Abstract: A semiconductor memory includes first and second memory storage latches each including first and second ports. A first pair of bit lines is coupled to the first ports, and a second pair of bit lines is coupled to the second ports. The first and second pairs of bit lines are twisted between the first and second memory storage latches. A first sense amplifier is coupled to the first pair of bit lines for outputting data, and a second sense amplifier is coupled to the second pair of bit lines for outputting an intermediate data signal. Output logic circuitry is coupled to an output of the second sense amplifier and is configured to output data based on the intermediate data signal and a control signal that identifies if the data is being read from the first memory storage latch or from the second memory storage latch.

Abstract: A word line driver includes an active area having a length that extends in a first direction over a semiconductor substrate. A plurality of fingers formed over an upper surface of the active area. Each of the plurality of fingers has a length that extends in a second direction and forms a MOS transistor with a portion of the active area. A first dummy structure is disposed between an outer one of the plurality of fingers and an edge of the semiconductor substrate. The first dummy structure includes a portion that is at least partially disposed over a portion of the active area.

Abstract: A memory array including at least one cross-latched pair of transistors for storing data. The memory array further includes a first power line for supplying a first reference voltage and a second power line for supplying a second reference voltage. The memory array further includes a first switch having a first output coupled with the at least one cross-latched pair of transistors for selectively connecting the at least one cross-latched pair of transistors to the first power line. The memory array further includes a second switch having a second output coupled with the at least one cross-latched pair of transistors for selectively connecting the at least one cross-latched pair of transistors to the second power line. The first output is coupled to the second output.

Abstract: Some embodiments relate to a method for pre-coloring data within an integrated chip layout to avoid overlay errors that result from mask misalignment during multiple patterning lithography. The method may be performed by generating a graphical IC layout file containing an integrated chip layout having a plurality of IC shapes. The IC shapes within the graphical IC layout file are assigned a color during decomposition. The IC shapes are further pre-colored in a manner that deliberately assigns the pre-colored data to a same mask. During mask building data associated with IC shapes that have been pre-colored is automatically sent to a same mask, regardless of the colors that are assigned to the shapes. Therefore, the pre-colored shapes are not assigned to a masked based upon a decomposition, but rather based upon the pre-coloring. By assigning IC shapes to a same mask through pre-coloring, overlay errors can be reduced.

Abstract: A semiconductor memory includes a bit cell having first and inverters forming a latch. First and second transistors are respectively coupled to first and second storage nodes of the latch and to first and second write bit lines. Each of the first and second transistors has a respective gate coupled to a first node. Third and fourth transistors are coupled together in series at the first node and are disposed between a write word line and a first voltage source. Each of the first and second transistors has a respective gate coupled to a first control line. A fifth transistor has a source coupled to a second voltage source, a drain coupled to at least one of the inverters of the latch, and a gate coupled to the first node. A read port is coupled to a first read bit line and to the second storage node of the latch.

Abstract: In an embodiment related to a sense amplifier, the sense amplifier includes a pair of transistors (e.g., transistors P2 and P3) that, when appropriate, enables data on input lines DL and DLB to be preset directly to the internal nodes (e.g., nodes S and SB) of the sense amplifier, from which the data can be read out. In addition, this pair of transistors P2 and P3 also allows the internal nodes S and SB to share the pre-charge mechanisms of lines DL and DLB.

Abstract: A circuit includes a first node, a second node, a memory cell, a first data line, a second data line, and a write driver. The memory cell is coupled to the first node and the second node and powered by a first voltage at the first node and a second voltage at the second node. The first data line and the second data line are coupled to the memory cell. The write driver has a third node carrying a third voltage less than the first voltage during a write operation. The write deriver is coupled to the first data line and the second data line and configured to, during a write operation, selectively coupling one of the first data line and the second data line to the third node and coupling the other one of the first data line and the second data line to the first node.

Abstract: Some embodiments relate to a method of pre-coloring word lines and control lines within an SRAM integrated chip design to avoid timing delays that result from processing variations introduced through multiple patterning lithography processes. The method is performed by generating a graphical IC layout file having an SRAM circuit with a plurality of word lines and Y-control lines. The word lines and Y-control lines are assigned a color during decomposition. The word lines and Y-control lines are further pre-colored in a manner that deliberately assigns the pre-colored data to a same mask. Therefore, during mask building, data associated with pre-colored word and Y-control lines is sent to a same mask, regardless of the colors that are assigned to the data. By assigning word and Y-control lines to a same mask through pre-coloring, processing variations between the word and Y-control lines are minimized, thereby mitigating timing variations in an SRAM circuit.

Abstract: Some embodiments relate to a method for pre-coloring data within an integrated chip layout to avoid overlay errors that result from mask misalignment during multiple patterning lithography. The method may be performed by generating a graphical IC layout file containing an integrated chip layout having a plurality of IC shapes. The IC shapes within the graphical IC layout file are assigned a color during decomposition. The IC shapes are further pre-colored in a manner that deliberately assigns the pre-colored data to a same mask. During mask building data associated with IC shapes that have been pre-colored is automatically sent to a same mask, regardless of the colors that are assigned to the shapes. Therefore, the pre-colored shapes are not assigned to a masked based upon a decomposition, but rather based upon the pre-coloring. By assigning IC shapes to a same mask through pre-coloring, overlay errors can be reduced.

