Patents by Inventor Yi MIN

Yi MIN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250149851
    Abstract: A laser module is provided. The laser module includes a substrate, a laser diode and a diffuser. The substrate has a surface and a base plane, wherein the base plane is parallel to the surface. The laser diode is disposed on the surface. The diffuser is disposed above the laser diode, wherein an included angle is formed between the diffuser and the base plane, and the included angle is greater than 5 degrees.
    Type: Application
    Filed: November 1, 2024
    Publication date: May 8, 2025
    Inventors: Yi-Min CHEN, Kai-Hung CHENG, Ming-Jing LEE, Jung-Tang CHU
  • Publication number: 20250149079
    Abstract: A memory system includes a memory device and a processing device coupled to the memory device. The processing device receives a plurality of codewords; selects a first read voltage associated with the one or more codewords, such that the first read voltage is based on a time elapsed since a last write operation with respect to a management unit comprising the one or more codewords; and applies the first read voltage to a set of memory cells storing the one or more codewords.
    Type: Application
    Filed: January 13, 2025
    Publication date: May 8, 2025
    Inventors: Yi-Min Lin, Fangfang Zhu, Chih-Kuo Kao
  • Publication number: 20250140770
    Abstract: An electronic package and a manufacturing method thereof are provided, in which a photonic integrated circuit chip and an electronic integrated circuit chip are disposed on opposite sides of an interposer respectively, and the photonic integrated circuit chip and the electronic integrated circuit chip can accomplish signal connection with each other via a plurality of conductive vias in the interposer directly, thereby reducing the power consumption and transmission delay of the signals transmitted between the circuits.
    Type: Application
    Filed: March 27, 2024
    Publication date: May 1, 2025
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Che-Yu LEE, Chi-Ching HO, Chao-Chiang PU, Yi-Min FU, Po-Yuan SU
  • Publication number: 20250140765
    Abstract: An electronic package and a manufacturing method thereof are provided, in which a plurality of photonic integrated circuit chips and an auxiliary electronic element are separately configured on a package module to shorten the transmission distance of the optical signal. Therefore, the signal transmission rate of a circuit structure can be increased, thereby improving the overall operating performance of the electronic package.
    Type: Application
    Filed: April 10, 2024
    Publication date: May 1, 2025
    Inventors: Yi-Min FU, Chi-Ching HO, Chao-Chiang PU, Yu-Po WANG
  • Publication number: 20250141170
    Abstract: A brush module for a rotary table includes: a housing, a brush unit, a first pushing unit and a second pushing unit, the brush unit includes a brush disposed in the housing, a conductive wire electrically connected to the brush, and a pushing force for pushing the brush towards the opening of the housing. The first and second pushing units oppositely provided on the housing provide the brush a first and a second pushing forces in opposite directions to resist the lateral thrust generated by friction between the brush and the rotary disk of the rotary table, thereby greatly reducing the vibration, shaking, slipping, line contact and other conditions of the brush caused by high-speed rotation of the rotary disk, avoiding damaging the peripheral surface of the rotary disk, and maintaining good electrical contact between the brush and the rotary disk.
    Type: Application
    Filed: October 31, 2023
    Publication date: May 1, 2025
    Inventors: Li-Wen Huang, Chih-Hao Ho, Yi-Lin Wu, Yi-Min Wu
  • Patent number: 12285082
    Abstract: Buffing of a footwear component allows for an alteration of the component surface to achieve an intended surface for aesthetics and/or manufacturing purposes. The buffing is performed in a system having a vision module, a sidewall buffing module, an up surface buffing module, and a down surface buffing module. Each of the buffing modules are adapted for the unique shape and sizes of a footwear component to effectively and automatically buff the footwear component.
    Type: Grant
    Filed: October 17, 2023
    Date of Patent: April 29, 2025
    Assignee: NIKE, Inc.
    Inventors: Chun-Chieh Chen, Yi-Min Chen, Chia-Hung Lin, Hsien-Kuang Wu, Hung-Yu Wu
  • Publication number: 20250126933
    Abstract: A light emitting device including an epitaxial structure and a plurality of surface microstructures is provided. The epitaxial structure has a light emitting surface and a surrounding wall surface. The surrounding wall surface surrounds and is connected to the light emitting surface. The plurality of surface microstructures are separately arranged on the light emitting surface along a plurality of directions. The plurality of directions are not perpendicular to the surrounding wall surface. A light emitting device substrate including a plurality of the light emitting device is also provided.
    Type: Application
    Filed: November 13, 2023
    Publication date: April 17, 2025
    Applicant: PlayNitride Display Co., Ltd.
