Abstract: A wearable heart sound detection device includes an acoustic sensing device for collecting heart sound signals of user's body. A wireless transmission device is connected to transmit and receive data, an e-SIM embedded in the wearable heart sound detection device, wherein said acoustic sensing device includes a capacitive sound sensor, a piezoelectric sound sensor or the combination thereof. A circuit assembly electrically is connected with the capacitive sound sensor or said piezoelectric sound sensor, wherein the capacitive sound sensor and the piezoelectric sound sensor are integrated on a flexible substrate. The e-SIM is compatible with a wireless transmission protocol selected from a group of WiFi, 4G, 5G, 6G or any combination thereof.

Abstract: According to various embodiments, there may be provided an interposer. The interposer including: a substrate; a dielectric layer disposed on the substrate; a via disposed entirely within the dielectric layer; a resistive film layer disposed to line the via; a metal interconnect disposed in the resistive layer lined via; and a plurality of metal lines disposed in the dielectric layer, the plurality of metal lines including a first metal line connected to the metal interconnect, a second metal line connected to the resistive film layer at a first point, and a third metal line connected to the resistive film layer at a second point.

Abstract: The present disclosure relates generally to roofing systems. for example. suitable for covering the roof of a house or other building. The present disclosure relates more particularly to a roofing panel support including a bracket with a support platform configured to receive a roofing panel. a first leg extending rearward from a first side of the support platform, and a second leg extending rearward from a second side of the support platform. A hook for holding the roofing panel is coupled to the bracket and disposed below the support platform. Insulation may surround the hook. Additionally. a conductive malleable strip may be positioned between the bracket and a support structure.

Abstract: Various embodiments of the present disclosure are directed towards a semiconductor structure including a first substrate comprising a first semiconductor material. A first light sensor is disposed within the first substrate. The first light sensor is configured to absorb electromagnetic radiation within a first wavelength range. A second light sensor is disposed within an absorption structure underlying the first substrate. The second light sensor is configured to absorb electromagnetic radiation within a second wavelength range different from the first wavelength range. The absorption structure underlies the first light sensor and comprises a second semiconductor material different from the first semiconductor material.

Abstract: Static state of charge (SOC) correction for a lithium iron phosphate (LFP) battery system of an electrified vehicle includes in response to a power-off of the electrified vehicle, (i) determining an initial SOC of the LFP battery system, (ii) initiating a power-off timer and (iii) initiating a periodic temperature measurement of the LFP battery system, in response to a subsequent power-on of the electrified vehicle, (i) stopping the power-off timer, (ii) determining an average of the periodic temperature measurements of the LFP battery system, and (iii) accessing a calibrated look-up table to determine a self-discharge rate of the LFP battery system based on a value of the power-off timer and the measured temperature of the LFP battery system, and determining a corrected SOC for the LFP battery system by determining an SOC change based on the determined self-discharge rate and subtracting the SOC change from the initial measured SOC.

Abstract: An electronic device such as a head-mounted display device may include an antenna that radiates through a cover. The antenna may have a ground and an antenna resonating element layered onto the cover. The ground may include conductive structures separated from the resonating element by a volume. The device may include a fan that conveys air through a vent in a chassis of the electronic device through a tunnel. The tunnel may be free from conductive material and may extend through the volume of the antenna. The fan may include blades enclosed within metal walls. A conductive mesh may be coupled between the metal walls and may separate the blades from the tunnel. This may serve to extend the volume of the antenna to also include at least some of the volume of the fan, thereby maximizing efficiency bandwidth of the antenna without sacrificing thermal dissipation by the fan.

Abstract: A head-mounted device may have a housing with a cover having three-dimensional curvature. A front-facing display may be mounted to the cover and may display images through the cover. The cover may have a peripheral region laterally surrounding the front-facing display. An antenna may have an antenna resonating element layered onto the cover overlapping the peripheral region. The antenna may be switchable between a first polarization state and a second polarization state. In the first polarization state, the antenna conveys radio-frequency signals having a first polarization with an earbud. In the second polarization state, the antenna conveys radio-frequency signals having a second polarization with the earbud. One or more processors may gather wireless performance metric data from the radio-frequency signals and may adjust the antenna between the polarization states to optimize the wireless performance metric data.

