Patents by Inventor Yi-Chun Liu

Yi-Chun Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140032813
    Abstract: A method of accessing a non-volatile memory is disclosed. Original bits of data are duplicated on a bit level to generate a plurality of duplicated bits corresponding to each original bit. At least one shielding bit is provided between the duplicated bits corresponding to different original bits. The duplicated bits and the at least one shielding bit are programmed to the non-volatile memory. The original bits are generated or determined according to the duplicated bits.
    Type: Application
    Filed: July 24, 2012
    Publication date: January 30, 2014
    Applicant: SKYMEDI CORPORATION
    Inventors: Yi Chun Liu, Chung-hsun LEE, Ming Hung CHOU
  • Publication number: 20120160551
    Abstract: An embedded structure of circuit board is provided. The embedded structure of the present invention includes a dielectric layer, a pad opening disposed in the dielectric layer, and a via disposed in the pad opening and in the dielectric layer, wherein the outer surface of the dielectric layer has a substantially even surface.
    Type: Application
    Filed: March 7, 2012
    Publication date: June 28, 2012
    Inventors: Yi-Chun Liu, Wei-Ming Cheng, Tsung-Yuan Chen, Shu-Sheng Chiang
  • Patent number: 8191248
    Abstract: An embedded structure of circuit board is provided. The embedded structure of the present invention includes a dielectric layer, a pad opening disposed in the dielectric layer, and a via disposed in the pad opening and in the dielectric layer, wherein the outer surface of the dielectric layer has a substantially even surface.
    Type: Grant
    Filed: September 17, 2008
    Date of Patent: June 5, 2012
    Assignee: Unimicron Technology Corp.
    Inventors: Yi-Chun Liu, Wei-Ming Cheng, Tsung-Yuan Chen, Shu-Sheng Chiang
  • Patent number: 8187478
    Abstract: A fabricating process of a structure with an embedded circuit is described as follows. Firstly, a substrate having an upper surface and a lower surface opposite to the upper surface is provided. Afterward, a dielectric layer is formed on the upper surface of the substrate. Next, a plating-resistant layer is formed on the dielectric layer. Then, the plating-resistant layer and the dielectric layer are patterned for forming an recess pattern on the dielectric layer. Subsequently, a conductive base layer is formed in the recess pattern by using a chemical method, and the plating-resistant layer is exposed by the conductive base layer. After that, the plating-resistant layer is removed.
    Type: Grant
    Filed: September 16, 2008
    Date of Patent: May 29, 2012
    Assignee: Unimicron Technology Corp.
    Inventor: Yi-Chun Liu
  • Publication number: 20120085569
    Abstract: An embedded structure of circuit board is provided. The embedded structure includes a substrate, a first patterned conductive layer disposed on the substrate and selectively exposing the substrate, a first dielectric layer covering the first patterned conductive layer and the substrate, a pad opening disposed in the first dielectric layer, and a via disposed in the pad opening and exposing the first patterned conductive layer, wherein the outer surface of the first dielectric layer has a substantially even surface.
    Type: Application
    Filed: December 13, 2011
    Publication date: April 12, 2012
    Inventors: Yi-Chun Liu, Wei-Ming Cheng, Tsung-Yuan Chen, Shu-Sheng Chiang
  • Patent number: 8132321
    Abstract: An embedded structure of circuit board is provided. The embedded structure includes a substrate, a first patterned conductive layer disposed on the substrate and selectively exposing the substrate, a first dielectric layer covering the first patterned conductive layer and the substrate, a pad opening disposed in the first dielectric layer, and a via disposed in the pad opening and exposing the first patterned conductive layer, wherein the outer surface of the first dielectric layer has a substantially even surface.
    Type: Grant
    Filed: August 13, 2008
    Date of Patent: March 13, 2012
    Assignee: Unimicron Technology Corp.
    Inventors: Yi-Chun Liu, Wei-Ming Cheng, Tsung-Yuan Chen, Shu-Sheng Chiang
  • Publication number: 20120017053
    Abstract: Various embodiments of a nonvolatile memory apparatus are disclosed. In one exemplary embodiment, the nonvolatile memory apparatus may include: a host interface; a memory controller coupled to the host interface; and a memory area including a plurality of chips controlled by the memory controller. The memory controller may be configured to assign logical addresses to the plurality of chips to form a plurality of virtual logical groups, set a plurality of threshold values and a plurality of scan ranges depending on the total erase count (TEC) of each logical group, and perform wear-leveling in stages.
    Type: Application
    Filed: December 8, 2010
    Publication date: January 19, 2012
    Applicant: Hynix Semiconductor Inc.
    Inventors: Wun Mo YANG, Yi Chun Liu
  • Publication number: 20110320910
    Abstract: A storage system is provided. The storage system comprises a storage media, a storage controller and a host. The storage controller is connected to the storage media. The host is connected to the storage controller, and performs a physical resource management algorithm for managing a physical resource of the storage media, so as to output at least a media operation command to the storage controller. The storage controller performs the media operation command to manage the storage media. A storage management method is also provided.
