Patents by Inventor Yen-Hsiang Fang

Yen-Hsiang Fang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9977192
    Abstract: An optical receiver including a photodetector and a waveguide is provided. The photodetector includes a plurality of photosensitive regions arranged in an array. The waveguide is disposed on the photodetector and includes a plurality of gratings, a plurality of optical channels, and a plurality of light-deflection elements. The gratings are respectively adapted to collect light beams incident on the waveguide at different angles. The optical channels are adapted to propagate the light beams collected by the gratings. The light-deflection elements are disposed on transmission paths of the light beams propagating in the optical channels and are located above the photosensitive regions. The light-deflection elements are adapted to propagate the light beams propagating in the optical channels to the photosensitive regions. An optical transceiver is also provided.
    Type: Grant
    Filed: July 29, 2016
    Date of Patent: May 22, 2018
    Assignee: Industrial Technology Research Institute
    Inventors: Chia-Hsin Chao, Yen-Hsiang Fang, Chun-Hsing Lee, Kai-Ning Ku
  • Publication number: 20180108284
    Abstract: A three-dimensional display module includes a substrate, a display layer, a first electrode layer, a liquid-crystal layer, a second electrode layer, and a drive unit. The substrate has first electrodes and second electrodes. The display layer is disposed on the substrate and includes light-emitting elements. The first electrode layer is disposed on the display layer. The liquid-crystal layer is disposed on the display layer. The second electrode layer is disposed on the liquid-crystal layer. The drive unit drives the first electrodes and the first electrode layer to supply power to the light-emitting elements, such that the light-emitting elements generate light passing through the liquid-crystal layer to form a display image. The drive unit drives the second electrodes and the second electrode layer to produce an electric field on the liquid-crystal layer to change focal length of the liquid-crystal layer so as to control depth of field of the display image.
    Type: Application
    Filed: December 8, 2016
    Publication date: April 19, 2018
    Applicant: Industrial Technology Research Institute
    Inventors: Ying-Chien Chu, Yen-Hsiang Fang, Chia-Hsin Chao, Ming-Hsien Wu, Shih-Hao Wang
  • Publication number: 20180032826
    Abstract: A biometric device includes a substrate, an image sensor, at least one infrared light emitting diode (IR LED), a supporting structure and an optical layer. The image sensor is disposed on the substrate. The at least one IR LED is disposed on the substrate. The supporting structure is disposed on the substrate and located between the image sensor and the at least one infrared light emitting diode. The optical layer is disposed on the supporting structure, covers the image sensor, and includes a coded pattern.
    Type: Application
    Filed: October 11, 2017
    Publication date: February 1, 2018
    Applicant: Industrial Technology Research Institute
    Inventors: Chia-Hsin Chao, Yen-Hsiang Fang, Ming-Hsien Wu, Po-Hsun Wang
  • Patent number: 9847047
    Abstract: A display pixel suitable for being arranged on a carrier is provided. The display pixel includes a plurality of light-emitting diode chips. The light-emitting diode chips are disposed on and electrically connected to the carrier. Each of the light-emitting diode chips respectively serves as a sub-pixel and includes a semiconductor device layer, and the semiconductor device layer includes a display light-emitting mesa and at least one redundant light-emitting mesa. During a period of driving each of the light-emitting diode chips, one of the display light-emitting mesa and the at least one redundant light-emitting mesa in each of the light-emitting diode chips is capable of emitting light. A display panel including a plurality of the display pixels mentioned above is also provided.
    Type: Grant
    Filed: December 28, 2015
    Date of Patent: December 19, 2017
    Assignee: Industrial Technology Research Institute
    Inventors: Ming-Hsien Wu, Yen-Hsiang Fang, Yao-Jun Tsai
  • Patent number: 9773711
    Abstract: A picking-up and placing process for electronic devices includes: forming a plurality of electronic devices arranged in an array on a carrier, wherein a first conductive layer having a conductive pattern is disposed between each of the electronic devices and the carrier, and a width of the electronic device is greater than that of the corresponding conductive pattern; selectively picking-up parts of the electronic devices and corresponding first conductive layers from the carrier via a picking-up and placing module; and placing the parts of the electronic devices and the corresponding first conductive layers on a target substrate by the picking-up and placing module. An electronic module is further provided.
