Patents by Inventor Yi Jiang

Yi Jiang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11752800
    Abstract: A non-pneumatic tire includes a tread layer and a spoke layer including an inner cylinder and several spoke assemblies. The tread layer is annular and has a maximum outer diameter of the non-pneumatic tire and is adapted to be in contact with a ground. The spoke assemblies extend in a radial direction of the non-pneumatic tire and are arranged around an axial core of the non-pneumatic tire. An end of each spoke assembly is connected to the inner cylinder, and another end thereof is connected to the tread layer. Each spoke assembly includes a straight spoke, a bending spoke, and a connecting rib. Each bending spoke includes a first segment and a second segment, which are not connected in a straight line. Each connecting rib has a first end connected to the straight spoke and a second end opposite to the first end and connected to the bending spoke. When the non-pneumatic tire bears a weight and is squeezed, the spoke assemblies do not get in contact with one another.
    Type: Grant
    Filed: August 20, 2020
    Date of Patent: September 12, 2023
    Assignee: KENDA RUBBER IND. CO., LTD.
    Inventors: Chi-Jen Yang, Min-Fan Huang, Jia-Yi Jiang
  • Patent number: 11744085
    Abstract: A semiconductor device includes a first insulating layer; a second insulating layer arranged over the first insulating layer; a memory structure arranged within a memory region and including a resistance changing memory element within the first insulating layer; and a logic structure arranged within a logic region. In the memory region, the first insulating layer may contact the second insulating layer and in the logic region, the semiconductor device may further include a stop layer arranged between the first insulating layer and the second insulating layer.
    Type: Grant
    Filed: September 10, 2020
    Date of Patent: August 29, 2023
    Assignee: GLOBALFOUNDRIES Singapore Pte. Ltd.
    Inventors: Benfu Lin, Yi Jiang, Lup San Leong, Juan Boon Tan
  • Publication number: 20230260815
    Abstract: The present disclosure provides a multi-substrate handling system having an alignment apparatus capable of positioning each of a set of substrates in predetermined orientations for transfer. A buffer chamber is configured to receive and condition the set of substrates which are disposed on a substrate carrier. A first transfer assembly is configured to transfer the set of substrates to and from the buffer chamber and is capable of transferring each of the set of substrates from the alignment apparatus to the carrier in the buffer chamber. The carrier includes a plurality of modules capable of securing the set of substrates. The system includes a second transfer assembly having at least two robots configured to transfer the carrier of the set of substrates between the buffer chamber and a process chamber. The process chamber is capable of processing the set of substrates using different process parameters for each substrate.
    Type: Application
    Filed: June 16, 2021
    Publication date: August 17, 2023
    Inventors: Hsiu-jen WANG, Sin-Yi JIANG, Neng-rui DONG, Shih-Hao KUO, Chia-Hung KAO, Bang-Yu LIU, Hsu-Ming HSU
  • Patent number: 11705148
    Abstract: Technologies are disclosed for improving the efficiency of real-time audio processing, and specifically for improving the efficiency of continuously modifying a real-time audio signal. Efficiency is improved by reducing memory bandwidth requirements and by reducing the amount of processing used to modify the real-time audio signal. In some configurations, memory bandwidth requirements are reduced by selectively transferring active samples in the frequency domain—e.g. avoiding the transfer samples with amplitudes of zero or near-zero. This has particular importance when the specialized hardware retrieves samples from main memory in real-time. In some configurations, the amount of processing needed to modify the audio signal is reduced by omitting operations that do not meaningfully affect the output audio signal. For example, a multiplication of samples may be avoided when at least one of the samples has an amplitude of zero or near-zero.
    Type: Grant
    Filed: October 13, 2021
    Date of Patent: July 18, 2023
    Assignee: MICROSOFT TECHNOLOGY LICENSING, LLC
    Inventors: Ziyad Ibrahim, Laxmi Narsimha Rao Kakulamarri, Andrew Yi Jiang
  • Publication number: 20230191625
    Abstract: A pick-and-place system includes a movement mechanism, an adjustment mechanism, and a clamping mechanism. The adjustment mechanism includes a first coupling component, a second coupling component, and a driving assembly. The first coupling component is mounted on the movement mechanism. The second coupling component is movably disposed on the first coupling component. The driving assembly is configured to be connected to the first coupling component and the second coupling component so as to force the first coupling component and the second coupling component to move relative to each other. The clamping mechanism is mounted on the second coupling component of the adjustment mechanism.
