Abstract: A three-dimensional display module includes a substrate, a display layer, a first electrode layer, a liquid-crystal layer, a second electrode layer, and a drive unit. The substrate has first electrodes and second electrodes. The display layer is disposed on the substrate and includes light-emitting elements. The first electrode layer is disposed on the display layer. The liquid-crystal layer is disposed on the display layer. The second electrode layer is disposed on the liquid-crystal layer. The drive unit drives the first electrodes and the first electrode layer to supply power to the light-emitting elements, such that the light-emitting elements generate light passing through the liquid-crystal layer to form a display image. The drive unit drives the second electrodes and the second electrode layer to produce an electric field on the liquid-crystal layer to change focal length of the liquid-crystal layer so as to control depth of field of the display image.

Abstract: A display array including a semiconductor stacked layer, an insulating layer, a plurality of electrode pads, and a driving backplane is provided. The semiconductor stacked layer has a plurality of light emitting regions. The insulating layer is disposed to an outer surface of the semiconductor stacked layer and contacts the semiconductor stacked layer. The insulating layer has a plurality of openings. The electrode pads are disposed to the insulating layer. The driving backplane is disposed to the semiconductor stacked layer. The electrode pads are respectively electrically connected to a portion of the semiconductor stacked layer and the driving backplane via the openings of the insulating layer to drive the light emitting regions. The electrode pads are located in the openings of the insulating layer and separated by the insulating layer, and the adjacent light emitting regions in the semiconductor stacked layer are not patterned.

Abstract: A method for manufacturing a display array includes the following steps: providing a substrate and forming a semiconductor stacked layer on the substrate; forming an insulating layer and a plurality of electrode pads on an outer surface of the semiconductor stacked layer, the insulating layer and the electrode pads directly contacting the semiconductor stacked layer, wherein the insulating layer has a plurality of openings, and the electrode pads are respectively located in the openings of the insulating layer and separated by the insulating layer; and transferring the semiconductor stacked layer, the insulating layer and the electrode pads from the substrate to a driving backplane, wherein the electrode pads are respectively electrically connected to a portion of the semiconductor stacked layer and the driving backplane through the openings of the insulating layer to form a plurality of light emitting regions in the semiconductor stacked layer.

Abstract: A transfer support adapted to contact a plurality of elements is provided. The transfer support has a first surface, a second surface opposite to the first surface, a recess located on the second surface, a plurality of platforms protruded from the first surface, a plurality of supporting pillars distributed in the recess and a plurality of through holes. The platforms have carry surfaces adapted to contact the plurality of elements. The through holes extend from the carry surfaces of the platforms to the recess, and two of the adjacent supporting pillars are spaced apart from each other to form an air passage. In addition, a transfer module is also provided.

Abstract: A detection method for electronic devices including steps as follows is provided. The detection method includes: providing an electronic device substrate; attaching a portion of electronic devices of the electronic device substrate through an electronic device transfer module, wherein the electronic device transfer module includes a plurality of detecting elements corresponding to the portion of the electronic devices, and each of the detecting elements includes at least one pair of electrodes; detecting whether a conducting path between the at least one pair of electrodes is generated or not to confirm a status of contact between the portion of the electronic devices and a contact target; and transferring the portion of the electronic devices attached to the electronic device transfer module to a target substrate. An electronic device transfer module having detecting elements is also provided.

Abstract: A display device including a circuit substrate, a plurality of pixels, and a light-shielding layer is provided. The pixels include a plurality of light-emitting elements. The light-emitting elements are disposed on the circuit substrate and are electrically connected to the circuit substrate. The light-emitting elements in the pixels are arranged along an arrangement direction. The light-shielding layer is disposed on the circuit substrate and has a plurality of pixel apertures. The pixels are disposed in a corresponding pixel aperture. The light-shielding layer includes a plurality of first light-shielding patterns extending in the arrangement direction and a plurality of second light-shielding patterns connected to the first light-shielding patterns. The extending direction of the second light-shielding patterns is different from the extending direction of the first light-shielding patterns.

Abstract: A transfer support adapted to contact a plurality of elements is provided. The transfer support has a first surface, a second surface opposite to the first surface, a recess located on the second surface, a plurality of platforms protruded from the first surface, a plurality of supporting pillars distributed in the recess and a plurality of through holes. The platforms have carry surfaces adapted to contact the plurality of elements. The through holes extend from the carry surfaces of the platforms to the recess, and two of the adjacent supporting pillars are spaced apart from each other to form an air passage. In addition, a transfer module is also provided.

Abstract: A transfer support adapted to contact a plurality of elements is provided. The transfer support has a first surface, a second surface opposite to the first surface, a recess located on the second surface, a plurality of platforms protruded from the first surface, a plurality of supporting pillars distributed in the recess and a plurality of through holes. The platforms have carry surfaces adapted to contact the plurality of elements. The through holes extend from the carry surfaces of the platforms to the recess, and two of the adjacent supporting pillars are spaced apart from each other to form an air passage. In addition, a transfer module is also provided.

Abstract: An electric-programmable magnetic module comprising a micro electro mechanical system (MEMS) chip and a bonding equipment is provided. The MEMS chip comprises a plurality of electromagnetic coils and each of the electromagnetic coils is individually controlled. The MEMS chip is assembled with and carried by the bonding equipment.

