Abstract: A system determines a current state of an information handling system, and receives a sensor output signal. The system determines whether a status change of the sensor output signal relates to an expected state based on the current state and a previous state of the information handling system, and determines whether the sensor output signal is triggered by an external magnet. If the status change of the sensor output signal relates to the expected state and the sensor output signal is not triggered by the external magnet, then the system transitions the information handling system from the current state to the expected state.

Abstract: A contact assembly for an electrical connector, includes: a row of contacts having plural contacting portions; an insulator secured to the contacting portions; an upper ground plate and a lower ground plate surrounding the row of contacts, at least one of the upper and lower ground plates integrally having plural ground contacting portions aligned with the contacting portions of the row of contacts; and plural separate conductive rivets electrically connecting the upper and lower ground plates.

Abstract: The present invention proposes a method for constructing investment portfolios, which includes calculating the logarithmic return and the momentum factor through a processor based on historical stock prices, storing the logarithmic return and the momentum factor, the processor calculates the information coefficient (IC) values based on the logarithmic return and momentum factor, and stores the IC values as an investment target screening indicators, utilizes the processor to exanimate the momentum IC value in the time interval, deletes the stocks whose stock price is too small, ranks and stores the stocks according to the strength of the momentum, and utilizes the processor to determine the stock list in the portfolio based on the ranking by the equal weighting method, and then stores the portfolio.

Abstract: A power tool includes a housing (10), a power device (20), a bearing set (30), a torque post (40) and a torque sensor (50). The housing (10) includes a main body (11) and a handle (12) perpendicularly connected to one side of the main body (11). The power device (20) is disposed in the main body (11) and includes a power body (21) and a bushing (22) adapted to sheathe the power body (21). The bearing set (30) is arranged between the bushing (22) and the housing (10). The power body (21) may rotate relative to the housing (10). The torque post (40) is disposed in the handle (12) and abuts against the bushing (22). The torque post (40) is arranged perpendicularly to the power body (21). The torque sensor (50) is disposed on the torque post (40).

Abstract: A micro light emitting device display apparatus including a substrate, a plurality of micro light emitting devices, an isolation layer, and at least one first air gap is provided. The substrate has a plurality of connection pads. The micro light emitting devices are discretely disposed on the substrate. The isolation layer is disposed between the substrate and each of the micro light emitting devices. The at least one first air gap is disposed between the substrate and a surface of the isolation layer facing the substrate.

Abstract: The present disclosure provides a system for signal optimization adjustment based on different heat source information. The system includes a plurality of heat source measurers, a first system chip, a second system chip, an electrical interconnection, and a bit error risk evaluator. The first system chip includes a signal transmitter, and the second system chip includes a signal receiver. The second system chip provides an electrical characteristic state of the signal receiver, and a signal adjustment information of the signal transmitter and/or the signal receiver. The bit error risk evaluator performs a signal optimization adjustment for an electrical characteristic of the signal receiver according to the electrical characteristic state. The present disclosure further provides a method for signal optimization adjustment.

Abstract: An example operation may include one or more of generating, by a blockchain node, an asset containment world-state by execution of a linear-time ingestion algorithm, detecting, by the blockchain node, an asset aggregation or disaggregation event, updating, by the blockchain node, the world-state based on the asset aggregation or disaggregation event, and computing supply-chain metrics based on the updated world-state.

Abstract: A heating device includes a resonant circuit, a detection unit and a control unit. The resonant circuit includes an inverter circuit and a resonant tank. The inverter circuit provides a resonant tank current and a resonant tank voltage. The resonant tank includes a heating coil, a resonant tank capacitor, a resonant tank equivalent inductor and a resonant tank equivalent resistor. The detection unit calculates an inductance of the resonant tank equivalent inductor according to a capacitance of the resonant tank capacitor, a resonant period and a first expression. The detection unit calculates a resistance of the resonant tank equivalent resistor according to the inductance of the resonant tank equivalent inductor, a time change value, a reference voltage value, a negative peak voltage value and a second expression.

Abstract: An electronic package is provided in which a chip packaging module, an electronic element having a plurality of contacts, and an electronic connector are disposed on a routing structure of a carrier component, so as to communicatively connect with the chip packaging module via the electronic element and the electronic connector, thereby increasing a signal transmission speed.

Abstract: An electronic package is provided in which an electronic module and a heat dissipation structure combined with the electronic module are disposed on a carrier structure, and at least one adjustment structure is coupled with the heat dissipation structure and located around the electronic module. Therefore, the adjustment structure disperses thermal stress to avoid warpage of the electronic module.

