Patents by Inventor Yen Hsiang Chew

Yen Hsiang Chew has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10462411
    Abstract: Examples are disclosed for video analytics of captured video content. In some examples, information may be received from a host processing system for a camera to capture video content. The camera may be a surveillance camera or a camera located with a display device. Video analytics may be performed on the captured video and the captured video content may be encoded. Data associated with the video analytics may then be sent to the host processing system. In some examples, the data as well as encoded captured video content or streaming video may be sent via communication channels included in an interconnect. Other examples are described and claimed.
    Type: Grant
    Filed: April 23, 2018
    Date of Patent: October 29, 2019
    Assignee: INTEL CORPORATION
    Inventors: Yen Hsiang Chew, Boon Hee Thomas Kam, Esther Chee Hsiang Cheng, Ivan Yu Kit Ho
  • Patent number: 10452549
    Abstract: An apparatus and method for page table management. For example, one embodiment of an apparatus comprises: a memory management circuit to perform address translations using a page directory, a base page directory address identifying a location of the page directory in a system memory; a cache to reserve a first cache line containing the base page directory address stored in a modified state; cache snoop circuitry to detect a read to the base page directory address by a processor or graphics processing unit (GPU); and locking circuitry to assert a lock signal to change the state of the first cache line to a locked state, the memory management circuit to refrain from performing a page table walk until the lock signal is de-asserted.
    Type: Grant
    Filed: August 17, 2017
    Date of Patent: October 22, 2019
    Assignee: Intel Corporation
    Inventor: Yen Hsiang Chew
  • Patent number: 10447476
    Abstract: Embodiments of methods and systems for encrypting and decrypting with encryption attributes are presented. An encryption attribute contains information to identify one or more segments of a file to be encrypted. An encryption process encrypts those one or more segments to generate a partly encrypted file instead of encrypting the entire file. That is, the file includes some data that are encrypted and some data that are not. In one embodiment, at least three encryption keys are used such that the encryption attribute is encrypted with using a third key.
    Type: Grant
    Filed: December 14, 2015
    Date of Patent: October 15, 2019
    Assignee: INTEL CORPORATION
    Inventor: Yen Hsiang Chew
  • Patent number: 10396038
    Abstract: A flexible packaging architecture is described that is suitable for curved package shapes. In one example a package has a first die, a first mold compound layer over the first die, a wiring layer over the first mold compound layer, a second die over the wiring layer and electrically coupled to the wiring layer, and a second mold compound layer over the second die.
    Type: Grant
    Filed: September 26, 2014
    Date of Patent: August 27, 2019
    Assignee: Intel Corporation
    Inventors: Bok Eng Cheah, Jackson Chung Peng Kong, Shanggar Periaman, Michael Skinner, Yen Hsiang Chew, Kheng Tat Mar, Ridza Effendi Abd Razak, Kooi Chi Ooi
  • Patent number: 10394280
    Abstract: Embodiments of wearable electronic devices, components thereof, and related systems and techniques are disclosed herein. For example, a wearable electronic device may include a wearable support structure having a first surface and a second surface; a first electrode located at the first surface, wherein, when the wearable electronic device is worn by a user on a portion of the user's body, the first electrode is arranged to contact the user's skin in the portion of the user's body; a second electrode located at the second surface, wherein, when the wearable electronic device is worn by a user on the portion of the user's body, the second electrode is arranged to not contact the user's skin in the portion of the user's body; and a resistance switch having first and second input terminals coupled to the first and second electrodes, respectively. Other embodiments may be disclosed and/or claimed.
    Type: Grant
    Filed: January 12, 2018
    Date of Patent: August 27, 2019
    Assignee: INTEL CORPORATION
    Inventors: Thorsten Meyer, Dirk Plenkers, Hans-Joachim Barth, Bernd Waidhas, Yen Hsiang Chew, Kooi Chi Ooi, Howe Yin Loo
  • Patent number: 10394728
    Abstract: A processor includes a core and an interrupt controller. The interrupt controller includes logic to read interrupt data from a memory, the interrupt data including a timestamp, an allowable delay value, and at least one interrupt vector. The interrupt controller also includes a delay-comparison circuit to determine a time lapse based on the timestamp and a system clock signal and to compare the time lapse to the allowable delay value. Further, the interrupt controller includes a second logic to determine whether to invoke an interrupt handler based on the comparison of the time lapse to the allowable delay value.
