Patents by Inventor Yen-Huei Chen

Yen-Huei Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200152242
    Abstract: A device includes a memory array. The memory array includes a first sub-bank, a first strap cell coupled to the first sub-bank, and a first continuous data line. The first continuous data line includes a first portion and a second portion coupled to the first sub-bank via the first strap cell. The first portion of the first continuous data line is disposed above the first strap cell and the second portion of the first continuous data line is disposed above the first portion of the first continuous data line.
    Type: Application
    Filed: January 15, 2020
    Publication date: May 14, 2020
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Jonathan Tsung-Yung CHANG, Cheng-Hung LEE, Chi-Ting CHENG, Hung-Jen LIAO, Jhon-Jhy LIAW, Yen-Huei CHEN
  • Patent number: 10651114
    Abstract: An apparatus and method of three dimensional conductive lines comprising a first memory column segment in a first tier, a second memory column segment in a second tier, and conductive lines connecting the first memory column segment to the second memory column segment. In some embodiments a conductive line is disposed in the first tier on a first side of the memory column and in the second tier on a second side of the memory column.
    Type: Grant
    Filed: December 18, 2018
    Date of Patent: May 12, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chih-Yu Lin, Kao-Cheng Lin, Li-Wen Wang, Yen-Huei Chen
  • Patent number: 10650882
    Abstract: A static random access memory (SRAM) including at least a first memory cell array, a second memory cell array, a first data line connected to the first memory cell array and the second memory cell array, a primary driver circuit connected to the first data line and a supplementary driver circuit connected to the first data line, wherein the supplementary driver circuit is configured to pull a voltage level of the first data line to a first voltage level during a write operation of the SRAM.
    Type: Grant
    Filed: October 15, 2014
    Date of Patent: May 12, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chih-Yu Lin, Wei-Cheng Wu, Kao-Cheng Lin, Yen-Huei Chen
  • Publication number: 20200143875
    Abstract: A semiconductor memory device includes an array of memory cells arranged in a plurality of rows and columns, with each memory cell including a plurality of bit cell transistors. The semiconductor memory device further includes a plurality of write assist circuits, including one or more write assist circuits within each column of the array of memory cells, each write assist circuit configured to provide a core voltage to memory cells within the same column and to reduce the core voltage during a write operation. The array of memory cells and the plurality of write assist circuits have a common semiconductor layout.
    Type: Application
    Filed: January 6, 2020
    Publication date: May 7, 2020
    Inventors: Sahil Preet Singh, Yen-Huei Chen, Hung-Jen Liao
  • Publication number: 20200144268
    Abstract: Some embodiments relate to a memory device including first and second conductive lines extending generally in parallel with one another within over a row of memory cells. A centerline extends generally in parallel with the first and second conductive lines and is spaced between the first and second conductive lines. A first plurality of conductive line segments is over the first conductive line. Conductive line segments of the first plurality of conductive line segments are coupled to different locations on the first conductive line. A second plurality of conductive line segments are disposed over the second conductive line, and are coupled to different locations on the second conductive line.
    Type: Application
    Filed: January 8, 2020
    Publication date: May 7, 2020
    Inventors: Sahil Preet Singh, Yen-Huei Chen
  • Publication number: 20200135288
    Abstract: A memory device is provided. The memory device includes a shift register array having a plurality of shift registers arranged in a matrix of a plurality of rows and a plurality of columns. Each of the plurality of rows comprises a first plurality of shift registers and each of the plurality of columns comprises a second plurality of shift registers. Each of the plurality of rows are associated with a read word line and a write word lines. Each of the plurality of rows are associated with a data input line and a data output line. Each of the plurality of shift arrays comprises a static random access memory.