    Type: Grant
    Filed: March 4, 2016
    Date of Patent: September 26, 2017
    Assignee: Industrial Technology Research Institute
    Inventors: Ming-Hsien Wu, Yen-Hsiang Fang
  • Patent number: 9692509
    Abstract: A driving method of a light emitting device including visible light emitting elements is provided. In a first visible light communication mode, a first portion of the visible light emitting elements is driven and a second portion of the visible light emitting elements is idled for the first portion of the visible light emitting elements having a first current density. In a second visible light communication mode, each of the visible light emitting elements is driven so as to have a second current density. An illumination brightness difference of the light emitting device between the first visible light communication mode and the second visible light communication mode is smaller than 15%.
    Type: Grant
    Filed: December 21, 2015
    Date of Patent: June 27, 2017
    Assignee: Industrial Technology Research Institute
    Inventors: Chia-Hsin Chao, Yen-Hsiang Fang, Ming-Hsien Wu
  • Publication number: 20170162091
    Abstract: A display pixel suitable for being arranged on a carrier is provided. The display pixel includes a plurality of light-emitting diode chips. The light-emitting diode chips are disposed on and electrically connected to the carrier. Each of the light-emitting diode chips respectively serves as a sub-pixel and includes a semiconductor device layer, and the semiconductor device layer includes a display light-emitting mesa and at least one redundant light-emitting mesa. During a period of driving each of the light-emitting diode chips, one of the display light-emitting mesa and the at least one redundant light-emitting mesa in each of the light-emitting diode chips is capable of emitting light. A display panel including a plurality of the display pixels mentioned above is also provided.
    Type: Application
    Filed: December 28, 2015
    Publication date: June 8, 2017
    Inventors: Ming-Hsien Wu, Yen-Hsiang Fang, Yao-Jun Tsai
  • Publication number: 20170162767
    Abstract: A package structure of an ultraviolet light emitting diode is provided, which includes a substrate, a transparent body, at least one ultraviolet light emitting diode, a connecting element and an ultraviolet shielding layer. The transparent body is disposed on the substrate. The transparent body has a space inside thereof. The at least one ultraviolet light emitting diode is disposed on the substrate and inside the space. The connecting element is disposed between the substrate and the transparent body. The ultraviolet shielding layer is disposed between the transparent body and the connecting element.
    Type: Application
    Filed: October 11, 2016
    Publication date: June 8, 2017
    Applicant: Industrial Technology Research Institute
    Inventors: Chien-Chun Lu, Chen-Peng Hsu, Zhi-Wei Koh, Yen-Hsiang Fang
  • Publication number: 20170148650
    Abstract: An electric-programmable magnetic module comprising a micro electro mechanical system (MEMS) chip and a bonding equipment is provided. The MEMS chip comprises a plurality of electromagnetic coils and each of the electromagnetic coils is individually controlled. The MEMS chip is assembled with and carried by the bonding equipment.
    Type: Application
    Filed: February 9, 2017
    Publication date: May 25, 2017
    Applicants: Industrial Technology Research Institute, PlayNitride Inc.
    Inventors: Ming-Hsien Wu, Yen-Hsiang Fang, Chia-Hsin Chao
  • Publication number: 20170149498
    Abstract: A driving method of a light emitting device including visible light emitting elements is provided. In a first visible light communication mode, a first portion of the visible light emitting elements is driven and a second portion of the visible light emitting elements is idled for the first portion of the visible light emitting elements having a first current density. In a second visible light communication mode, each of the visible light emitting elements is driven so as to have a second current density. An illumination brightness difference of the light emitting device between the first visible light communication mode and the second visible light communication mode is smaller than 15%.
