Abstract: A micro light emitting device structure includes a substrate, a connecting layer, a micro light emitting device and a covering layer. The connecting layer is connected to the substrate. The micro light emitting device is removably connected to the connecting layer, and includes a semiconductor epitaxial structure and two electrodes. The semiconductor epitaxial structure has an outer surface. The electrodes are disposed on a first surface of the outer surface of the semiconductor epitaxial structure, or disposed on the first surface of the outer surface of the semiconductor epitaxial structure and a second surface of the semiconductor epitaxial structure away from the first surface, respectively. The covering layer is disposed on the outer surface of the semiconductor epitaxial structure.

Abstract: A conversion control circuit capable of recycling energy is configured to control an isolated power converter, converting an input power to generate an output power. The conversion control circuit generates an optocoupler current for a photodiode included in the optocoupler based on a control-related signal, transmitting the information of the control-related signal between the primary and secondary sides of the power converter via optical coupling to achieve power conversion. The conversion control circuit comprises a controllable current source circuit and a power conversion circuit. The controllable current source circuit generates a controllable current based on the control-related signal, wherein at least a portion of the controllable current is coupled to provide the optocoupler current. The power conversion circuit converts at least a portion of the optocoupler current into a supply power for an operating circuit, thereby recycling the energy generated by the optocoupler current.

Abstract: A method for LLM inference is provided. The method includes: receiving an input prompt; generating sequentially multiple draft tokens based on the input prompt by a draft model; generating multiple answer tokens in parallel based on the multiple draft tokens by a target model; and verifying at least one of the draft tokens. The verification result indicates that, when a ratio of a first probability of one of the draft tokens to a second probability of the one of the draft tokens is larger than a threshold which is lower than 1, or the one of the draft tokens is identical to a corresponding one of the answer tokens, the one of the draft tokens passes the verification.

Abstract: An adjustment circuit is included in a secondary-side controller, wherein the secondary-side controller is installed at a secondary side of an isolated power converter. The adjustment circuit includes a voltage divider, a buffer, a first variable resistor, a second variable resistor, an amplifier, and an N-type metal-oxide-semiconductor transistor. The buffer is coupled to the voltage divider. The first variable resistor is coupled to an external resistor outside the secondary-side controller. The second variable resistor is coupled to the first variable resistor and the buffer. The amplifier is coupled to the first variable resistor and the second variable resistor. The N-type metal-oxide-semiconductor transistor is coupled to a first external capacitor, a bias resistor, and an optocoupler. The first variable resistor and the second variable resistor adjust a characteristic of a Bode plot of the isolated power converter.

Abstract: A modular cabinet assembly has at least a first sub-cabinet and a second sub-cabinet. Each sub-cabinet includes a back board having at least two separate back board pieces that are pivotably connected to each other, a left side board pivotably connected to one of the at least two back board pieces, and a right side board pivotably connected to another of the at least two back board pieces. At least one shelf board having opposite ends is removably connected to the left side board and the right side board of either the first sub-cabinet or the second sub-cabinet. A first end board is connected to either an upper end of the first sub-cabinet or a lower end of the second sub-cabinet. A first connector removably connects the left side boards of the first and second sub-cabinets, and a second connector removably connects the right side boards of the first and second sub-cabinets.

Abstract: An electronic package is provided and includes an electronic structure and a plurality of conductive pillars embedded in a cladding layer, a circuit structure formed on the cladding layer, and a reinforcing member bonded to a side surface of the cladding layer, where a plurality of electronic elements are disposed on and electrically connected to the circuit structure, such that the electronic structure electrically bridges any two of the electronic elements via the circuit structure, so as to enhance the structural strength of the electronic package and avoid warpage by means of the design of the reinforcing member.

Abstract: An electronic package and a manufacturing method thereof are provided, in which a passive element and an interposer structure are disposed on a carrier structure, the passive element is encapsulated by an encapsulation layer, and the electronic element is disposed on and electrically connected to the passive element and the interposer structure. Therefore, by the design of the electronic element electrically connecting to the passive element, the power transmission path is shortened and the resistance is reduced, thereby achieving the effect of reducing power loss.

Abstract: The present disclosure provides an electronic device. The electronic device includes a substrate, an electronic component, a circuit structure, and a shielding layer. The electronic component is disposed under the substrate. The circuit structure is disposed under the substrate. The shielding layer is disposed under the substrate and covers the electronic component and connected to the circuit structure. The circuit structure and the shielding layer are collectively configured to block the electronic component from electromagnetic interference.

Abstract: A memory system includes a memory device and a processing device coupled to the memory device. The processing device receives a plurality of codewords; selects a first read voltage associated with the one or more codewords, such that the first read voltage is based on a time elapsed since a last write operation with respect to a management unit comprising the one or more codewords; and applies the first read voltage to a set of memory cells storing the one or more codewords.