    Type: Application
    Filed: October 18, 2019
    Publication date: April 30, 2020
    Inventors: Hidehiro Fujiwara, Hsien-Yu Pan, Chih-Yu Lin, Yen-Huei Chen, Hiroki Noguchi, Wei-Chang Zhao
  • Publication number: 20200135268
    Abstract: A memory cell includes a write port and a read port. The write port includes two cross-coupled inverters that form a storage unit. The cross-coupled inverters are connected between a first power source signal line and a second power source signal line. The write port also includes a first local interconnect line in an interconnect layer that is connected to the second power source signal line. The read port includes a transistor that is connected to the storage unit in the write port and to the second power source signal line, and a second local interconnect line in the interconnect layer that is connected to the second power source signal line. The second local interconnect line in the read port is separate from the first local interconnect line in the write port.
    Type: Application
    Filed: October 21, 2019
    Publication date: April 30, 2020
    Inventors: Hidehiro Fujiwara, Hsien-Yu Pan, Chih-Yu Lin, Yen-Huei Chen, Wei-Chang Zhao
  • Patent number: 10636458
    Abstract: A sense amplifier (SA) comprises a semiconductor substrate having an oxide definition (OD) region, a pair of SA sensing devices, a SA enabling device, and a sense amplifier enabling signal (SAE) line for carrying an SAE signal. The pair of SA sensing devices have the same poly gate length Lg as the SA enabling device, and they all share the same OD region. When enabled, the SAE signal turns on the SA enabling device to discharge one of the pair of SA sensing devices for data read from the sense amplifier.
    Type: Grant
    Filed: July 23, 2018
    Date of Patent: April 28, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yen-Huei Chen, Chien Chi Linus Tien, Kao-Cheng Lin, Jung-Hsuan Chen
  • Publication number: 20200105358
    Abstract: A testing circuit for testing a multi-port random access memory includes an input circuit, a first port testing circuit and a second port testing circuit. The input circuit receives a testing clock signal and a test mode enable signal and is configured to provide the testing clock signal according to the test mode enable signal. The first port testing circuit is coupled to the input circuit, and is configured to output a first word line enable signal for a first port of the multi-port random access memory according to the testing clock signal and a first delay signal. The second port testing circuit is coupled to the input circuit, and is configured to output a second word line enable signal for a second port of the multi-port random access memory according to the testing clock signal and a second delay signal. The first word line enable signal and the second word line enable signal are asserted at the same time, and the first word line enable signal is de-asserted before the second word line enable signal.
    Type: Application
    Filed: September 5, 2019
    Publication date: April 2, 2020
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Hidehiro Fujiwara, Yen-Huei Chen
  • Publication number: 20200075092
    Abstract: In some embodiments, a semiconductor memory device includes an array of semiconductor memory cells arranged in rows and columns. The array includes a first segment of memory cells and a second segment of memory cells. A first pair of complementary local bit lines extend over the first segment of memory cells and is coupled to multiple memory cells along a first column within the first segment of memory cells. A second pair of complementary local bit lines extend over the second segment of memory cells and is coupled to multiple memory cells along the first column within the second segment of memory cells. A pair of switches is arranged between the first and second segments of memory cells. The pair of switches is configured to selectively couple the first pair of complementary local bit lines in series with the second pair of complementary local bit lines.
    Type: Application
    Filed: November 7, 2019
    Publication date: March 5, 2020
    Inventors: Mahmut Sinangil, Hidehiro Fujiwara, Hung-Jen Liao, Jonathan Tsung-Yung Chang, Yen-Huei Chen, Sahil Preet Singh
  • Publication number: 20200066333
    Abstract: A memory device includes memory cells and a control circuit. Each memory cell includes a first inverter, a second inverter, a first transistor and a second transistor. The first and second inverters are cross-coupled between a first data node and a second data node. The first transistor has a first control terminal coupled to a wordline, a first connection terminal coupled to a bitline, and a second connection terminal. The second transistor has a second control terminal, a third connection terminal and a fourth connection terminal. The second control terminal is coupled to the first data node. The third connection terminal is coupled to the second connection terminal. The control circuit is coupled to the fourth connection terminal, and is configured to, when the bitline is selected, adjust a voltage level at the fourth connection terminal in response to activation of the wordline.
