Abstract: Among other things, techniques and systems are provided for activating a memory cell of a memory arrangement in preparation for at least one of a read operation or write operation. The memory arrangement comprises a word-line driver comprising at least a first input terminal and a second input terminal. The first input terminal is operably coupled to a first decoder and the second input terminal is operably coupled to a second decoder. When the word-line driver senses a first voltage at the first input terminal and a second voltage at the second input terminal, the word-line driver outputs a gate voltage signal which activates the memory cell.

Abstract: A circuit includes a first data line, a second data line, a reference node, and a memory cell. The reference node is configured to have a reference voltage level corresponding to a first logical value. The memory cell includes a data node, a first transistor and a second transistor connected in series between the first data line and the reference node, and a third transistor between the data node and the second data line. A gate of the first transistor is coupled to the data node, and the first transistor is configured to be turned off when the gate of the first transistor has a voltage level corresponding to the first logical value. The third transistor is configured to be turned off when a gate of the third transistor has a voltage level corresponding to a second logical value different from the first logical value.

Abstract: A three dimensional dual-port bit cell generally comprises a first portion disposed on a first tier, wherein the first portion includes a plurality of port elements. The dual-port bit cell also includes a second portion disposed on a second tier that is vertically stacked with respect to the first tier using at least one via, wherein the second portion includes a latch.

Abstract: A three-port, three-dimensional bit cell generally comprises a read portion of a cell disposed on a first tier. The read portion comprises a plurality of read port elements. The three-port bit cell further comprises a write portion of the cell disposed on a second tier that is vertically stacked with respect to the first tier. The first and second tiers are coupled using at least one via. The write portion comprises a plurality of write port elements.

Abstract: One or more techniques or systems for boosting a read word line (RWL) or a write word line (WWL) of a two port synchronous random access memory (SRAM) bit cell array are provided herein. In some embodiments, a boosted control block is configured to generate a boosted word line signal configured to operate a RWL, a WWL, or a read write word line (RWWL). In some embodiments, the boosted word line signal includes a first stage and a second stage. For example, the first stage is associated with a first stage voltage level at a positive supply voltage (Vdd) voltage level and the second stage is associated with a second stage voltage level above the Vdd voltage level. In this manner, a read or write operation is boosted for an SRAM bit cell, because the second stage boosts a corresponding transistor in the SRAM bit cell, for example.

Abstract: A static random access memory (SRAM) including a bit cell, wherein the bit cell includes at least two p-type pass gates. The SRAM further includes a bit line connected to the bit cell, and a bit line bar connected to the bit cell. The SRAM further includes a pre-discharge circuit connected to the bit line and to the bit line bar, wherein the pre-discharge circuit includes at least two n-type transistors. The SRAM further includes cross-coupled transistors connected to the bit line and to the bit line bar, wherein each transistor of the cross-coupled transistors is an n-type transistor. The SRAM further includes a write multiplexer connected to the bit line and to the bit line bar, wherein the write multiplexer includes two p-type transistors.

Abstract: A layout design usable for manufacturing a memory cell includes a first and second active area layout pattern associated with forming a first and second active area, an isolation region outside the first and second active area, a first polysilicon layout pattern associated with forming a first polysilicon structure, a second polysilicon layout pattern associated with forming a second polysilicon structure, a first interconnection layout pattern associated with forming a first interconnection structure, and a second interconnection layout pattern associated with forming a second interconnection structure. The first active area does not overlap the second active area. The first polysilicon layout pattern overlaps the first active area layout pattern. The second polysilicon layout pattern overlaps the first active area layout pattern and the second active area layout pattern. The first interconnection layout pattern overlaps the second active area layout pattern.

Abstract: A three dimensional dual-port bit cell generally comprises a first portion of a latch disposed on a first tier, wherein the first portion includes a plurality of first port elements. A second portion of the latch is disposed on a second tier that is vertically stacked with respect to the first tier using at least one via, wherein the second portion includes a plurality of second port elements.

Abstract: A static random access memory (SRAM) includes a first port word line, a second port word line, a first port bit line and a first port complementary bit line, a second port bit line and second port complementary bit line, and a memory cell having a data node coupled to the first and second port bit lines and a complementary data node coupled to the first and second port complementary bit lines. The first and second port word lines control access to the dual port memory cell. A circuit couples the second port bit line to a high voltage supply node during a write logic high operation to the data node through the first port bit line and couple the second port complementary bit line to the high voltage supply node during a write logic high operation to the complementary data node through the first port complementary bit line.

Abstract: A static random access memory (SRAM) that includes a memory cell comprising at least two p-type pass gates. The SRAM also includes a first data line connected to the memory cell, a second data line connected to the memory cell and a voltage control unit connected to the first data line, wherein the voltage control unit is configured to control the memory cell.