Abstract: A head-mounted device may have a housing with a cover having three-dimensional curvature. A front-facing display may be mounted to the cover and may display images through the cover. The cover may have a peripheral region laterally surrounding the front-facing display. An antenna may have an antenna resonating element layered onto the cover overlapping the peripheral region. The antenna may be switchable between different radiation patterns. A controller may gather wireless performance metric data for each of the radiation patterns. The antenna may be switched to exhibit a radiation pattern that optimizes the wireless performance metric data. This may serve to minimize interference from external devices operating using the same ultra-low-latency audio communications protocol as the antenna.

Abstract: An electronic device such as a head-mounted display device may include an antenna that radiates through a cover. The antenna may have an antenna resonating element layered onto the cover and having a three-dimensional curvature. The antenna resonating element may have an antenna ground. A pressure-activated connector may electrically couple the antenna resonating element to the antenna ground. If desired, the pressure-activated connector may lock the antenna resonating element to the antenna ground. The pressure-activated connector may include a metal finger, a metal spring, a metal ball, a curling metal receptacle, a dimple, a metal screw, a screw receptacle, metal burs, and/or rotational locking structures. The pressure-activated connector may form a robust mechanical connection between the first and second conductors despite the curvature of the antenna resonating element, which minimizes electrical discontinuities that can otherwise deteriorate antenna performance.

Abstract: A manufacturing method for and a structure of a semiconductor structure are provided. The manufacturing method for a semiconductor structure includes the steps as follows. A substrate is provided. A first semiconductor layer and a second semiconductor layer that are sequentially stacked are formed on the substrate. The second semiconductor layer is etched to form active pillars arranged in an array, the active pillar including a first doped region, a channel region, and a second doped region. Word line structures are formed, the word line structures surrounding the channel region. Capacitor structures are formed, the capacitor structures being in contact with and connected to the second doped region. The substrate and the first semiconductor layer are removed to expose bottom surfaces of the active pillars. Bit line structures are formed, the bit line structures being in contact with and connected to the first doped region.

Abstract: An electronic device may have first and second rear-facing displays, a front-facing display, a cover at a front side overlapping the front-facing display, and an antenna that radiates through the cover. The cover may have a three-dimensional curvature. The device may have an inner chassis and an outer chassis. The antenna may include a radiating element and a ground trace on a flexible printed circuit. To maximize wireless performance of the antenna, the ground trace may be electrically coupled to as much conductive material in the vicinity of the antenna as possible. For example, the ground trace may be grounded to conductive structures in the front-facing display via a conductive cavity for the antenna, may be grounded directly to the outer chassis using conductive screws, and/or may be grounded directly to the inner chassis using conductive screws.

Abstract: A method for interaction of a media function in an Internet protocol (IP) multimedia subsystem (IMS) network comprises: sending, by a first network element to a second network element, a media function discovery request message used for querying a target media function; receiving, by the first network element, a media function discovery request response message sent by the second network element, wherein the media function discovery request response message is used for feeding back information of at least one candidate media function instance matching the target media function.

Abstract: Various embodiments of the present disclosure are directed towards an image sensor with a passivation layer for dark current reduction. A device layer overlies a substrate. Further, a cap layer overlies the device layer. The cap and device layers and the substrate are semiconductor materials, and the device layer has a smaller bandgap than the cap layer and the substrate. For example, the cap layer and the substrate may be silicon, whereas the device layer may be or comprise germanium. A photodetector is in the device and cap layers, and the passivation layer overlies the cap layer. The passivation layer comprises a high k dielectric material and induces formation of a dipole moment along a top surface of the cap layer.