    Type: Application
    Filed: July 24, 2019
    Publication date: February 27, 2020
    Inventors: HIDEHIRO FUJIWARA, HARUKI MORI, CHIH-YU LIN, YEN-HUEI CHEN
  • Publication number: 20200066332
    Abstract: A memory device includes: a memory cell array having a plurality of memory cells, wherein each of the plurality of memory cells includes a first port; a first control circuit disposed on a first side of the memory cell array and arranged to electrically connect to the plurality of first ports; and a second control circuit disposed on a second side of the memory cell array and arranged to electrically connect to the plurality of first ports; wherein the second side is opposite to the first side of the memory cell array.
    Type: Application
    Filed: July 16, 2019
    Publication date: February 27, 2020
    Inventors: HIDEHIRO FUJIWARA, YEN-HUEI CHEN
  • Patent number: 10559333
    Abstract: A memory macro includes a first memory cell array, first tracking circuit, first pre-charge circuit coupled to a first end of the first tracking bit line and a second pre-charge circuit coupled to a second end of the first tracking bit line. The first tracking circuit includes a first set of memory cells configured as a first set of loading cells responsive to a first set of control signals, a second set of memory cells configured as a first set of pull-down cells responsive to a second set of control signals, and a first tracking bit line. The first set of pull-down cells and first set of loading cells are configured to track a memory cell of the first memory cell array. The first and second pre-charge circuit are configured to charge the first tracking bit line to a voltage level responsive to a third set of control signals.
    Type: Grant
    Filed: May 6, 2019
    Date of Patent: February 11, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chien-Kuo Su, Cheng Hung Lee, Chiting Cheng, Hung-Jen Liao, Jonathan Tsung-Yung Chang, Yen-Huei Chen, Pankaj Aggarwal, Jhon Jhy Liaw
  • Patent number: 10541007
    Abstract: A device includes a memory array. The memory array includes a first sub-bank, a second sub-bank, a strap cell and a continuous data line. The strap cell is arranged between the first sub-bank and the second sub-bank. The continuous data line includes a first portion coupled to the first sub-bank and a second portion disposed across the second sub-bank. The first portion of the continuous data line and the second portion of the continuous data line are disposed at separate layers above the strap cell.
    Type: Grant
    Filed: February 1, 2019
    Date of Patent: January 21, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Jonathan Tsung-Yung Chang, Cheng-Hung Lee, Chi-Ting Cheng, Hung-Jen Liao, Jhon-Jhy Liaw, Yen-Huei Chen
  • Publication number: 20200020390
    Abstract: A static random access memory (SRAM) circuit can group the column bit lines in a memory array into subsets of bit lines, and a y-address signal input is provided for each subset of bit lines. Additionally or alternatively, each row in the array of memory cells is operably connected to multiple word lines.
    Type: Application
    Filed: July 10, 2019
    Publication date: January 16, 2020
    Inventors: Hidehiro Fujiwara, Chun-Jiun Dai, Chih-Yu Lin, Yen-Huei Chen, Hiroki Noguchi
  • Publication number: 20200020383
    Abstract: A semiconductor memory device includes: a local write bit (LWB) line; a local write bit_bar (LWB_bar) line; a global write bit (GWB) line; a global write bit_bar (GWBL_bar) line; a column of segments, each segment including bit cells; each of the bit cells including a latch circuit and first and second pass gates connecting the corresponding LWB and LWB_bar lines to the latch circuit; and a distributed write driving arrangement. The distributed write driving arrangement includes: a global write driver including a first inverter connected between the GWB line and the LWB line, and a second inverter connected between the GWB_bar line and the LWB_bar line; and a local write driver included at an interior of each segment, each local write driver including a third inverter connected between the GWB line and the LWB line; and a fourth inverter connected between the GWB_bar line and the LWB_bar line.
