    Filed: November 13, 2019
    Publication date: May 21, 2020
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Wen-Jiao Liao, Jhin-Ciang Chen, Shih-Chia Liu, Liang-Che Chou, Yen-Hao Yu, Li-Chun Lee
  • Publication number: 20200162126
    Abstract: A circuit device includes a positive phase signal line, a negative phase signal line and a single-ended signal line. The positive phase signal line includes a first positive-phase-signal-line terminal and a second positive-phase-signal-line terminal for transmitting a first signal. The negative phase signal line includes a first negative-phase-signal-line terminal and a second negative-phase-signal-line terminal for transmitting a second signal. The single-ended signal line is disposed between the positive phase signal line and the negative phase signal line, and includes a first single-ended signal line terminal and a second single-ended signal line terminal for transmitting a single-ended signal. The first signal of the positive phase signal line causes a first noise on the single-ended signal line. The second signal of the negative phase signal line causes a second noise on the single-ended signal line. The first noise and the second noise eliminate one another.
    Type: Application
    Filed: December 17, 2018
    Publication date: May 21, 2020
    Inventor: Yen-Hao Chen
  • Patent number: 10658315
    Abstract: The present disclosure provides an integrated circuit (IC) structure. The IC structure includes a semiconductor substrate; an interconnection structure formed on the semiconductor substrate; and a redistribution layer (RDL) metallic feature formed on the interconnection structure. The RDL metallic feature further includes a barrier layer disposed on the interconnection structure; a diffusion layer disposed on the barrier layer, wherein the diffusion layer includes metal and oxygen; and a metallic layer disposed on the diffusion layer.
    Type: Grant
    Filed: March 27, 2018
    Date of Patent: May 19, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Shih Wei Bih, Sheng-Wei Yeh, Yen-Yu Chen, Wen-Hao Cheng, Chih-Wei Lin, Chun-Chih Lin
  • Publication number: 20200144208
    Abstract: The present disclosure provides an integrated circuit (IC) structure. The IC structure includes a semiconductor substrate; an interconnection structure formed on the semiconductor substrate; and a redistribution layer (RDL) metallic feature formed on the interconnection structure. The RDL metallic feature further includes a barrier layer disposed on the interconnection structure; a diffusion layer disposed on the barrier layer, wherein the diffusion layer includes metal and oxygen; and a metallic layer disposed on the diffusion layer.
    Type: Application
    Filed: December 26, 2019
    Publication date: May 7, 2020
    Inventors: Shih Wei Bih, Sheng-Wei Yeh, Yen-Yu Chen, Wen-Hao Cheng, Chih-Wei Lin, Chun-Chih Lin
  • Publication number: 20200137864
    Abstract: A method for monitoring a shock wave in an extreme ultraviolet light source includes irradiating a target droplet in the extreme ultraviolet light source apparatus of an extreme ultraviolet lithography tool with ionizing radiation to generate a plasma and to detect a shock wave generated by the plasma. One or more operating parameters of the extreme ultraviolet light source is adjusted based on the detected shock wave.
    Type: Application
    Filed: October 16, 2019
    Publication date: April 30, 2020
    Inventors: Yen-Shuo SU, Jen-Hao YEH, Jhan-Hong YEH, Ting-Ya CHENG, Yee-Shian Henry TONG, Chun-Lin CHANG, Han-Lung CHANG, Li-Jui CHEN, Po-Chung CHENG
  • Publication number: 20200125176
    Abstract: A method of virtual user interface interaction based on gesture recognition comprises detecting two hands in a plurality of images, recognizing each hand's gesture, projecting a virtual user interface on an open gesture hand when one hand is recognized with a point gesture and the other hand is recognized with an open gesture, tracking an index fingertip of the point gesture hand, determining whether the index fingertip of the point gesture hand is close to the open gesture hand within a predefined rule, interpreting a movement of the index fingertip of the point gesture hand as a click command when the index fingertip of the point gesture hand is close to the open gesture hand within the predefined rule, and in response to the click command, generating image data with a character object of the virtual user interface object.
    Type: Application
    Filed: October 21, 2018
    Publication date: April 23, 2020
    Inventors: Peter Chou, Feng-Seng Chu, Yen-Hung Lin, Shih-Hao Ke, Jui-Chieh Chen
  • Patent number: 10629990
    Abstract: An antenna structure including a metal element, a first capacitor, a second capacitor, a feeding element and an adjustment element is provided. The metal element has an open slot, and the open slot has an open end, a first slot and a second slot. The first slot and the second slot are respectively disposed on two opposite sides of the open end. The feeding element crosses the first slot. A first end of the feeding element has a feeding point, and a second end of the feeding element is electrically connected to the metal element through the first capacitor. The adjustment element is disposed in the second slot. A first end of the adjustment element is electrically connected to the metal element, and a second end of the adjustment element is electrically connected to the metal element through the second capacitor.