Abstract: A ratchet wrench includes a head, a toothed wheel, a pawl and a switch. The head includes two bores in communication with a pothole in communication with a chamber via a channel. The channel includes a broad section between two tapered sections. The toothed wheel is rotatable in the chamber. The switch is pivotable in the pothole and includes a tunnel with a first end in communication with the broad section of the channel and a second end in communication with the pothole. A spring is compressed between a detent and a ball. The detent includes an end connected to the pawl and another end movable in the tunnel. The ball includes a portion in the tunnel and another portion insertable in a selected one of the bores when the detent moves the pawl into a corresponding one of the tapered sections of the channel.

Abstract: An electronic package is provided in which a chip packaging module, an electronic element having a plurality of contacts, and an electronic connector are disposed on a routing structure of a carrier component, so as to communicatively connect with the chip packaging module via the electronic element and the electronic connector, thereby increasing a signal transmission speed.

Abstract: An electronic package and a manufacturing method thereof are provided, in which an electronic element is disposed on a carrier structure, a heat conduction layer is formed on the electronic element, and a heat dissipation member having a recess portion is disposed on the heat conduction layer to cover the electronic element. Therefore, the arrangement of the recess portion can buffer the flow of the heat conduction layer to facilitate the formation of an intermetallic structure with sufficient thickness between the heat dissipation member and the electronic element, and the heat dissipation effect of the electronic element can meet expectations.

Abstract: A multilevel buck converter includes a plurality of switches, an inductor, a flying capacitor, and a control circuit. The plurality of switches are coupled between an input terminal and a ground. The input terminal has an input voltage. The inductor is coupled between the plurality of switches and an output terminal for generating an inductor-current signal. The flying capacitor is coupled to the plurality of switches for generating a flying capacitor voltage. The control circuit is coupled to the output terminal and the plurality of switches for generating a plurality of switching signals according a feedback voltage and the inductor-current signal. The control circuit operates in a valley current mode with dual slope compensation.

Abstract: Buffing of a footwear component allows for an alteration of the component surface to achieve an intended surface for aesthetics and/or manufacturing purposes. The buffing is performed in a system having a vision module, a sidewall buffing module, an up surface buffing module, and a down surface buffing module. Each of the buffing modules are adapted for the unique shape and sizes of a footwear component to effectively and automatically buff the footwear component.

Abstract: A source/drain region of a semiconductor device is formed using an epitaxial growth process. In an embodiment a first step comprises forming a bulk region of the source/drain region using a first precursor, a second precursor, and an etching precursor. A second step comprises cleaning the bulk region with the etchant along with introducing a shaping dopant to the bulk region in order to modify the crystalline structure of the exposed surfaces. A third step comprises forming a finishing region of the source/drain region using the first precursor, the second precursor, and the etching precursor.

Abstract: An electronic package and a manufacturing method thereof are provided, in which an electronic element is disposed on a carrier structure with a circuit layer, a first encapsulating layer and a second encapsulating layer are formed on the carrier structure to cover the electronic element, a first antenna layer is formed on the first encapsulating layer, and a second antenna layer communicatively connected to the first antenna layer is formed on the second encapsulating layer. Therefore, the thickness of the first encapsulating layer is used to control the resonance distance of the antenna frequency so as to generate better resonance effect, and the distance between the first antenna layer and the second antenna layer is controlled by the thickness of the second encapsulating layer to increase the bandwidth of the antenna.

Abstract: A source/drain region of a semiconductor device is formed using an epitaxial growth process. In an embodiment a first step comprises forming a bulk region of the source/drain region using a first precursor, a second precursor, and an etching precursor. A second step comprises cleaning the bulk region with the etchant along with introducing a shaping dopant to the bulk region in order to modify the crystalline structure of the exposed surfaces. A third step comprises forming a finishing region of the source/drain region using the first precursor, the second precursor, and the etching precursor.

Abstract: An electronic package and a manufacturing method thereof are provided, in which a heat sink with an opening is disposed on an electronic component of a carrier structure, a heat dissipation material is formed in the opening, and a heat dissipation lid is disposed on the opening to cover the heat dissipation material, such that the problem of insufficient heat dissipation due to the loss of the heat dissipation material can be prevented from occurring to the electronic component.

Abstract: A capacitor structure for a power semiconductor device includes a semiconductor substrate, an isolation insulating layer having a ring-shape and including an outer periphery and an inner periphery defining an opening region, a first electrode disposed on the isolation insulating layer, a dielectric layer disposed on the first electrode, and a second electrode disposed on the dielectric layer.