Abstract: A light emitting diode package including a circuit layer, a light-shielding layer, a plurality of light emitting diodes and an encapsulation layer is provided. A thickness of the circuit layer is less than 100 ?m. The light-shielding layer is disposed on a first surface of the circuit layer and the light-shielding layer has a plurality of apertures. The light emitting diodes are disposed on the first surface of the circuit layer and in the apertures of the light-shielding layer. The light emitting diodes are electrically connected to the circuit layer. The encapsulation layer covers the light-shielding layer. A refractive index of the encapsulation layer is 1.4 and to 1.7. The Young's modulus of the encapsulation layer is larger than or equal to 1 GPa. A thickness of the encapsulation layer is greater than thicknesses of the light emitting diodes.

Abstract: A package structure of an ultraviolet light emitting diode is provided, which includes a substrate, a transparent body, at least one ultraviolet light emitting diode, a connecting element and an ultraviolet shielding layer. The transparent body is disposed on the substrate. The transparent body has a space inside thereof. The at least one ultraviolet light emitting diode is disposed on the substrate and inside the space. The connecting element is disposed between the substrate and the transparent body. The ultraviolet shielding layer is disposed between the transparent body and the connecting element.

Abstract: A magnetic transfer module adapted to transfer a plurality of electronic elements. The magnetic transfer module includes an electromagnet and a plurality of transfer unit. The transfer units are connected to the electromagnet, each of the transfer units includes a ferromagnetic material element, and at least one of the transfer units includes a heating element. The electromagnet magnetizes the ferromagnetic material element, such that the ferromagnetic material element magnetically attracts one of the electronic elements. The heating element is disposed between the electromagnet and the ferromagnetic material element, and heats the ferromagnetic material element to demagnetize the ferromagnetic material element while being actuated.

Abstract: An optical receiver including a photodetector and a waveguide is provided. The photodetector includes a plurality of photosensitive regions arranged in an array. The waveguide is disposed on the photodetector and includes a plurality of gratings, a plurality of optical channels, and a plurality of light-deflection elements. The gratings are respectively adapted to collect light beams incident on the waveguide at different angles. The optical channels are adapted to propagate the light beams collected by the gratings. The light-deflection elements are disposed on transmission paths of the light beams propagating in the optical channels and are located above the photosensitive regions. The light-deflection elements are adapted to propagate the light beams propagating in the optical channels to the photosensitive regions. An optical transceiver is also provided.

Abstract: A three-dimensional display module includes a substrate, a display layer, a first electrode layer, a liquid-crystal layer, a second electrode layer, and a drive unit. The substrate has first electrodes and second electrodes. The display layer is disposed on the substrate and includes light-emitting elements. The first electrode layer is disposed on the display layer. The liquid-crystal layer is disposed on the display layer. The second electrode layer is disposed on the liquid-crystal layer. The drive unit drives the first electrodes and the first electrode layer to supply power to the light-emitting elements, such that the light-emitting elements generate light passing through the liquid-crystal layer to form a display image. The drive unit drives the second electrodes and the second electrode layer to produce an electric field on the liquid-crystal layer to change focal length of the liquid-crystal layer so as to control depth of field of the display image.

Abstract: A biometric device includes a substrate, an image sensor, at least one infrared light emitting diode (IR LED), a supporting structure and an optical layer. The image sensor is disposed on the substrate. The at least one IR LED is disposed on the substrate. The supporting structure is disposed on the substrate and located between the image sensor and the at least one infrared light emitting diode. The optical layer is disposed on the supporting structure, covers the image sensor, and includes a coded pattern.

Abstract: A display pixel suitable for being arranged on a carrier is provided. The display pixel includes a plurality of light-emitting diode chips. The light-emitting diode chips are disposed on and electrically connected to the carrier. Each of the light-emitting diode chips respectively serves as a sub-pixel and includes a semiconductor device layer, and the semiconductor device layer includes a display light-emitting mesa and at least one redundant light-emitting mesa. During a period of driving each of the light-emitting diode chips, one of the display light-emitting mesa and the at least one redundant light-emitting mesa in each of the light-emitting diode chips is capable of emitting light. A display panel including a plurality of the display pixels mentioned above is also provided.

Abstract: A picking-up and placing process for electronic devices includes: forming a plurality of electronic devices arranged in an array on a carrier, wherein a first conductive layer having a conductive pattern is disposed between each of the electronic devices and the carrier, and a width of the electronic device is greater than that of the corresponding conductive pattern; selectively picking-up parts of the electronic devices and corresponding first conductive layers from the carrier via a picking-up and placing module; and placing the parts of the electronic devices and the corresponding first conductive layers on a target substrate by the picking-up and placing module. An electronic module is further provided.

Abstract: A driving method of a light emitting device including visible light emitting elements is provided. In a first visible light communication mode, a first portion of the visible light emitting elements is driven and a second portion of the visible light emitting elements is idled for the first portion of the visible light emitting elements having a first current density. In a second visible light communication mode, each of the visible light emitting elements is driven so as to have a second current density. An illumination brightness difference of the light emitting device between the first visible light communication mode and the second visible light communication mode is smaller than 15%.