    Type: Grant
    Filed: December 1, 2016
    Date of Patent: August 27, 2019
    Assignee: Intel Corporation
    Inventor: Yen Hsiang Chew
  • Publication number: 20190181118
    Abstract: An electronic package can include a substrate, a first die and a second die. The first die can include a first thickness and the second die can include a second thickness. The first and second dies can be coupled to the substrate. A mold can be disposed on the substrate and cover the first die and the second die. The mold can include a planar upper surface. A first via, having a first length, can be extended between the first die and the planar upper surface. A second via, having a second length, can be extended between the second die and the planar upper surface. In some examples, a third die can be communicatively coupled to the first die using the first via and the second die using the second via.
    Type: Application
    Filed: June 28, 2018
    Publication date: June 13, 2019
    Inventor: Yen Hsiang Chew
  • Publication number: 20190109063
    Abstract: Integrated circuit (IC) structures with extended conductive pathways, as well as related structures, devices, and methods, are disclosed herein. For example, in some embodiments, an IC structure may include a die having a device side and an opposing back side; a mold compound disposed at the back side; and a conductive pathway extending into the die from the back side and extending into the mold compound from the back side.
    Type: Application
    Filed: April 28, 2016
    Publication date: April 11, 2019
    Applicant: Intel Corporation
    Inventor: Yen Hsiang Chew
  • Patent number: 10256219
    Abstract: Methods of forming stacked die assemblies are described. Those methods/structures may include forming a circuit element on a first substrate, wherein a first die is adjacent the circuit element, forming a via disposed directly on a surface of the circuit element, and forming a mold compound on the first die, on the circuit element and on the via, wherein the via and circuit element are completely embedded within the mold compound. A routing layer is formed on a top surface of the mold compound, and a second die is coupled with the routing layer.
    Type: Grant
    Filed: September 8, 2016
    Date of Patent: April 9, 2019
    Assignee: Intel Corporation
    Inventor: Yen Hsiang Chew
  • Publication number: 20190089939
    Abstract: Described are mechanisms for depth sensor optimization based on detected distances. The mechanisms may comprise a distance measurement module, which may be operable to measure a physical distance between a 3D camera sensor and a person or object in view of the 3D camera. The mechanisms may also comprise a sensor mode selector module, which may be operable to select a best camera sensor configuration based on a measured distance from a distance-measurement module.
    Type: Application
    Filed: September 18, 2017
    Publication date: March 21, 2019
    Applicant: Intel Corporation
    Inventor: Yen Hsiang Chew
  • Publication number: 20190088233
    Abstract: Embodiments herein relate to provision of keyboard, video, and mouse (KVM) connections. In various embodiments, a gateway apparatus may include a KVM remote connection manager, a local area network (LAN) port coupled with the KVM remote connection manage, and a wide area network (WAN) port coupled with the KVM remote connection manager, where the KVM remote connection manager includes a video encoder to encode an out-of-band redirected video stream received at the LAN port from a managed client device, destined for a remote management console, and send the encoded video stream to the remote management console via the WAN port. Other embodiments may be described and/or claimed.
    Type: Application
    Filed: September 19, 2017
    Publication date: March 21, 2019
    Inventor: Yen Hsiang CHEW
  • Publication number: 20190057034
    Abstract: An apparatus and method for page table management. For example, one embodiment of an apparatus comprises: a memory management circuit to perform address translations using a page directory, a base page directory address identifying a location of the page directory in a system memory; a cache to reserve a first cache line containing the base page directory address stored in a modified state; cache snoop circuitry to detect a read to the base page directory address by a processor or graphics processing unit (GPU); and locking circuitry to assert a lock signal to change the state of the first cache line to a locked state, the memory management circuit to refrain from performing a page table walk until the lock signal is de-asserted.
    Type: Application
    Filed: August 17, 2017
    Publication date: February 21, 2019
    Inventor: YEN HSIANG CHEW
  • Publication number: 20190044793
    Abstract: Embodiments herein relate to out-of-band connections for remote diagnosis and repair of client devices. In various embodiments, an apparatus for remote management of a client device may include a local area network (LAN) port, a wide area network (WAN) port, and a remote communications manager to provide to a remote management service, an identification of the apparatus as a gateway device for a LAN of the remote managed client computer. In embodiments, the identification may assist the remote management service in invoking the remote managed client computer to establish a remote management session via an out-of-band (OOB) channel with the gateway device. In embodiments, a gateway-assisted failover during a remote management session between a remote management console and a managed client device may be provided. Other embodiments may be described and/or claimed.
    Type: Application
    Filed: December 28, 2017
    Publication date: February 7, 2019
    Inventor: Yen Hsiang CHEW
  • Publication number: 20190044794
    Abstract: Technologies to provide a gateway-assisted out-of-band (OOB) remote management session between a remote management service (RMS) and a managed client system are provided. In response to a fault being detected at a client computer system, a RMS receives a client initiated remote access (CIRA) packet from the client system. The CIRA packet includes client configuration information and a single hop network appliance identifier (SHNAI) associated with a network appliance that is a single hop away from the client system. The RMS inspects the SHNAI and the client configuration information, and identifies and copies suitable application(s) from a storage system to a local storage of the gateway indicated by the SHNAI. The RMS instructs/controls the client system to perform an IDE redirection to the gateway in order to provision the application(s) from the local storage of the gateway. Other embodiments may be described and/or claimed.
