Abstract: A circuit includes a first circuit configured to sense a leakage of a first bit line and output a first signal in response, and a second circuit configured to receive the first signal output from the first circuit and in response supply current to a second bit line for maintaining a voltage level of the second bit line.

Abstract: An SRAM differential voltage sensing apparatus is coupled to a memory circuit. The memory circuit comprises a memory bank, a plurality of bit lines, a plurality of data lines coupled to the plurality of bit lines via a plurality of transmission gates and a sense amplifier. When the sense amplifier operates in a characterization mode, the transmission gates and pre-charge circuits are turned off. The differential voltage sensing apparatus applies a characterization signal to the sense amplifier and obtains the parameters of the memory circuit through a trial and error process.

Abstract: A semiconductor memory includes a bit cell having first and inverters forming a latch. First and second transistors are respectively coupled to first and second storage nodes of the latch and to first and second write bit lines. Each of the first and second transistors has a respective gate coupled to a first node. Third and fourth transistors are coupled together in series at the first node and are disposed between a write word line and a first voltage source. Each of the first and second transistors has a respective gate coupled to a first control line. A fifth transistor has a source coupled to a second voltage source, a drain coupled to at least one of the inverters of the latch, and a gate coupled to the first node. A read port is coupled to a first read bit line and to the second storage node of the latch.

Abstract: A multiple finger structure comprises a plurality of active regions placed between a pair of dummy POLY lines. The active regions comprise a plurality of multiple fingered NMOS transistors, which are part of a sense amplifier of an SRAM memory circuit. The drain and source of each multiple fingered NMOS transistor have an SiP/SiC epitaxial growth region. The active regions extend and overlap with the dummy POLY lines. The overlap between the active regions and the dummy POLY lines helps to reduce edge imperfection at the edge of the active regions.

Abstract: A voltage level shifter having an internal low voltage power supply (VCCL) and an external high voltage power supply (VCCH) includes a first PMOS transistor and a second PMOS transistor each with a source connected to the VCCH, a gate of the first PMOS transistor being coupled to a drain of the second PMOS transistor, and a gate of the second PMOS transistor being coupled to a drain of the first PMOS transistor. The voltage level shifter further includes a first NMOS transistor with a source connected to a ground (VSS) and a gate connected to a first signal swinging between the VCCL and the VSS, and a first blocking device coupled between the drain of the first PMOS transistor and a drain of the first NMOS transistor, such that the voltage level shifter can operate at a lower VCCL.

Abstract: An integrated circuit includes at least one memory array for storing data. A first switch is coupled with the memory array. A first power line is coupled with the first switch. The first power line is operable to supply a first power voltage. A second switch is coupled with the memory array. A second power line is coupled with the second switch. The second power line is operable to supply a second power voltage for retaining the data during a retention mode. A third power line is coupled with the memory array. The third power line is capable of providing a third power voltage.

Abstract: Some embodiments regard a method comprising: during a leakage sampling phase, recognizing a voltage level dropped due to a leakage current associated with a signal linestoring the voltage level; and during a reading phase, using the voltage level to provide an amount of compensation current to the signal line.

Abstract: A method and layout for forming word line decoder devices and other devices having word line decoder cells provides for forming metal interconnect layers using non-DPL photolithography operations and provides for stitching distally disposed transistors using a lower or intermediate metal layer or a subjacent conductive material. The transistors may be disposed in or adjacent longitudinally arranged word line decoder or other cells and the conductive coupling using the metal or conductive material lowers gate resistance between transistors and avoids RC signal delays.

Abstract: A method of forming integrated circuits includes forming a mask layer over a gate electrode line, wherein the gate electrode line is over a well region of a semiconductor substrate; forming an opening in the mask layer, wherein a portion of the gate electrode line and a well pickup region of the well region are exposed through the opening; and removing the portion of the gate electrode line through the opening.

Abstract: A level shifter includes first and second NMOS transistors with gates connected to inverted circuit and circuit inputs, respectively, sources connected to the ground, and drains connected to circuit and inverted circuit outputs, respectively. First and second PMOS transistors have their gates connected to the inverted circuit and circuit outputs, respectively, and sources connected to the high voltage supply. A third PMOS transistor of the multiple independent gate type has its source connected to the drain of the first PMOS transistor, drain and back-gate connected to the circuit output, and front-gate connected to the inverted circuit input. A fourth PMOS transistor of the multiple independent gate type has its source connected to the drain of the second PMOS transistor, drain and back-gate connected to the inverted circuit output, and front-gate connected to the circuit input.