    Type: Application
    Filed: July 3, 2019
    Publication date: January 16, 2020
    Inventors: Hidehiro FUJIWARA, Hung-Jen LIAO, Li-Wen WANG, Jonathan Tsung-Yung CHANG, Yen-Huei CHEN
  • Publication number: 20200020391
    Abstract: A bit line architecture for dual-port static random-access memory (DP SRAM) is provided. An array of memory cells is arranged in rows and columns, and comprises a first subarray and a second subarray. A first pair of complementary bit lines (CBLs) extends along a column, from a first side of the array, and terminates between the first and second subarrays. A second pair of CBLs extends from the first side of the array, along the column, to a second side of the array. The CBLs of the second pair of CBLs have stepped profiles between the first and second subarrays. A third pair of CBLs and a fourth pair of CBLs extend along the column. The first and third pairs of CBLs electrically couple to memory cells in the first subarray, and the second and fourth pairs of CBLs electrically couple to memory cells in the second subarray.
    Type: Application
    Filed: September 25, 2019
    Publication date: January 16, 2020
    Inventors: Sahil Preet Singh, Jung-Hsuan Chen, Yen-Huei Chen, Avinash Chander, Albert Ying
  • Publication number: 20200020699
    Abstract: A memory cell includes a first and second pull up transistor, a first and second pass gate transistor and a metal contact. The first pull up transistor has a first active region extending in a first direction. The first pass gate transistor has a second active region extending in the first direction, and being separated from the first active region in a second direction. The second active region is adjacent to the first active region. The second pass gate transistor is coupled to the second pull up transistor. The metal contact extends in the second direction, and extends from the first active region to the second active region. The metal contact couples drains of the first pull up transistor and the first pass gate transistor. The first and second pass gate transistors and the first and second pull up transistors are part of a four transistor memory cell.
    Type: Application
    Filed: June 28, 2019
    Publication date: January 16, 2020
    Inventors: Hidehiro FUJIWARA, Hung-Jen LIAO, Hsien-Yu PAN, Chih-Yu LIN, Yen-Huei CHEN, Yasutoshi OKUNO
  • Publication number: 20200020392
    Abstract: A bit line architecture for dual-port static random-access memory (DP SRAM) is provided. An array of memory cells is arranged in rows and columns, and comprises a first subarray and a second subarray. A first pair of complementary bit lines (CBLs) extends along a column, from a first side of the array, and terminates between the first and second subarrays. A second pair of CBLs extends from the first side of the array, along the column, to a second side of the array. The CBLs of the second pair of CBLs have stepped profiles between the first and second subarrays. A third pair of CBLs and a fourth pair of CBLs extend along the column. The first and third pairs of CBLs electrically couple to memory cells in the first subarray, and the second and fourth pairs of CBLs electrically couple to memory cells in the second subarray.
    Type: Application
    Filed: September 25, 2019
    Publication date: January 16, 2020
    Inventors: Sahil Preet Singh, Jung-Hsuan Chen, Yen-Huei Chen, Avinash Chander, Albert Ying
  • Publication number: 20200020371
    Abstract: The present disclosure describes various exemplary memory storage devices that can be programmed to bypass one or more memory cells in a bypass mode of operation. The various exemplary memory storage devices can adjust, for example, pull-up or pull-down, the electronic data as the electronic data passes through these exemplary memory storage devices in the bypass mode of operation. In some situations, the various exemplary memory storage devices may introduce an unwanted bias into the electronic data as the electronic data passes through these exemplary memory storage devices in the bypass mode of operation. The various exemplary memory storage devices can pull-down the electronic data and/or pull-up the electronic data as the electronic data is passing through these exemplary memory storage devices in the bypass mode of operation to compensate for this unwanted bias.
    Type: Application
    Filed: July 3, 2019
    Publication date: January 16, 2020
    Applicant: Taiwan Semiconductor Manufacturing Co. Ltd.
    Inventors: Hidehiro FUJIWARA, Yen-Huei CHEN