    Type: Application
    Filed: December 21, 2015
    Publication date: May 25, 2017
    Inventors: Chia-Hsin Chao, Yen-Hsiang Fang, Ming-Hsien Wu
  • Patent number: 9653382
    Abstract: A semiconductor laser structure is provided. The semiconductor laser comprises a central thermal shunt, a ring shaped silicon waveguide, a contiguous thermal shunt, an adhesive layer and a laser element. The central thermal shunt is located on a SOI substrate which has a buried oxide layer surrounding the central thermal shunt. The ring shaped silicon waveguide is located on the buried oxide layer and surrounds the central thermal shunt. The ring shaped silicon waveguide includes a P-N junction of a p-type material portion, an n-type material portion and a depletion region there between. The contiguous thermal shunt covers a portion of the buried oxide layer and surrounds the ring shaped silicon waveguide. The adhesive layer covers the ring shaped silicon waveguide and the buried oxide layer. The laser element covers the central thermal shunt, the adhesive layer and the contiguous thermal shunt.
    Type: Grant
    Filed: September 24, 2015
    Date of Patent: May 16, 2017
    Assignee: Industrial Technology Research Institute
    Inventors: Jui-Ying Lin, Yen-Hsiang Fang, Chia-Hsin Chao, Yao-Jun Tsai, Yi-Chen Lin
  • Patent number: 9607907
    Abstract: A picking-up and placement process for electronic devices comprising: (a) providing a first substrate having a plurality of electronic devices formed thereon, the electronic devices being arranged in an array, and each of the electronic devices comprising a magnetic portion; (b) selectively picking-up parts of the electronic devices from the first substrate via a magnetic force generated from an electric-programmable magnetic module; and (c) bonding the parts of the electronic devices picked-up by the electric-programmable magnetic module with a second substrate.
    Type: Grant
    Filed: November 30, 2015
    Date of Patent: March 28, 2017
    Assignees: Industrial Technology Research Institute, PlayNitride Inc.
    Inventors: Ming-Hsien Wu, Yen-Hsiang Fang, Chia-Hsin Chao
  • Publication number: 20170031104
    Abstract: An optical receiver including a photodetector and a waveguide is provided. The photodetector includes a plurality of photosensitive regions arranged in an array. The waveguide is disposed on the photodetector and includes a plurality of gratings, a plurality of optical channels, and a plurality of light-deflection elements. The gratings are respectively adapted to collect light beams incident on the waveguide at different angles. The optical channels are adapted to propagate the light beams collected by the gratings. The light-deflection elements are disposed on transmission paths of the light beams propagating in the optical channels and are located above the photosensitive regions. The light-deflection elements are adapted to propagate the light beams propagating in the optical channels to the photosensitive regions. An optical transceiver is also provided.
    Type: Application
    Filed: July 29, 2016
    Publication date: February 2, 2017
    Applicant: Industrial Technology Research Institute
    Inventors: Chia-Hsin Chao, Yen-Hsiang Fang, Chun-Hsing Lee, Kai-Ning Ku
  • Publication number: 20170028647
    Abstract: In one exemplary embodiment, a three dimensional printing system may include a tank filled with liquid forming material, a carrier platform, an optical module disposed under the tank, and a control module is provided. The control module is electrically connected to the optical module and the carrier platform, such that the carrier platform is controlled to move in the tank, and the optical module is controlled to generate light irradiating to the liquid forming material to form a solidification layer on the carrier platform. An image position of the optical module is located in a specific position away from the bottom of the tank in the liquid forming material to form a solidification plane, the liquid forming material at the solidification plane is cured and solidified to form the solidification layer, and a plurality of solidification layers are stacked to form a three dimensional object.