    Type: Application
    Filed: June 29, 2010
    Publication date: December 29, 2011
    Inventors: Yi-Chun Liu, Yun-Tai Kao Yang
  • Publication number: 20110240402
    Abstract: The disclosure provides a unit with a sound isolation/vibration isolation structure, an array employing the same, and a method for fabricating the same. The unit with a sound isolation/vibration isolation structure includes: a hollow frame surrounding an inside space; a film disposed within the inside space, vertically contacting an inside wall of the hollow frame; and a body mass disposed on a top surface of the film. Particularly, the horizontal area of the inside space is larger than the area of the top surface of the film.
    Type: Application
    Filed: August 20, 2010
    Publication date: October 6, 2011
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Jung-Tsung Chou, Ting-Chu Lu, Yu-Tsung Chiu, Horng-Yuan Wen, Hui-Lung Kuo, Ping-Chen Chen, Yi-Chun Liu, Wen-Liang Liu, Sheng-Wen Lin
  • Publication number: 20110143922
    Abstract: A composition with catalyst particles for making a circuit pattern is provided. The composition includes an insulation material and a plurality of catalyst particles. The catalyst particles are distributed in the insulation material and not made of metal. When the composition is bathed in a chemical plating solution, a redox reaction takes place between some of the catalyst particles and the chemical plating solution so as to deposit a conductive pattern on the composition.
    Type: Application
    Filed: August 11, 2010
    Publication date: June 16, 2011
    Inventors: Cheng-Hsien Lee, Yi-Chun Liu
  • Patent number: 7775954
    Abstract: A cutter shifting mechanism includes a main body having a longitudinal cylinder casing and a shaft is located in the longitudinal cylinder casing. An arm is connected to a lower end of the shaft so as to be connected with cutters. A longitudinal pushing device is connected to a top end of the shaft and a gear is rotatably mounted to the shaft. The gear is movable along a longitudinal axis of the shaft. A threaded rod is engaged with the gear and connected with a latitude pushing device. Each of the longitudinal and latitude pushing devices includes a pneumatic cylinder. The mechanism includes simple structure and can be manufactured at low cost. The pneumatic cylinders accurately operate the parts of the mechanism.
    Type: Grant
    Filed: June 25, 2007
    Date of Patent: August 17, 2010
    Inventor: Yi-Chun Liu
  • Patent number: 7750208
    Abstract: The invention provides an anther-specific expression promoter in plant, wherein said promoter is a promoter of Oncidium aureusidin synthase gene OgAS1, and has a sequence as SEQ ID No: 3. The invention provides further a gene expression cassette that comprised a promoter having a DNA sequence as SEQ ID No: 3, and a polynucleotide that encode an open reading frame and is linked to the 3? end of said promoter, wherein said promoter can activate the transcription of said polynucleotide in an organism containing said gene expression cassette. The invention provides also a gene expression vector that contains a promoter having DNA sequence as SEQ ID No: 3. The invention provides further a process for producing a transgenic plant or part of organ, tissue or cell of said transgenic plant containing the above-described gene expression cassette.
    Type: Grant
    Filed: July 9, 2008
    Date of Patent: July 6, 2010
    Assignee: National Taiwan University
    Inventors: Pung-Ling Huang, Yi-Yin Do, Wei-Fen Huang, Yi-Chun Liu
  • Publication number: 20100065324
    Abstract: An embedded structure of circuit board is provided. The embedded structure of the present invention includes a dielectric layer, a pad opening disposed in the dielectric layer, and a via disposed in the pad opening and in the dielectric layer, wherein the outer surface of the dielectric layer has a substantially even surface.
    Type: Application
    Filed: September 17, 2008
    Publication date: March 18, 2010
    Inventors: Yi-Chun Liu, Wei-Ming Cheng, Tsung-Yuan Chen, Shu-Sheng Chiang
  • Publication number: 20100038124
    Abstract: An embedded structure of circuit board is provided. The embedded structure includes a substrate, a first patterned conductive layer disposed on the substrate and selectively exposing the substrate, a first dielectric layer covering the first patterned conductive layer and the substrate, a pad opening disposed in the first dielectric layer, and a via disposed in the pad opening and exposing the first patterned conductive layer, wherein the outer surface of the first dielectric layer has a substantially even surface.