    Inventors: Yi-Min Su, Chung-Yu Chang, Yi-Ting Chen, Ching-Liang Lin
  • Patent number: 12274330
    Abstract: Buffing of a footwear component allows for an alteration of the component surface to achieve an intended surface for aesthetics and/or manufacturing purposes. The buffing is performed in a system having a vision module, a sidewall buffing module, an up surface buffing module, and a down surface buffing module. Each of the buffing modules are adapted for the unique shape and sizes of a footwear component to effectively and automatically buff the footwear component.
    Type: Grant
    Filed: August 24, 2023
    Date of Patent: April 15, 2025
    Assignee: NIKE, Inc.
    Inventors: Chun-Chieh Chen, Yi-Min Chen, Chia-Hung Lin, Hsien-Kuang Wu, Hung-Yu Wu
  • Publication number: 20250087601
    Abstract: An electronic package is provided in which an electronic module and a heat dissipation structure combined with the electronic module are disposed on a carrier structure, and at least one adjustment structure is coupled with the heat dissipation structure and located around the electronic module. Therefore, the adjustment structure disperses thermal stress to avoid warpage of the electronic module.
    Type: Application
    Filed: November 22, 2024
    Publication date: March 13, 2025
    Inventors: Chao-Chiang PU, Chi-Ching HO, Yi-Min FU, Yu-Po WANG, Po-Yuan SU
  • Patent number: 12246417
    Abstract: A torque wrench includes a wrench body, a deformable rod, a torque adjustment mechanism, a switch and an alarm. The wrench body includes a working section and a gripping section. Two ends of the deformable rod are fixed to the working section and the gripping section respectively, and a middle section is formed in-between. The torque adjustment mechanism is installed in the gripping section and includes a knob and an abutting member. The knob adjusts the abutting member to be proximate to or away from the middle section. The switch is disposed between the middle section and the torque adjustment mechanism. The alarm is electrically connected to the switch, and the middle section is in a bending deformation toward the abutting member, when load of the working section is greater than a set torque, to touch the switch and trigger the alarm to generate a warning signal.
    Type: Grant
    Filed: September 28, 2022
    Date of Patent: March 11, 2025
    Assignee: MATATAKITOYO TOOL CO., LTD.
    Inventor: Yi-Min Wu
  • Publication number: 20250079254
    Abstract: An electronic package is provided and includes: a thermally conductive chip; a circuit structure having a circuit layer; and an electronic component disposed between the circuit structure and the thermally conductive chip and electrically connected to the circuit layer, so as to dissipate the heat generated during the operation of the electronic component via the thermally conductive chip. A method of manufacturing the electronic package is further provided.
    Type: Application
    Filed: January 4, 2024
    Publication date: March 6, 2025
    Inventors: Po-Yuan SU, Chi-Ching HO, Chao-Chiang PU, Yi-Min FU, Che-Yu LEE
  • Patent number: 12243577
    Abstract: A memory system includes a memory device and a processing device coupled to the memory device. The processing device receives a plurality of codewords; determines that one or more codewords of the plurality of codewords are corrupt; selects a first read voltage associated with the one or more codewords, such that the first read voltage is based on a second read voltage utilized for reading the one or more codewords in a previous read operation; and applies the first read voltage to a set of memory cells storing the one or more corrupted codewords.
    Type: Grant
    Filed: September 5, 2023
    Date of Patent: March 4, 2025
    Assignee: Micron Technology, Inc.
    Inventors: Yi-Min Lin, Fangfang Zhu, Chih-Kuo Kao
  • Patent number: 12242313
    Abstract: A system determines a current state of an information handling system, and receives a sensor output signal. The system determines whether a status change of the sensor output signal relates to an expected state based on the current state and a previous state of the information handling system, and determines whether the sensor output signal is triggered by an external magnet. If the status change of the sensor output signal relates to the expected state and the sensor output signal is not triggered by the external magnet, then the system transitions the information handling system from the current state to the expected state.
    Type: Grant
    Filed: September 28, 2023
    Date of Patent: March 4, 2025
    Assignee: Dell Products L.P.
    Inventors: Chen Hsin Chang, Wan Shih Chien, Yi Min Lin
  • Publication number: 20250069138
    Abstract: The present invention proposes a method for constructing investment portfolios, which includes calculating the logarithmic return and the momentum factor through a processor based on historical stock prices, storing the logarithmic return and the momentum factor, the processor calculates the information coefficient (IC) values based on the logarithmic return and momentum factor, and stores the IC values as an investment target screening indicators, utilizes the processor to exanimate the momentum IC value in the time interval, deletes the stocks whose stock price is too small, ranks and stores the stocks according to the strength of the momentum, and utilizes the processor to determine the stock list in the portfolio based on the ranking by the equal weighting method, and then stores the portfolio.