    Type: Application
    Filed: December 28, 2015
    Publication date: February 2, 2017
    Inventors: Chia-Hsin Chao, Yen-Hsiang Fang, Ming-Hsien Wu, Ying-Chien Chu
  • Publication number: 20170034922
    Abstract: A detection method for electronic devices including steps as follows is provided. The detection method includes: providing an electronic device substrate; attaching a portion of electronic devices of the electronic device substrate through an electronic device transfer module, wherein the electronic device transfer module includes a plurality of detecting elements corresponding to the portion of the electronic devices, and each of the detecting elements includes at least one pair of electrodes; detecting whether a conducting path between the at least one pair of electrodes is generated or not to confirm a status of contact between the portion of the electronic devices and a contact target; and transferring the portion of the electronic devices attached to the electronic device transfer module to a target substrate. An electronic device transfer module having detecting elements is also provided.
    Type: Application
    Filed: July 29, 2016
    Publication date: February 2, 2017
    Applicant: Industrial Technology Research Institute
    Inventors: Ming-Hsien Wu, Yen-Hsiang Fang, Shih-Hao Wang, Yi-Chen Lin
  • Publication number: 20170032203
    Abstract: A biometric device includes a substrate, an image sensor, an optical layer and at least one infrared light emitting diode (IR LED). The image sensor is disposed on the substrate. The optical layer is disposed on the image sensor and includes a diffraction pattern. The IR LED is disposed on the diffraction pattern of the optical layer. The optical layer is located between the IR LED and the image sensor.
    Type: Application
    Filed: July 28, 2016
    Publication date: February 2, 2017
    Applicant: Industrial Technology Research Institute
    Inventors: Chia-Hsin Chao, Yen-Hsiang Fang, Ming-Hsien Wu
  • Publication number: 20160268491
    Abstract: A picking-up and placing process for electronic devices includes: forming a plurality of electronic devices arranged in an array on a carrier, wherein a first conductive layer having a conductive pattern is disposed between each of the electronic devices and the carrier, and a width of the electronic device is greater than that of the corresponding conductive pattern; selectively picking-up parts of the electronic devices and corresponding first conductive layers from the carrier via a picking-up and placing module; and placing the parts of the electronic devices and the corresponding first conductive layers on a target substrate by the picking-up and placing module. An electronic module is further provided.
    Type: Application
    Filed: March 4, 2016
    Publication date: September 15, 2016
    Inventors: Ming-Hsien Wu, Yen-Hsiang Fang
  • Publication number: 20160172536
    Abstract: A semiconductor light-emitting structure including a first-type doped semiconductor layer, a second-type doped semiconductor layer, a light-emitting layer, a first electrode, a second electrode, and a magnetic layer is provided. The light-emitting layer is disposed between the first-type doped semiconductor layer and the second-type doped semiconductor layer. The first electrode is electrically connected to the first-type doped semiconductor layer, and the second electrode is electrically connected to the second-type doped semiconductor layer. The magnetic layer connects the first electrode and the first-type doped semiconductor layer. At least a portion of the magnetic layer is magnetic, and the bandgap of at least another portion of the magnetic layer is greater than 0 eV and is less than or equal to 5 eV. The material of the magnetic layer includes metal, metal oxide, or a combination thereof.
    Type: Application
    Filed: December 29, 2014
    Publication date: June 16, 2016
    Inventors: Chia-Lung Tsai, Yen-Hsiang Fang, Pao-Chu Tzeng
  • Patent number: D801181
    Type: Grant
    Filed: June 2, 2016
    Date of Patent: October 31, 2017
    Assignee: Industrial Technology Research Institute
    Inventors: Zhi-Wei Koh, Chien-Chun Lu, Chen-Peng Hsu, Yen-Hsiang Fang
  • Patent number: D807524
    Type: Grant
    Filed: May 5, 2016
    Date of Patent: January 9, 2018
    Assignee: Industrial Technology Research Institute
    Inventors: Zhi-Wei Koh, Yen-Hsiang Fang, Chen-Peng Hsu, Chien-Chun Lu