    Type: Grant
    Filed: September 29, 2017
    Date of Patent: April 21, 2020
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Li-Chun Lee, Shih-Chia Liu, Yen-Hao Yu, Jhin-Ciang Chen, Chao-Lin Wu, Jui-Hung Lai
  • Publication number: 20200107427
    Abstract: A droplet generator assembly includes a storage tank, a refill system, a droplet generator, and a temperature control system. The storage tank is configured to store a target material. The refill system is connected to the storage tank. The droplet generator includes a reservoir and a nozzle connected to the reservoir, in which the droplet generator is connected to the refill system, and the refill system is configured to deliver the target material to the reservoir. The temperature control system is adjacent to the refill system or the reservoir.
    Type: Application
    Filed: July 11, 2019
    Publication date: April 2, 2020
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Shih-Yu TU, Yu-Kuang SUN, Shao-Hua WANG, Han-Lung CHANG, Hsiao-Lun CHANG, Li-Jui CHEN, Po-Chung CHENG, Cheng-Hao LAI, Hsin-Feng CHEN, Wei-Shin CHENG, Ming-Hsun TSAI, Yen-Hsun CHEN
  • Publication number: 20200104042
    Abstract: An electronic device includes a keyboard module, a silicone film, a light-emitting module, and a touch module. The keyboard module has a plurality of buttons and a point stick. The silicone film has a virtual touch region. The light-emitting module is configured below the silicone film and corresponds to the virtual touch region. The light-emitting module includes a first light-emitting unit and a second light-emitting unit. The touch module is configured below the silicone film and corresponds to the virtual touch region. The touch module includes a control chip and a sensing layer. The point stick, the first light-emitting unit, the second light-emitting unit, and the sensing layer are electrically connected to the control chip, respectively.
    Type: Application
    Filed: February 18, 2019
    Publication date: April 2, 2020
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Meng-Huan Tsai, Yen-Hua Hsiao, Yun-Tung Pai, Chih-Yuan Lee, Chien-Hao Ho, Chia-Hua Wu, Kung-Ju Chen, Chia-Chi Lin, Chia-Chi Sun
  • Publication number: 20200097091
    Abstract: A method of interactive display based on gesture recognition includes determining a plurality of gestures corresponding to a plurality of images, interpreting a predetermined combination of gestures among the plurality of gestures as a command, and displaying a scene in response to the command.
    Type: Application
    Filed: September 25, 2018
    Publication date: March 26, 2020
    Inventors: Peter Chou, Feng-Seng Chu, Yen-Hung Lin, Shih-Hao Ke, Jui-Chieh Chen
  • Publication number: 20200075518
    Abstract: A method for forming a bond pad structure includes forming an interconnect structure on a semiconductor device, forming a passivation layer on the interconnect structure, forming at least one opening through the passivation layer, forming an oxidation layer at least in the opening, and forming a pad metal layer on the oxidation layer. A portion of the interconnect structure is exposed by the at least one opening.
    Type: Application
    Filed: June 3, 2019
    Publication date: March 5, 2020
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Wen-Hao CHENG, Yen-Yu CHEN, Chih-Wei LIN, Yi-Ming DAI
  • Publication number: 20200058689
    Abstract: The present disclosure relates to a CMOS image sensor, and an associated method of formation. In some embodiments, the CMOS image sensor comprises a floating diffusion region disposed at one side of a transfer gate within a substrate and a photo detecting column disposed at the other side of the transfer gate opposing to the floating diffusion region within the substrate. The photo detecting column comprises a doped sensing layer with a doping type opposite to that of the substrate. The photo detecting column and the substrate are in contact with each other at a junction interface comprising one or more recessed portions. By forming the junction interface with recessed portions, the junction interface is enlarged compared to a previous p-n junction interface without recessed portions, and thus a full well capacity of the photodiode structure is improved.
    Type: Application
    Filed: October 24, 2019
    Publication date: February 20, 2020
    Inventors: Chia-Yu Wei, Hsin-Chi Chen, Kuo-Cheng Lee, Ping-Hao Lin, Hsun-Ying Huang, Yen-Liang Lin, Yu Ting Kao
  • Publication number: 20200058601
    Abstract: A system and method for preventing cracks in a passivation layer is provided. In an embodiment a contact pad has a first diameter and an opening through the passivation layer has a second diameter, wherein the first diameter is greater than the second diameter by a first distance of about 10 ?m. In another embodiment, an underbump metallization is formed through the opening, and the underbump metallization has a third diameter that is greater than the first diameter by a second distance of about 5 ?m. In yet another embodiment, a sum of the first distance and the second distance is greater than about 15 ?m. In another embodiment the underbump metallization has a first dimension that is less than a dimension of the contact pad and a second dimension that is greater than a dimension of the contact pad.