    Type: Application
    Filed: June 27, 2018
    Publication date: February 7, 2019
    Inventor: Yen Hsiang CHEW
  • Patent number: 10168767
    Abstract: An embodiment of an interaction mode selection apparatus may include a distance estimator to estimate a distance between a user and a part of a machine interface, and an interaction selector communicatively coupled to the distance estimator to select one or more active interaction modes from two or more available interaction modes based on the estimated distance. The distance estimator may include a depth sensor, a three-dimensional camera, a two-dimensional camera, an array of cameras, an array of microphones, an array of wireless access points, a beacon sensor, a proximity sensor, and/or an ultrasonic sensor. The available interaction modes may include a keyboard interaction mode, a mouse interaction mode, a touch interaction mode, a voice interaction mode, a gesture interaction mode, a body part cursor interaction mode, a body analysis interaction mode, and/or a facial analysis interaction mode. Other embodiments are disclosed and claimed.
    Type: Grant
    Filed: September 30, 2016
    Date of Patent: January 1, 2019
    Assignee: Intel Corporation
    Inventor: Yen Hsiang Chew
  • Publication number: 20180359446
    Abstract: Examples are disclosed for video analytics of captured video content. In some examples, information may be received from a host processing system for a camera to capture video content. The camera may be a surveillance camera or a camera located with a display device. Video analytics may be performed on the captured video and the captured video content may be encoded. Data associated with the video analytics may then be sent to the host processing system. In some examples, the data as well as encoded captured video content or streaming video may be sent via communication channels included in an interconnect. Other examples are described and claimed.
    Type: Application
    Filed: April 23, 2018
    Publication date: December 13, 2018
    Applicant: INTEL CORPORATION
    Inventors: Yen Hsiang Chew, Boon Hee Thomas Kam, Esther Chee Hsiang Cheng, Ivan Yu Kit Ho
  • Publication number: 20180285767
    Abstract: A method for training an analytics engine hosted by an edge server device is provided. The method includes determining a classification for data in an analytics engine hosted by an edge server and computing a confidence level for the classification. The confidence level is compared to a threshold. The data is sent to a cloud server if the confidence level is less than the threshold. A reclassification is received from the cloud server and the analytics engine is trained based, at least in part, on the data and the reclassification.
    Type: Application
    Filed: March 30, 2017
    Publication date: October 4, 2018
    Applicant: INTEL CORPORATION
    Inventor: Yen Hsiang Chew
  • Patent number: 10089264
    Abstract: A mechanism is described for facilitating callback interrupt handling for multi-threaded applications in computing environments. A method of embodiments, as described herein, includes detecting a task issued by a thread associated with an application processor, where the task is to be processed by a graphics processor at the apparatus. The method may further include scheduling the task at the graphics processor, and emulating an interrupt to the application processor, where the emulated interrupt disables one or more graphics interrupts while the task is being processed by the graphics processor. The method may further include facilitating an interrupt handler to communicate a signal to the application processor to wake up the thread, where the thread is facilitated to perform one or more tasks independent of the task being processed by the graphics processor.
    Type: Grant
    Filed: May 13, 2016
    Date of Patent: October 2, 2018
    Assignee: INTEL CORPORATION
    Inventor: Yen Hsiang Chew
  • Publication number: 20180190617
    Abstract: Heat dissipation technology in a die stack is disclosed. In one example, an electronic device comprises a pair of electrically coupled dies; and a heat spreader disposed between the pair of dies and electrically isolated from an electrical connection between the pair of dies.
    Type: Application
    Filed: December 31, 2016
    Publication date: July 5, 2018
    Applicant: Intel Corporation
    Inventor: Yen Hsiang Chew
  • Publication number: 20180183653
    Abstract: System and techniques for gateway assisted diagnostics and repair are described herein. A request for assistance may be received from a client device at a gateway device attached to a local area network (LAN) and a wide area network (WAN). The request for assistance may include an indication of an event experienced by the client device. The request for assistance may be forwarded to a management controller of the gateway device. Instructions may be transmitted to the client device via the LAN for resolving the event experienced by the client device.
    Type: Application
    Filed: December 23, 2016
    Publication date: June 28, 2018
    Inventors: Yen Hsiang Chew, Kanapathy Murugayah, Jose Avalos