Abstract: A wear-leveling method for managing flash memory is provided, including an access process to consult a translation table when accessing a data block in the data region, and a reconstruction process to reconstruct the translation table when powering on the flash memory. The translation table is defined to include a plurality of entries, and each entry includes a physical address field and an enduring counter field. The logical address of a data block is used as input to map to the entry in the translation table. The access process, further including a read process and an erase/program process, maps the logical address to the physical address, and uses the enduring counter to determine whether an update is required to avoid the disturbance. The reconstruct process uses the information stored in the spare data region to reconstruct the translation table for the access process to consult during flash memory accesses.

Abstract: A wire grid polarizer with double metal layers for the visible spectrum. Parallel dielectric layers having a period (p) of 10˜250 nm and a trench between adjacent dielectric layers overlie a transparent substrate. A first metal layer having a first thickness (d1) of 30˜150 nm is disposed in the trench. A second metal layer having a second thickness (d2) of 30˜150 nm and a width (w) overlies on the top surface of each dielectric layer. The first and second metal layers are separated by a vertical distance (l) of 10˜100 nm. The first thickness (d1) is the same as the second thickness (d2). A ratio of the width (w) to the period (p) is 25˜75%.

Abstract: A method for forming at least two layers of electrical coils and their supportive resistive layers for a magnetic write head having an ultra-short yoke so that the second and any additional coil layers are formed on flat resistive surfaces to eliminate problems associated with inter- and intra-layer shorting and with shorting between coil and yoke. The resistive layers are formed with flat surfaces and desired apex angles by using a novel two-step photoresist scheme in which a layer of photoresist is first photoexposed and developed, then photoexposed a second time to cure a surface region that will remain flat during a final low temperature curing process.

Abstract: A method for making an optical device comprises steps of: 1) Providing a substrate, a polymerizable liquid crystal material having a plurality of liquid crystal molecules, and a mold having rows of trenches; 2) Imprinting the polymerizable liquid crystal material on said substrate by the mold; 3) Proceeding a cross-linking process to cure the liquid crystal material so as to have long axes of the liquid crystal molecules be aligned along the rows of trenches. The optical device made from the present method conforms to an A-plate type retardation plate. Moreover, the optical device is capable of aligning liquid crystal molecules adjacent to it.

Abstract: A wire grid polarizer with double metal layers for the visible spectrum. Parallel dielectric layers having a period (p) of 10˜250 nm and a trench between adjacent dielectric layers overlie a transparent substrate. A first metal layer having a first thickness (d1) of 30˜150 nm is disposed in the trench. A second metal layer having a second thickness (d2) of 30˜150 nm and a width (w) overlies on the top surface of each dielectric layer. The first and second metal layers are separated by a vertical distance (l) of 10˜100 nm. The first thickness (d1) is the same as the second thickness (d2). A ratio of the width (w) to the period (p) is 25˜75%.

Abstract: A method for forming a plated layer. There is first provided a substrate. There is then formed over the substrate a masking frame employed for masking frame plating a masking frame plated layer within the masking frame, where the masking frame is fabricated to provide an overhang of an upper portion of the masking frame spaced further from the substrate with respect to a lower portion of the masking frame spaced closer to the substrate. Finally, there is then plated the masking frame plated layer within the masking frame. The method is useful for forming masking frame plated magnetic pole tip stack layers with enhanced planarity dimensional control within magnetic transducer elements.

Abstract: The present invention provides a kind of liquid crystal aligning film composition used for liquid crystal display (LCD), in which the liquid crystal aligning film composition used for LCD is a polyimide resin oligomer (A) having the structural formula (I) as shown in the following: wherein m is an interger of 1, 2, and 3, R is selected one of from aromatic and cyclicaliphatic, X is selected from the group containing amide, ester, and ether etc., Y is the group of containing cholesterol structure; this polyimide resin oligomer (A) and the second reagent (B) are mixed together, through an induced process (C), to produce a thin film for aligning liquid crystal molecule.

Abstract: A method for forming at least two layers of electrical coils and their supportive resistive layers for a magnetic write head having an ultra-short yoke so that the second and any additional coil layers are formed on flat resistive surfaces to eliminate problems associated with inter- and intra-layer shorting and with shorting between coil and yoke. The resistive layers are formed with flat surfaces and desired apex angles by using a novel two-step photoresist scheme in which a layer of photoresist is first photoexposed and developed, then photoexposed a second time to cure a surface region that will remain flat during a final low temperature curing process.