    Type: Application
    Filed: October 23, 2019
    Publication date: February 20, 2020
    Inventors: Yu-Feng Chen, Yen-Liang Lin, Tin-Hao Kuo, Sheng-Yu Wu, Chen-Shien Chen
  • Patent number: 10559717
    Abstract: A light-emitting device includes a semiconductor stack including a first semiconductor layer, a second semiconductor layer formed on the first semiconductor layer, and an active layer formed therebetween, wherein the first semiconductor layer includes a surrounding exposed region not covered by the active layer, and the surrounding exposed region surrounds the active layer; a conductive layer formed on the second semiconductor layer, including a first conductive region extending toward and contacting the surrounding exposed region of the first semiconductor layer; an electrode layer formed on the first conductive region in the surrounding exposed region; an outside insulating layer covering a portion of the conductive layer and the electrode layer, and including a first opening exposing the other portion of the conductive layer; a bonding layer covering the outside insulating layer and electrically connecting to the other portion of the conductive layer through the first opening; and a conductive substrate, w
    Type: Grant
    Filed: November 13, 2018
    Date of Patent: February 11, 2020
    Assignee: EPISTAR CORPORATION
    Inventors: Chun-Teng Ko, Chao-Hsing Chen, Jia-Kuen Wang, Yen-Liang Kuo, Chih-Hao Chen, Wei-Jung Chung, Chih-Ming Wang, Wei-Chih Peng, Schang-Jing Hon, Yu-Yao Lin
  • Publication number: 20200039022
    Abstract: Provided herein are polishing pads in which microcapsules that include a polymer material and are dispersed, as well as methods of making and using the same. Such microcapsules are configured to break open (e.g., when the polishing pad is damaged during the dressing process), which releases the polymer material. When contacted with ultraviolet light the polymer material at least partially cures, healing the damage to the polishing pad. Such polishing pads have a longer lifetime and a more stable remove rate when compared to standard polishing pads.
    Type: Application
    Filed: July 16, 2019
    Publication date: February 6, 2020
    Inventors: Chun-Hao Kung, Hui-Chi Huang, Kei-Wei Chen, Yen-Ting Chen
  • Publication number: 20200039062
    Abstract: An automatic alignment system of a robot manipulator is provided. The automatic alignment system includes a signal transmission module and a controller. The signal transmission module includes a first signal receiving and transmitting element and a second signal receiving and transmitting element. The first signal receiving and transmitting element is mounted on the robot manipulator. The second signal receiving and transmitting element is disposed neighboring to a target workpiece. A signal is transported between the signal receiving and transmitting elements. The controller is electrically connected with the signal transmission module for receiving the signal outputted from the signal transmission module. The controller acquires a relative position between the first signal receiving and transmitting element and the second signal receiving and transmitting element according to a variation in the signal.
    Type: Application
    Filed: December 14, 2018
    Publication date: February 6, 2020
    Inventors: Yen-Po Wang, Cheng-Hao Huang, Ke-Hao Chang, Chun-Ying Chen
  • Publication number: 20200043747
    Abstract: A chemical-mechanical polishing (CMP) system includes a head, a polishing pad, and a magnetic system. The slurry used in the CMP process contains magnetizable abrasives. Application and control of a magnetic field, by the magnetic system, allows precise control over how the magnetizable abrasives in the slurry may be drawn toward the wafer or toward the polishing pad.
    Type: Application
    Filed: December 3, 2018
    Publication date: February 6, 2020
    Inventors: Yen-Ting Chen, Chun-Hao Kung, Tung-Kai Chen, Hui-Chi Huang, Kei-Wei Chen
  • Publication number: 20200005877
    Abstract: A write line circuit includes a power supply node configured to carry a power supply voltage level, a reference node configured to carry a reference voltage level, a first input node configured to receive a first data signal, a second input node configured to receive a second data signal, a third input node configured to receive a control signal, and an output node. The write line circuit is configured to, responsive to the first data signal, the second data signal, and the control signal, either output one of the power supply voltage level or the reference voltage level on the output node, or float the output node.
    Type: Application
    Filed: November 29, 2018
    Publication date: January 2, 2020
    Inventors: Manish ARORA, Hung-Jen LIAO, Yen-Huei CHEN, Nikhil PURI, Yu-Hao HSU
  • Publication number: 20200004151
    Abstract: In a pattern formation method, a bottom layer is formed over an underlying layer. A middle layer is formed over the bottom layer. A resist pattern is formed over the middle layer. The middle layer is patterned by using the resist pattern as an etching mask. The bottom layer is patterned by using the patterned middle layer. The underlying layer is patterned. The middle layer contains silicon in an amount of 50 wt % or more and an organic material. In one or more of the foregoing and following embodiments, an annealing operation is further performed after the middle layer is formed.
    Type: Application
    Filed: March 27, 2019
    Publication date: January 2, 2020
    Inventors: Chien-Wei WANG, Ching-Yu CHANG, Shang-Wern CHANG, Yen-Hao CHEN