Abstract: A memory cell includes a first, second, and third columns of devices. The first column of devices includes a first pull-down transistor, a second pull-down transistor, a first switch, and a second switch. The second column of devices includes a third pull-down transistor, a fourth pull-down transistor, a third switch, and a fourth switch. The third column of devices includes a first pull-up transistor, and a second pull-up transistor. The first pull-up transistor, the first pull-down transistor, and the third pull-down transistor are connected as a first inverter, and the second pull-up transistor, the second pull-down transistor, and the fourth pull-down transistor are connected as a second inverter. The first inverter and the second inverter are cross-coupled. The first switch, the second switch, the third switch, and the fourth switch are coupled with output terminals of the first and second inverters.

Abstract: A method of testing a semiconductor memory includes performing a first test of a first type prior to packaging the semiconductor memory. The first test of the first type includes generating a first plurality of addresses, decoding the first plurality of addresses to generate a second plurality of decoded addresses at a first decoder, and activating one of a plurality of rows or a plurality of columns of the semiconductor memory based on the second plurality of decoded addresses. The semiconductor memory is packaged after performing the first test of the first type.

Abstract: A circuit includes a first node, a second node, a memory cell, a first data line, a second data line, and a write driver. The memory cell is coupled to the first node and the second node and powered by a first voltage at the first node and a second voltage at the second node. The first data line and the second data line are coupled to the memory cell. The write driver has a third node carrying a third voltage less than the first voltage during a write operation. The write deriver is coupled to the first data line and the second data line and configured to, during a write operation, selectively coupling one of the first data line and the second data line to the third node and coupling the other one of the first data line and the second data line to the first node.

Abstract: A delay circuit includes an input port, an output port, a first delay circuit block, a second delay circuit block, and an inverter module. The first delay circuit block is coupled to the input port and configured to generate an intermediate signal by applying a first delay to an input signal. The inverter module has an input terminal and an output terminal. The input terminal of the inverter module is coupled to the first delay circuit block, and the inverter module is configured to generate an inverted intermediate signal at the output terminal. The second delay circuit block is coupled to the output terminal of the inverter module and configured to generate a delayed signal by applying a second delay to the inverted intermediate signal.

Abstract: Apparatus and methods for providing SRAM timing tracking cell circuits are disclosed. In an embodiment, an apparatus comprises an SRAM array comprising static random access memory cells arranged in rows and columns; a plurality of word lines each coupled to memory cells along one of the rows; a clock generation circuit for outputting clock signals; a word line generation circuit for generating a pulse on the plurality of word lines responsive to one of the clock signals and for ending the pulse responsive to one of the clock signals; and a tracking cell for receiving a clock signal and for outputting a word line pulse end signal to the clock generation circuit, following an SRAM tracking time; wherein the tracking cell further comprises SRAM tracking circuits positioned in the SRAM array and coupled in series to provide a signal indicating the SRAM tracking time. Methods for SRAM timing are disclosed.

Abstract: A semiconductor memory includes a memory array having at least one bit line, a tracking bit line, and a global tracking circuit. The tracking bit line is configured to emulate a voltage transition of the at least one bit line. The global tracking circuit is configured to generate a timing signal for generating a negative voltage with respect to ground on the at least one bit line of the memory array.

Abstract: A method of forming integrated circuits includes forming a mask layer over a gate electrode line, wherein the gate electrode line is over a well region of a semiconductor substrate; forming an opening in the mask layer, wherein a portion of the gate electrode line and a well pickup region of the well region are exposed through the opening; and removing the portion of the gate electrode line through the opening.

Abstract: A semiconductor memory includes first and second word lines. A first bit cell of a first type is coupled to a first one of a plurality of bit lines and has a first layout in which the first bit cell of the first type is coupled to the first word line with a first number of vias and to the second word line with a second number of vias. A first bit cell of a second type is coupled to a second one of the plurality of bit lines and has a second layout in which the first bit cell of the second type is coupled to the first word line with a third number of vias and to the second word line with a fourth number of vias. A load on the first word line is approximately equal to a load on the second word line.

Abstract: A word-line driving circuit for driving a word-line in a memory array includes a NAND circuit having a pair of address inputs and an output, an output inverter circuit having an inverter power supply node, an input coupled to the output of the NAND circuit and an output for providing a word line signal, a power gate coupled between a first power supply node and the inverter power supply node, and a control circuit coupled to the power gate. The control circuit controls the power gate to place the word line driver circuit in active or standby mode in response to the output of the NAND circuit.

Abstract: A semiconductor memory bit cell includes an inverter latch including a pair of cross-coupled inverters. A first transistor has a gate coupled to a first control line and a source coupled to the inverter latch, and a second transistor has a gate coupled to a second control line and a drain coupled to the drain of the first transistor at a first node. A third transistor has a source coupled to the first node and a gate coupled to a word line, and a fourth transistor has a gate coupled to a source of the second transistor and to the inverter latch. A fifth transistor has a gate coupled to the word line and a drain coupled to a read bit line.

Abstract: A voltage level shifter having an internal low voltage power supply (VCCL) and an external high voltage power supply (VCCH) includes a first PMOS transistor and a second PMOS transistor each with a source connected to the VCCH, a gate of the first PMOS transistor being coupled to a drain of the second PMOS transistor, and a gate of the second PMOS transistor being coupled to a drain of the first PMOS transistor. The voltage level shifter further includes a first NMOS transistor with a source connected to a ground (VSS) and a gate connected to a first signal swinging between the VCCL and the VSS, and a first blocking device coupled between the drain of the first PMOS transistor and a drain of the first NMOS transistor, such that the voltage level shifter can operate at a lower VCCL.