    Type: Application
    Filed: September 22, 2023
    Publication date: February 27, 2025
    Inventors: Yi-Min Lan, Hung-Wen Cheng
  • Publication number: 20250070517
    Abstract: A contact assembly for an electrical connector, includes: a row of contacts having plural contacting portions; an insulator secured to the contacting portions; an upper ground plate and a lower ground plate surrounding the row of contacts, at least one of the upper and lower ground plates integrally having plural ground contacting portions aligned with the contacting portions of the row of contacts; and plural separate conductive rivets electrically connecting the upper and lower ground plates.
    Type: Application
    Filed: August 19, 2024
    Publication date: February 27, 2025
    Inventors: PATRICK R. CASHER, TERRANCE F. LITTLE, CHUN-HSIUNG HSU, YI-MIN HSU, MING ZHOU
  • Patent number: 12233515
    Abstract: A power tool includes a housing (10), a power device (20), a bearing set (30), a torque post (40) and a torque sensor (50). The housing (10) includes a main body (11) and a handle (12) perpendicularly connected to one side of the main body (11). The power device (20) is disposed in the main body (11) and includes a power body (21) and a bushing (22) adapted to sheathe the power body (21). The bearing set (30) is arranged between the bushing (22) and the housing (10). The power body (21) may rotate relative to the housing (10). The torque post (40) is disposed in the handle (12) and abuts against the bushing (22). The torque post (40) is arranged perpendicularly to the power body (21). The torque sensor (50) is disposed on the torque post (40).
    Type: Grant
    Filed: October 13, 2022
    Date of Patent: February 25, 2025
    Assignee: MATATAKITOYO TOOL CO., LTD.
    Inventor: Yi-Min Wu
  • Patent number: 12237458
    Abstract: A micro light emitting device display apparatus including a substrate, a plurality of micro light emitting devices, an isolation layer, and at least one first air gap is provided. The substrate has a plurality of connection pads. The micro light emitting devices are discretely disposed on the substrate. The isolation layer is disposed between the substrate and each of the micro light emitting devices. The at least one first air gap is disposed between the substrate and a surface of the isolation layer facing the substrate.
    Type: Grant
    Filed: May 16, 2022
    Date of Patent: February 25, 2025
    Assignee: PlayNitride Display Co., Ltd.
    Inventors: Chih-Ling Wu, Yen-Yeh Chen, Yi-Min Su, Yi-Chun Shih
  • Publication number: 20250062856
    Abstract: The present disclosure provides a system for signal optimization adjustment based on different heat source information. The system includes a plurality of heat source measurers, a first system chip, a second system chip, an electrical interconnection, and a bit error risk evaluator. The first system chip includes a signal transmitter, and the second system chip includes a signal receiver. The second system chip provides an electrical characteristic state of the signal receiver, and a signal adjustment information of the signal transmitter and/or the signal receiver. The bit error risk evaluator performs a signal optimization adjustment for an electrical characteristic of the signal receiver according to the electrical characteristic state. The present disclosure further provides a method for signal optimization adjustment.
    Type: Application
    Filed: June 6, 2024
    Publication date: February 20, 2025
    Inventors: Wanfen TENG, Yi-Min YU, Jason YEH, Chao-Lung WEI, Fan-Cheng HUANG, Yi-Wen SU, Ting-Chu YEH, Mei-Yi HUANG
  • Patent number: 12229697
    Abstract: An example operation may include one or more of generating, by a blockchain node, an asset containment world-state by execution of a linear-time ingestion algorithm, detecting, by the blockchain node, an asset aggregation or disaggregation event, updating, by the blockchain node, the world-state based on the asset aggregation or disaggregation event, and computing supply-chain metrics based on the updated world-state.
    Type: Grant
    Filed: February 19, 2020
    Date of Patent: February 18, 2025
    Assignee: International Business Machines Corporation
    Inventors: Ashish Jagmohan, Yi-Min Chee, Julie MacNaught, Abhilash Narendra, Krishna Chaitanya Ratakonda, Ryan Enderby
  • Publication number: 20250056684
    Abstract: A heating device includes a resonant circuit, a detection unit and a control unit. The resonant circuit includes an inverter circuit and a resonant tank. The inverter circuit provides a resonant tank current and a resonant tank voltage. The resonant tank includes a heating coil, a resonant tank capacitor, a resonant tank equivalent inductor and a resonant tank equivalent resistor. The detection unit calculates an inductance of the resonant tank equivalent inductor according to a capacitance of the resonant tank capacitor, a resonant period and a first expression. The detection unit calculates a resistance of the resonant tank equivalent resistor according to the inductance of the resonant tank equivalent inductor, a time change value, a reference voltage value, a negative peak voltage value and a second expression.
    Type: Application
    Filed: December 27, 2023
    Publication date: February 13, 2025
    Inventors: Ming-Shi Huang, Zheng-Feng Li, Jhih-Cheng Hu, Yi-Min Chen, Chun-Wei Lin