Abstract: Apparatus and methods for providing SRAM timing tracking cell circuits are disclosed. In an embodiment, an apparatus comprises an SRAM array comprising static random access memory cells arranged in rows and columns; a plurality of word lines each coupled to memory cells along one of the rows; a clock generation circuit for outputting clock signals; a word line generation circuit for generating a pulse on the plurality of word lines responsive to one of the clock signals and for ending the pulse responsive to one of the clock signals; and a tracking cell for receiving a clock signal and for outputting a word line pulse end signal to the clock generation circuit, following an SRAM tracking time; wherein the tracking cell further comprises SRAM tracking circuits positioned in the SRAM array and coupled in series to provide a signal indicating the SRAM tracking time. Methods for SRAM timing are disclosed.

Abstract: A semiconductor memory bit cell includes an inverter latch including a pair of cross-coupled inverters. A first transistor has a gate coupled to a first control line and a source coupled to the inverter latch, and a second transistor has a gate coupled to a second control line and a drain coupled to the drain of the first transistor at a first node. A third transistor has a source coupled to the first node and a gate coupled to a word line, and a fourth transistor has a gate coupled to a source of the second transistor and to the inverter latch. A fifth transistor has a gate coupled to the word line and a drain coupled to a read bit line.

Abstract: A system and method for a distributed metal routing is disclosed. An embodiment comprises a metal_0 layer with a metal_1 layer overlying the metal_0 layer. The metal_1 layer comprises separate parallel lines, with lines having different signals being distributed across the metal_1 layer. Such a layout decreases the parasitic resistance within the metal_0 layer as it decreases the distance current travels. Additionally, the distributed layout in metal_1 allows connections to be made to a metal_2 layer without the need for a hammer head connection of vias.

Abstract: An integrated circuit includes at least one memory array for storing data. A first switch is coupled with the memory array. A first power line is coupled with the first switch. The first power line is operable to supply a first power voltage. A second switch is coupled with the memory array. A second power line is coupled with the second switch. The second power line is operable to supply a second power voltage for retaining the data during a retention mode. A third power line is coupled with the memory array. The third power line is capable of providing a third power voltage.

Abstract: An integrated circuit structure includes a static random access memory (SRAM) cell. The SRAM cell includes a pull-up transistor and a pull-down transistor forming an inverter with the pull-up transistor. The pull-down transistor includes a front gate connected to a gate of the pull-up transistor, and a back-gate decoupled from the front gate.

Abstract: An integrated circuit includes at least one memory array for storing data. A first switch is coupled with the memory array. A first power line is coupled with the first switch. The first power line is operable to supply a first power voltage. A second switch is coupled with the memory array. A second power line is coupled with the second switch. The second power line is operable to supply a second power voltage for retaining the data during a retention mode. A third power line is coupled with the memory array. The third power line is capable of providing a third power voltage.

Abstract: A level shifter includes first and second NMOS transistors with gates connected to inverted circuit and circuit inputs, respectively, sources connected to the ground, and drains connected to circuit and inverted circuit outputs, respectively. First and second PMOS transistors have their gates connected to the inverted circuit and circuit outputs, respectively, and sources connected to the high voltage supply. A third PMOS transistor of the multiple independent gate type has its source connected to the drain of the first PMOS transistor, drain and back-gate connected to the circuit output, and front-gate connected to the inverted circuit input. A fourth PMOS transistor of the multiple independent gate type has its source connected to the drain of the second PMOS transistor, drain and back-gate connected to the inverted circuit output, and front-gate connected to the circuit input.

Abstract: A semiconductor device comprises first, second, and third. The first conductor is a gate conductor formed above an oxide region over a substrate and having a contact. The second conductor is coupled to the contact and extends across a width of the oxide region. The second conductor has a lower resistance than the gate conductor. The third conductor is a word line conductor. The second conductor is routed to not intersect the word line conductor.

Abstract: A word line driver includes an active area having a length that extends in a first direction over a semiconductor substrate. A plurality of fingers formed over an upper surface of the active area. Each of the plurality of fingers has a length that extends in a second direction and forms a MOS transistor with a portion of the active area. A first dummy structure is disposed between an outer one of the plurality of fingers and an edge of the semiconductor substrate. The first dummy structure includes a portion that is at least partially disposed over a portion of the active area.

Abstract: This invention discloses a static random access memory (SRAM) cell comprising a pair of cross-coupled inverters having a storage node, and a NMOS transistor having a gate terminal, a first and a second source/drain terminal connected to the storage node, a read word-line (RWL) and a read bit-line (RBL), respectively, the RWL and RBL being activated during a read operation and not being activated during any write operation.