    Type: Application
    Filed: August 13, 2008
    Publication date: February 18, 2010
    Inventors: Yi-Chun Liu, Wei-Ming Cheng, Tsung-Yuan Chen, Shu-Sheng Chiang
  • Publication number: 20100011469
    Abstract: The invention provides an anther-specific expression promoter in plant, wherein said promoter is a promoter of Oncidium aureusidin synthase gene OgAS1, and has a sequence as SEQ ID No: 3. The invention provides further a gene expression cassette that comprised a promoter having a DNA sequence as SEQ ID No: 3, and a polynucleotide that encode an open reading frame and is linked to the 3? end of said promoter, wherein said promoter can activate the transcription of said polynucleotide in an organism containing said gene expression cassette. The invention provides also a gene expression vector that contains a promoter having DNA sequence as SEQ ID No: 3. The invention provides further a process for producing a transgenic plant or part of organ, tissue or cell of said transgenic plant containing the above-described gene expression cassette.
    Type: Application
    Filed: July 9, 2008
    Publication date: January 14, 2010
    Applicant: NATIONAL TAIWAN UNIVERSITY
    Inventors: Pung-Ling HUANG, Yi-Yin DO, Wei-Fen HUANG, Yi-Chun LIU
  • Publication number: 20090301997
    Abstract: A fabricating process of a structure with an embedded circuit is described as follows. Firstly, a substrate having an upper surface and a lower surface opposite to the upper surface is provided. Afterward, a dielectric layer is formed on the upper surface of the substrate. Next, a plating-resistant layer is formed on the dielectric layer. Then, the plating-resistant layer and the dielectric layer are patterned for forming an recess pattern on the dielectric layer. Subsequently, a conductive base layer is formed in the recess pattern by using a chemical method, and the plating-resistant layer is exposed by the conductive base layer. After that, the plating-resistant layer is removed.
    Type: Application
    Filed: September 16, 2008
    Publication date: December 10, 2009
    Applicant: UNIMICRON TECHNOLOGY CORP.
    Inventor: Yi-Chun Liu
  • Patent number: 7486371
    Abstract: A method for making an optical device comprises steps of: 1) Providing a substrate, a polymerizable liquid crystal material having a plurality of liquid crystal molecules, and a mold having rows of trenches; 2) Imprinting the polymerizable liquid crystal material on said substrate by the mold; 3) Proceeding a cross-linking process to cure the liquid crystal material so as to have long axes of the liquid crystal molecules be aligned along the rows of trenches. The optical device made from the present method conforms to an A-plate type retardation plate. Moreover, the optical device is capable of aligning liquid crystal molecules adjacent to it.
    Type: Grant
    Filed: February 17, 2005
    Date of Patent: February 3, 2009
    Assignee: Industrial Technology Research Institute
    Inventors: Chih-Ho Chiu, Hui-Lung Kuo, Mei-Chih Peng, Yi-Chun Liu, Pin-Chen Chen
  • Publication number: 20080317560
    Abstract: A cutter shifting mechanism includes a main body having a longitudinal cylinder casing and a shaft is located in the longitudinal cylinder casing. An arm is connected to a lower end of the shaft so as to be connected with cutters. A longitudinal pushing device is connected to a top end of the shaft and a gear is rotatably mounted to the shaft. The gear is movable along a longitudinal axis of the shaft. A threaded rod is engaged with the gear and connected with a latitude pushing device. Each of the longitudinal and latitude pushing devices includes a pneumatic cylinder. The mechanism includes simple structure and can be manufactured at low cost. The pneumatic cylinders accurately operate the parts of the mechanism.
    Type: Application
    Filed: June 25, 2007
    Publication date: December 25, 2008
    Inventor: Yi-Chun Liu
  • Patent number: 7409490
    Abstract: A wear-leveling method for managing flash memory is provided, including an access process to consult a translation table when accessing a data block in the data region, and a reconstruction process to reconstruct the translation table when powering on the flash memory. The translation table is defined to include a plurality of entries, and each entry includes a physical address field and an enduring counter field. The logical address of a data block is used as input to map to the entry in the translation table. The access process, further including a read process and an erase/program process, maps the logical address to the physical address, and uses the enduring counter to determine whether an update is required to avoid the disturbance. The reconstruct process uses the information stored in the spare data region to reconstruct the translation table for the access process to consult during flash memory accesses.
    Type: Grant
    Filed: April 15, 2006
    Date of Patent: August 5, 2008
    Inventor: Yi-Chun Liu
  • Publication number: 20080016266
    Abstract: A smart storage device that can be either used in conjunction with a conventional storage device or integrated into a conventional storage device to become a smart storage device is disclosed. The smart storage device of the present invention includes a transmission interface, a processor, a control interface, a storage medium, an input interface, an input device, a response interface, and a response device. The processor further includes a memory, a data transmission and medium control module, and a monitor, analysis and response (MAR) module. The MAR module is for monitoring and analyzing the operation requests and responding accordingly. When used in conjunction with a conventional storage device, the external smart storage device includes a host-end transmission interface, a processor, a device-end transmission interface, an input device, an input device, a response interface, and a response device.
    Type: Application
    Filed: July 14, 2006
    Publication date: January 17, 2008
    Inventor: Yi-Chun Liu