Abstract: A semiconductor memory includes a read port array disposed on a first layer of a three-dimensional integrated circuit and a bit cell array disposed on a second layer of the three-dimensional integrated circuit. The second layer being vertically positioned above or below the first layer. At least one bit cell of the bit cell array is coupled to at least one read port cell of the read port array by a via extending from the first layer to the second layer.

Abstract: Some embodiments relate to a system that pre-colors word lines and control lines within a memory cell to avoid timing delays that result from processing variations introduced through multiple patterning lithography processes. The system has a memory element that stores a graphical IC layout with a memory circuit having layout features including a plurality of word lines and a plurality of Y-control lines. A pre-coloring element pre-colors one or more of the plurality of word lines and Y-control lines, to indicate that pre-colored word lines and Y-control lines are to be formed on a same mask of a multiple mask set used for a multiple patterning lithography process. A decomposition element assigns different colors to uncolored layout features of the memory circuit, to indicate that different colored memory features are to be formed on different masks of the multiple mask set.

Abstract: A memory device includes a memory cell electrically connected to a power line and a power supply unit configured to control a voltage level on the power line. The power supply unit receives a control signal corresponding to a write cycle of the memory cell and, responsive to a first state of the control signal, outputs a first voltage level on the power line. Responsive to a second state of the control signal, the power supply unit outputs a second voltage level on the power line, the second voltage level having a magnitude less than a magnitude of the first voltage level.

Abstract: A memory array includes a first memory cell and a second memory cell aligned along a column direction. Each of the first memory cell and the second memory cell includes a pair of cross-coupled inverters, a first switch on a first side, along the column direction, of the pair of cross-coupled inverters, a second switch aligned with the first switch along the column direction, on a second side of the pair of cross-coupled inverters opposing to the first side, a third switch on the first side of the pair of cross-coupled inverters, and a fourth switch aligned with the third switch along the column direction, on the second side of the pair of cross-coupled inverters. The memory array also includes a first data line, a first complementary data line, a second data line and a second complementary data line.

Abstract: A three dimensional dual-port bit cell generally comprises a first portion disposed on a first tier, wherein the first portion includes a plurality of port elements. The dual-port bit cell also includes a second portion disposed on a second tier that is vertically stacked with respect to the first tier using at least one via, wherein the second portion includes a latch.

Abstract: Among other things, techniques and systems are provided for activating a memory cell of a memory arrangement in preparation for at least one of a read operation or write operation. The memory arrangement comprises a word-line driver comprising at least a first input terminal and a second input terminal. The first input terminal is operably coupled to a first decoder and the second input terminal is operably coupled to a second decoder. When the word-line driver senses a first voltage at the first input terminal and a second voltage at the second input terminal, the word-line driver outputs a gate voltage signal which activates the memory cell.

Abstract: A memory circuit includes a plurality of memory cells arranged into columns and one or more pairs of adjacent rows and one or more first word lines. Each memory cell of the plurality of memory cells includes a data node, a first access node, and a first pass gate coupled to the first access node and configured to selectively alter a voltage level at the first access node according to a voltage level at the data node if the first pass gate is turned on. A word line of the one or more first word lines is coupled with the first pass gates of a pair of the one or more pairs of adjacent rows, and the first pass gates of the pair of the one or more pairs of adjacent rows are configured to be selectively turned on responsive to a voltage level at the word line.

Abstract: Some aspects of the present disclosure a method. In this method, a wordline voltage is provided to a wordline, which is coupled to a plurality of memory cells. A boost enable signal is provided. The state of the boost enable signal is indicative of whether the wordline voltage at a predetermined position on the wordline has reached a non-zero, predetermined wordline voltage. The wordline voltage is selectively boosted to a boosted wordline voltage level based on the boost enable signal.

Abstract: One or more techniques or systems for boosting a read word line (RWL) or a write word line (WWL) of a two port synchronous random access memory (SRAM) bit cell array are provided herein. In some embodiments, a boosted control block is configured to generate a boosted word line signal configured to operate a RWL, a WWL, or a read write word line (RWWL). In some embodiments, the boosted word line signal includes a first stage and a second stage. For example, the first stage is associated with a first stage voltage level at a positive supply voltage (Vdd) voltage level and the second stage is associated with a second stage voltage level above the Vdd voltage level. In this manner, a read or write operation is boosted for an SRAM bit cell, because the second stage boosts a corresponding transistor in the SRAM bit cell, for example.

Abstract: A system and method for a distributed metal routing is disclosed. An embodiment comprises a metal_0 layer with a metal_1 layer overlying the metal_0 layer. The metal_1 layer comprises separate parallel lines, with lines having different signals being distributed across the metal_1 layer. Such a layout decreases the parasitic resistance within the metal_0 layer as it decreases the distance current travels. Additionally, the distributed layout in metal_1 allows connections to be made to a metal_2 layer without the need for a hammer head connection of vias.