    Type: Application
    Filed: March 14, 2022
    Publication date: June 22, 2023
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Yen-Cheng CHEN, Jun-Yi JIANG, Guan-Wei SU
  • Publication number: 20230189508
    Abstract: Embodiments relate to a method for fabricating a semiconductor structure. The method includes: providing a substrate, where pillars arranged in an array are formed on a surface of the substrate, and bit lines extending along a first direction are formed at bottoms of the pillars; forming, between adjacent two of the pillars, a first groove extending along a second direction; forming an isolation layer on the substrate, where the isolation layer is filled in the first groove and is filled between adjacent two of the bit lines; etching the isolation layer to expose a surface of the pillar, where a first sub isolation layer positioned in the first groove is lower than a second sub isolation layer; forming a word line surrounding a side wall of the pillar, where a surface of the word line is not higher than a surface of the second sub isolation layer; and forming a dielectric layer on the word line.
    Type: Application
    Filed: September 23, 2022
    Publication date: June 15, 2023
    Inventors: Guangsu SHAO, Deyuan XIAO, Yunsong QIU, Yi JIANG
  • Publication number: 20230185506
    Abstract: The method includes: obtaining a changing distance of the retractable display screen in an extending-retracting direction in response to the retractable display screen being extended or retracted; and adjusting a spacing of application icons displayed on a current desktop in the extending-retracting direction according to the changing distance, and/or adjusting a number of the application icons displayed on the current desktop in the extending-retracting direction according to the changing distance.
    Type: Application
    Filed: December 30, 2022
    Publication date: June 15, 2023
    Inventors: Yi JIANG, Biao MA
  • Publication number: 20230173888
    Abstract: The present application discloses an electric vehicle, and a heating cavity assembly of an electric heater of the electric vehicle. The heating cavity assembly includes: an electric heating unit, located in a heating cavity and configured to convert electric energy into heat energy; a flow channel structure, located in a heat exchange cavity, configured to allow a heat transfer medium passing through the flow channel structure to receive heat energy from the electric heating unit and including a plurality of medium flow channels, wherein the plurality of medium flow channels extend in parallel to each other along respective extension track lines with a translation relationship.
    Type: Application
    Filed: May 18, 2021
    Publication date: June 8, 2023
    Inventors: Jian XU, Cheng YANG, Zhiwen SHEN, Peng WANG, Tao CHANG, Yi JIANG
  • Publication number: 20230151820
    Abstract: A range hood, includes a fan system (2), the fan system (2) having a volute (21) and an impeller (22); the volute (21) includes a front cover (211), a rear cover (212) and an annular wall (213); the annular wall (213) has a volute tongue (214); the front cover (211) has an air inlet (215), the air inlet (215) faces downward to make the range hood to be a horizontal range hood; the volute tongue (214) is gradually inclined from the rear cover (212) to the front cover (211) in a direction opposite to the rotation direction of the impeller (22).
    Type: Application
    Filed: October 30, 2020
    Publication date: May 18, 2023
    Applicant: NINGBO FOTILE KITCHEN WARE CO., LTD.
    Inventors: Yi JIANG, Zhineng XU, Gai LEI, Lei SHI, Wenbo GOU
  • Patent number: 11646501
    Abstract: An electronic device may have an antenna embedded in a substrate. The substrate may have first layers, second layers on the first layers, and third layers on the second layers. The antenna may include a first patch on the first layers that radiates in a first band, a second patch on the second antenna layers that radiates in a second band, and a parasitic patch on the third layers. A short path may couple ground to a location on the first patch that allows the first patch to form a ground extension in the second band for the second patch without affecting performance of the first patch in the first band. The first layers may have a higher dielectric permittivity than the second and third layers to minimize the thickness of the substrate without requiring a separate dielectric loading layer over the substrate.
    Type: Grant
    Filed: June 3, 2021
    Date of Patent: May 9, 2023
    Assignee: Apple Inc.
    Inventors: Jiangfeng Wu, Siwen Yong, Simon G. Begashaw, Yi Jiang, Lijun Zhang
  • Patent number: 11645166
    Abstract: Embodiments of the present disclosure provide a method, device and computer program product for backing up data. The method comprises obtaining a data attribute of specific data to be backed up from a client to a server, a resource utilization rate at the client, and a network condition between the client and the server. The method further comprises setting, based on the data attribute, the resource utilization rate and the network condition, a plurality of parameters for performing stream backup, wherein the plurality of parameters at least comprises a concurrent number of stream transmission and a concurrent number of data parsing. The method further comprises parsing, according to the set plurality of parameters, the specific data and backing up the specific data from the client to the server.