Abstract: The present invention provides a kind of liquid crystal aligning film composition used for liquid crystal display (LCD), in which the liquid crystal aligning film composition used for LCD is a polyimide resin oligomer (A) having the structural formula (I) as shown in the following: wherein m is an interger of 1, 2, and 3, R is selected one of from aromatic and cyclicaliphatic, X is selected from the group containing amide, ester, and ether etc., Y is the group of containing cholesterol structure; this polyimide resin oligomer (A) and the second reagent (B) are mixed together, through an induced process (C), to produce a thin film for aligning liquid crystal molecule.

Abstract: The problem of copper corrosion that occurs in the presence of strong alkaline developing solutions during photo rework has been overcome by protecting all exposed copper bearing surfaces from attack. Two ways of achieving this are described. In the first method, benzotriazole (BTA) is added to the developing solution which is then used in the normal way, developing time being unaffected by this modification. In the second method, the surface that is to receive the photoresist is first given a dip in a solution of BTA, following which the photoresist is immediately applied and processing, including proceeds as normal. For both methods the result is the elimination of all copper corrosion during development.

Abstract: The problem of copper corrosion that occurs in the presence of strong alkaline developing solutions during photo rework has been overcome by protecting all exposed copper bearing surfaces from attack. Two ways of achieving this are described. In the first method, benzotriazole (BTA) is added to the developing solution which is then used in the normal way, developing time being unaffected by this modification. In the second method, the surface that is to receive the photoresist is first given a dip in a solution of BTA, following which the photoresist is immediately applied and processing, including development, proceeds as normal. For both methods the result is the elimination of all copper corrosion during development.

Abstract: A method for forming a plated layer. There is first provided a substrate. There is then formed over the substrate a masking frame employed for masking frame plating a masking frame plated layer within the masking frame, where the masking frame is fabricated to provide an overhang of an upper portion of the masking frame spaced further from the substrate with respect to a lower portion of the masking frame spaced closer to the substrate. Finally, there is then plated the masking frame plated layer within the masking frame. The method is useful for forming masking frame plated magnetic pole tip stack layers with enhanced planarity dimensional control within magnetic transducer elements.

Abstract: A method for forming a plated layer. There is first provided a substrate. There is then formed over the substrate a masking frame employed for masking frame plating a masking frame plated layer within the masking frame, where the masking frame is fabricated to provide an overhang of an upper portion of the masking frame spaced further from the substrate with respect to a lower portion of the masking frame spaced closer to the substrate. Finally, there is then plated the masking frame plated layer within the masking frame. The method is useful for forming masking frame plated magnetic pole tip stack layers with enhanced planarity dimensional control within magnetic transducer elements.

Abstract: Disclosed is a solvent soluble polyimide and a method for making thereof, which characterizes by producing a solvent soluble polyimide with low electric conductivity through the polymerization of an anhydride and a diamine under the condition with or without catalyst.

Abstract: The problem of copper corrosion that occurs in the presence of strong alkaline developing solutions during photo rework has been overcome by protecting all exposed copper bearing surfaces from attack. Two ways of achieving this are described. In the first method, benzotriazole (BTA) is added to the developing solution which is then used in the normal way, developing time being unaffected by this modification. In the second method, the surface that is to receive the photoresist is first given a dip in a solution of BTA, following which the photoresist is immediately applied and processing, including development, proceeds as normal. For both methods the result is the elimination of all copper corrosion during development.

Abstract: The problem of copper corrosion that occurs in the presence of strong alkaline developing solutions during photo rework has been overcome by protecting all exposed copper bearing surfaces from attack. Two ways of achieving this are described. In the first method, benzotriazole (BTA) is added to the developing solution which is then used in the normal way, developing time being unaffected by this modification. In the second method, the surface that is to receive the photoresist is first given a dip in a solution of BTA, following which the photoresist is immediately applied and processing, including development, proceeds as normal. For both methods the result is the elimination of all copper corrosion during development.

Abstract: The problem of copper corrosion that occurs in the presence of strong alkaline developing solutions during photo rework has been overcome by protecting all exposed copper bearing surfaces from attack. Two ways of achieving this are described. In the first method, benzotriazole (BTA) is added to the developing solution which is then used in the normal way, developing time being unaffected by this modification. In the second method, the surface that is to receive the photoresist is first given a dip in a solution of BTA, following which the photoresist is immediately applied and processing, including development, proceeds as normal. For both methods the result is the elimination of all copper corrosion during development.

Abstract: The problem of copper corrosion that occurs in the presence of strong alkaline developing solutions during photo rework has been overcome by protecting all exposed copper bearing surfaces from attack. Two ways of achieving this are described. In the first method, benzotriazole (BTA) is added to the developing solution which is then used in the normal way, developing time being unaffected by this modification. In the second method, the surface that is to receive the photoresist is first given a dip in a solution of BTA, following which the photoresist is immediately applied and processing, including development, proceeds as normal. For both methods the result is the elimination of all copper corrosion during development.