Abstract: An electronic device may be provided with wireless communications circuitry and control circuitry. The wireless communications circuitry may include centimeter and millimeter wave transceiver circuitry and a phased antenna array. A dielectric cover may be formed over the phased antenna array. The phased antenna array may transmit and receive wireless radio-frequency signals through the dielectric cover. The dielectric cover may have first and second opposing surfaces. The second surface may face the phased antenna array and may have a curvature. The curvature of the second surface may include one or more recessed regions of the dielectric cover. The one or more recessed regions of the second surface may serve to maximize and broaden the coverage area for the phased antenna array. The first surface may be conformal to other structures in the electronic device.

Abstract: An electronic device may have a cover layer and an antenna. A dielectric adapter may have a first surface coupled to the antenna and a second surface pressed against the cover layer. The cover layer may have a three-dimensional curvature. The second surface may have a curvature that matches the curvature of the cover layer. Biasing structures may exert a biasing force that presses the antenna against the dielectric adapter and that presses the dielectric adapter against the cover layer. The biasing force may be oriented in a direction normal to the cover layer at each point across dielectric adapter. This may serve to ensure that a uniform and reliable impedance transition is provided between the antenna and free space through the cover layer over time, thereby maximizing the efficiency of the antenna.

Abstract: Some embodiments relate to an integrated circuit light sensor device. The integrated circuit light sensor device includes a semiconductor substrate, as well as a plurality of first light-absorption regions and a plurality of second light-absorption regions located in the semiconductor substrate. Each of the first light-absorption regions includes an implantation region of the semiconductor substrate. The implantation region and the semiconductor substrate form at least a portion of a corresponding one of a plurality of first photodetectors for a first light wavelength band. Each of the second light-absorption regions includes a semiconductor material different from the semiconductor substrate. The semiconductor material forms at least a portion of a corresponding one of a plurality of second photodetectors for a second light wavelength band different from the first light wavelength band.

Abstract: Embodiments of the present systems and methods may provide improved capability to predict the risk of recurrence of ductal carcinoma in situ (DCIS) conditions using whole slide image analysis based on machine learning techniques. For example, in an embodiment, a computer-implemented method for determining treatment of a patient may comprise receiving an image of living tissue of a patient, annotating the entire image into tissue structures, extracting texture features from the annotated image, determining a distribution of the extracted texture features relative to tissue conditions, classifying the patient into a risk group based on the distribution, and treating the patient accordingly based on the risk group.

Abstract: Various embodiments of the present disclosure are directed towards an image sensor with a passivation layer for dark current reduction. A device layer overlies a substrate. Further, a cap layer overlies the device layer. The cap and device layers and the substrate are semiconductor materials, and the device layer has a smaller bandgap than the cap layer and the substrate. For example, the cap layer and the substrate may be silicon, whereas the device layer may be or comprise germanium. A photodetector is in the device and cap layers, and the passivation layer overlies the cap layer. The passivation layer comprises a high k dielectric material and induces formation of a dipole moment along a top surface of the cap layer.

Abstract: An electronic device may have first and second rear-facing displays, a front-facing display, a cover at a front side overlapping the front-facing display, and an antenna that radiates through the cover. The antenna may be formed from sheet metal. The antenna may have a resonating element formed from a first portion of the sheet metal and an antenna ground that includes a second portion of the sheet metal separated from the first portion by a cavity. A third portion of the sheet metal may couple the first portion to the second portion and may be folded around the cavity to produce a spring force that presses the first portion against the cover. The first portion and the cover may have the same compound curvature. The second portion may form a conductive cavity for the antenna.

Abstract: An electronic device may have first and second rear-facing displays, a front-facing display, a cover layer at a front side with a central region overlapping the front-facing display and a peripheral region, and wireless circuitry with a transceiver and antennas. The transceiver may convey audio data with left and right earbuds using a non-Bluetooth low-latency-audio communications protocol. The antenna(s) may be mounted at a bottom side of the device overlapping the peripheral region, at a rear side of the device, or may be mounted to a head strap. The antenna(s) may be tilted to optimize field(s) of view, to match polarization of the earbuds, and/or to allow multiple antennas to exhibit orthogonal polarizations. The antennas may include a single antenna that concurrently conveys packets of audio data to both earbuds or may include first and second antennas that concurrently convey audio data to the left and right earbuds.