    Type: Grant
    Filed: April 30, 2020
    Date of Patent: May 9, 2023
    Assignee: EMC IP Holding Company LLC
    Inventors: Qin Liu, Yi Jiang, Wenhao Dai, Jiang Fu
  • Patent number: 11643478
    Abstract: Provided is a low-molecular-weight holothurian glycosarninoglycan, with the constituent units thereof being a glucuronic acid group, an N-acetaminogalactose group and a fucose group, and a sulfate ester group or acetyl ester group thereof. Glucuronic acid and N-acetaminogalactose are interconnected via ?(1-3) and ?(1-4) glucosidic bonds to form a backbone of a disaccharide repeating structural unit, and a fucose group is connected to the backbone as a side chain. On a molar ratio basis, the ratio of the glucuronic acid group:the N-acetaminogalactose group:the fucose group is 1:(0.8-1.2):(0.6-1.2). In the structure of the low-molecular-weight holothurian glycosaminoglycan, 10-30% of glucuronic acid groups are modified, on the 2-position, with a sulfate ester group, and the rest are hydroxyl groups; and a proportion of 10-30% of fucose groups is modified, on the 2-position, with an acetyl ester group, and the rest are hydroxyl or sulfate ester groups.
    Type: Grant
    Filed: November 19, 2019
    Date of Patent: May 9, 2023
    Inventors: Yongsheng Jin, Xiujuan Ding, Wu Chen, Xiaoming Li, Junting Sun, Yihao Zhu, Xiaohua Lu, Caijuan Jin, Hua Zhou, Ningxia Wang, Yongbao Li, Qiaoyun Zhou, Jiangen Qian, Xi Chong, Yiming Yao, Yi Jiang
  • Patent number: 11641789
    Abstract: According to various embodiments, there is provided a memory cell. The memory cell may include a transistor, a dielectric member, an electrode and a contact member. The dielectric member may be disposed over the transistor. The electrode may be disposed over the dielectric member. The contact member has a first end and a second end opposite to the first end. The first end is disposed towards the transistor, and the second end is disposed towards the dielectric member. The contact member has a side surface extending from the first end to the second end. The second end may have a recessed end surface that has a section that slopes towards the side surface so as to form a tip with the side surface at the second end. The dielectric member may be disposed over the second end of the contact member and may include at least a portion disposed over the tip.
    Type: Grant
    Filed: June 23, 2021
    Date of Patent: May 2, 2023
    Assignee: GLOBALFOUNDRIES Singapore Pte. Ltd.
    Inventors: Yi Jiang, Benfu Lin, Lup San Leong, Curtis Chun-I Hsieh, Wanbing Yi, Juan Boon Tan
  • Patent number: 11604704
    Abstract: Embodiments of the present disclosure relate to a method for data backup. The method includes obtaining an attribute value associated with a backup task to be run, the backup task being used for backing up data on a client terminal to a server through a network, the attribute value including a value of at least one of an attribute of the client terminal, an attribute of the server, and an attribute of the network; determining, based on the attribute value, the number of threads to be used to perform the backup task on the client terminal; and causing the client terminal to perform the backup task using the number of threads to back up the data.
    Type: Grant
    Filed: May 25, 2020
    Date of Patent: March 14, 2023
    Assignee: EMC IP HOLDING COMPANY LLC
    Inventors: Yi Jiang, Wei Chen, Qin Liu, Wenhao Dai, Jianxu Xu, Jiang Fu
  • Patent number: 11600737
    Abstract: Germanium-based sensors are disclosed herein. An exemplary germanium-based sensor includes a germanium photodiode and a junction field effect transistor (JFET) formed from a germanium layer disposed in a silicon substrate, in some embodiments, or on a silicon substrate, in some embodiments. A doped silicon layer, which can be formed by in-situ doping epitaxially grown silicon, is disposed between the germanium layer and the silicon substrate. In embodiments where the germanium layer is on the silicon substrate, the doped silicon layer is disposed between the germanium layer and an oxide layer. The JFET has a doped polysilicon gate, and in some embodiments, a gate diffusion region is disposed in the germanium layer under the doped polysilicon gate. In some embodiments, a pinned photodiode passivation layer is disposed in the germanium layer. In some embodiments, a pair of doped regions in the germanium layer is configured as an e-lens of the germanium-based sensor.