Abstract: A laser module is provided. The laser module includes a substrate, a laser diode and a diffuser. The substrate has a surface and a base plane, wherein the base plane is parallel to the surface. The laser diode is disposed on the surface. The diffuser is disposed above the laser diode, wherein an included angle is formed between the diffuser and the base plane, and the included angle is greater than 5 degrees.

Abstract: An electronic package and a manufacturing method thereof are provided, in which a photonic integrated circuit chip and an electronic integrated circuit chip are disposed on opposite sides of an interposer respectively, and the photonic integrated circuit chip and the electronic integrated circuit chip can accomplish signal connection with each other via a plurality of conductive vias in the interposer directly, thereby reducing the power consumption and transmission delay of the signals transmitted between the circuits.

Abstract: An electronic package and a manufacturing method thereof are provided, in which a plurality of photonic integrated circuit chips and an auxiliary electronic element are separately configured on a package module to shorten the transmission distance of the optical signal. Therefore, the signal transmission rate of a circuit structure can be increased, thereby improving the overall operating performance of the electronic package.

Abstract: A brush module for a rotary table includes: a housing, a brush unit, a first pushing unit and a second pushing unit, the brush unit includes a brush disposed in the housing, a conductive wire electrically connected to the brush, and a pushing force for pushing the brush towards the opening of the housing. The first and second pushing units oppositely provided on the housing provide the brush a first and a second pushing forces in opposite directions to resist the lateral thrust generated by friction between the brush and the rotary disk of the rotary table, thereby greatly reducing the vibration, shaking, slipping, line contact and other conditions of the brush caused by high-speed rotation of the rotary disk, avoiding damaging the peripheral surface of the rotary disk, and maintaining good electrical contact between the brush and the rotary disk.

Abstract: Buffing of a footwear component allows for an alteration of the component surface to achieve an intended surface for aesthetics and/or manufacturing purposes. The buffing is performed in a system having a vision module, a sidewall buffing module, an up surface buffing module, and a down surface buffing module. Each of the buffing modules are adapted for the unique shape and sizes of a footwear component to effectively and automatically buff the footwear component.

Abstract: A light emitting device including an epitaxial structure and a plurality of surface microstructures is provided. The epitaxial structure has a light emitting surface and a surrounding wall surface. The surrounding wall surface surrounds and is connected to the light emitting surface. The plurality of surface microstructures are separately arranged on the light emitting surface along a plurality of directions. The plurality of directions are not perpendicular to the surrounding wall surface. A light emitting device substrate including a plurality of the light emitting device is also provided.

Abstract: Buffing of a footwear component allows for an alteration of the component surface to achieve an intended surface for aesthetics and/or manufacturing purposes. The buffing is performed in a system having a vision module, a sidewall buffing module, an up surface buffing module, and a down surface buffing module. Each of the buffing modules are adapted for the unique shape and sizes of a footwear component to effectively and automatically buff the footwear component.

Abstract: An electronic package is provided in which an electronic module and a heat dissipation structure combined with the electronic module are disposed on a carrier structure, and at least one adjustment structure is coupled with the heat dissipation structure and located around the electronic module. Therefore, the adjustment structure disperses thermal stress to avoid warpage of the electronic module.

Abstract: A torque wrench includes a wrench body, a deformable rod, a torque adjustment mechanism, a switch and an alarm. The wrench body includes a working section and a gripping section. Two ends of the deformable rod are fixed to the working section and the gripping section respectively, and a middle section is formed in-between. The torque adjustment mechanism is installed in the gripping section and includes a knob and an abutting member. The knob adjusts the abutting member to be proximate to or away from the middle section. The switch is disposed between the middle section and the torque adjustment mechanism. The alarm is electrically connected to the switch, and the middle section is in a bending deformation toward the abutting member, when load of the working section is greater than a set torque, to touch the switch and trigger the alarm to generate a warning signal.

Abstract: An electronic package is provided and includes: a thermally conductive chip; a circuit structure having a circuit layer; and an electronic component disposed between the circuit structure and the thermally conductive chip and electrically connected to the circuit layer, so as to dissipate the heat generated during the operation of the electronic component via the thermally conductive chip. A method of manufacturing the electronic package is further provided.

Abstract: A memory system includes a memory device and a processing device coupled to the memory device. The processing device receives a plurality of codewords; determines that one or more codewords of the plurality of codewords are corrupt; selects a first read voltage associated with the one or more codewords, such that the first read voltage is based on a second read voltage utilized for reading the one or more codewords in a previous read operation; and applies the first read voltage to a set of memory cells storing the one or more corrupted codewords.