    Type: Grant
    Filed: July 23, 2021
    Date of Patent: March 7, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Jhy-Jyi Sze, Sin-Yi Jiang, Yi-Shin Chu, Yin-Kai Liao, Hsiang-Lin Chen, Kuan-Chieh Huang
  • Publication number: 20230069164
    Abstract: A semiconductor image sensor includes a first substrate including a first front side and a first back side, a second substrate including a second front side and a second back side, a third substrate including a third front side and a third back side, a first interconnect structure, and a second interconnect structure. The first substrate includes a layer and a first light-sensing element in the layer. The layer includes a first semiconductor material, and the first light-sensing element includes a second semiconductor material. The second substrate is bonded to the first substrate with the second front side facing the first back side. The third substrate is bonded to the first substrate with the third front side facing the first front side. The first interconnect structure and the second interconnect structure are disposed between the first front side and the third front side.
    Type: Application
    Filed: August 30, 2021
    Publication date: March 2, 2023
    Inventors: JHY-JYI SZE, YI-SHIN CHU, YIN-KAI LIAO, HSIANG-LIN CHEN, SIN-YI JIANG, KUAN-CHIEH HUANG
  • Patent number: 11576609
    Abstract: The present disclosure relates to noninvasive methods for detecting liver fibrosis. Disclosed herein are noninvasive liver fibrosis detection methods that use Doppler Ultrasound devices and a physics-based machine learning method. Further disclosed herein are methods for detecting liver fibrosis in a subject by detecting and measuring the presence of a shift in the frequency of blood flow in the hepatic vein as compared to the frequency of blood flow in the portal vein.
    Type: Grant
    Filed: June 29, 2018
    Date of Patent: February 14, 2023
    Assignee: Georgia State University Research Foundation, Inc.
    Inventors: Yi Jiang, Hao Chen, Bin Zhang, Sergey Klimov
  • Publication number: 20230044062
    Abstract: Systems and methods for fused multi-modal electron microscopy are provided to generate quantitatively accurate 2D maps or 3D volumes with pixel/voxel values that directly reflect a sample's chemistry. Techniques are provided for combining annular dark field detector (ADF), annular bright field (ABF) and/or pixelated detector image data and energy dispersive X-rays (EDX) data and/or electron energy loss spectroscopy (EELS) data for a sample and generating chemical 2D and 3D maps by applying minimization optimization process.
    Type: Application
    Filed: July 27, 2022
    Publication date: February 9, 2023
    Inventors: Robert Hovden, Jonathan Schwartz, Yi Jiang, Zichao Wendy Di, Steve Rozeveld
  • Patent number: 11571453
    Abstract: Disclosed are a Piper laetispicum extract and a preparation method therefor and a use thereof. The Piper laetispicum extract includes any one or more of sesamin, (2E,6E)-N-isobutyl-7-(3,4-methylenedioxyphenyl)heptadienamide, (2E,4E)-N-isobutyldodecane-2,4-dieneamide, (2E,4E)-N-isobutyl-15-phenylpentadeca-2,4-dieneamide, (2E,4E,14Z)—N-isobutyleicosane-2,4,14-trienamide, and (2E,4E)-N-isobutyl-13-phenyltrideca-2,4-dieneamide. The Piper laetispicum extract can prevent depression.
    Type: Grant
    Filed: October 29, 2018
    Date of Patent: February 7, 2023
    Inventors: Xiujuan Ding, Wu Chen, Yi Jiang, Yongbao Li
  • Publication number: 20230020173
    Abstract: A semiconductor structure and a method for manufacturing a semiconductor structure are provided. The method for manufacturing the semiconductor structure includes: a substrate is provided: a plurality of semiconductor channels arrayed in a first direction and a second direction are formed on the substrate: a plurality of bit lines extending in the first direction are formed, in which the bit lines is located in the substrate: and a plurality of word lines extending in the second direction are formed, in which two word lines adjacent to each other in the first direction are spaced apart from each other in a direction perpendicular to a surface of the substrate: and a sidewall conductive layer is formed, in which the sidewall conductive layer is located above one of the two word lines adjacent to each other, and is arranged in the same layer as the other of the two word lines.
    Type: Application
    Filed: September 21, 2022
    Publication date: January 19, 2023
    Applicant: CHANGXIN MEMORY TECHNOLOGIES, INC.
    Inventors: Deyuan XIAO, YI JIANG, Guangsu SHAO, Xingsong SU, Yunsong QIU