HEAT DISSIPATION DEVICE

Abstract

A heat dissipation device includes a substrate, a fin assembly located on the substrate, a plurality of heat pipes connecting the substrate and the fin assembly, and a fan fixed on the substrate by a clip. The fin assembly includes a first fin unit, a second fin unit, and a third fin unit. The third fin unit is located on the substrate, the second fin unit is located on the third fin unit, and the first fin unit is located on the first fin unit. A receiving space is defined in the second and third fin unit. The fan is received in the receiving space and spaced apart from the fin assembly.

Description

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present disclosure relates to heat dissipation and, more particularly, to a heat dissipation device having a fan fixed on a substrate thereof.

2. Description of Related Art

Electronic components, such as central processing units (CPUs), generate large amounts of heat during normal operation. If the heat is not properly dissipated, it can adversely affect operational stability of the electronic components and damage associated electronic devices.

Often, a heat dissipation device is attached to a top surface of a CPU in order to dissipate heat generated therefrom. A typical heat dissipation device includes a heat sink attached to the CPU. The heat sink includes a plurality of fins. A fan is mounted on top of the fins of the heat sink. It is known that the fan generates vibration when operating. The fins, on which the fan is mounted by a clip, will vibrate sympathetically with the fan, whereby considerable noise is generated during the operation of the heat dissipation device.

What is needed, therefore, is a heat dissipation device which can overcome the described limitations.

BRIEF DESCRIPTION OF THE DRAWINGS

Many aspects of the present apparatus can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present apparatus. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.

FIG. 1 is an exploded, isometric view of a heat dissipation device in accordance with an embodiment of the disclosure.

FIG. 2 is an isometric view of a clip and a substrate of the heat dissipation device in FIG. 1.

FIG. 3 is a partly assembled, isometric view of the heat dissipation device in FIG. 1.

FIG. 4 is an inverted, assembled, isometric view of the heat dissipation device in FIG. 1.

DETAILED DESCRIPTION OF THE INVENTION

Referring to FIG. 1, a heat dissipation device in accordance with an embodiment of the disclosure dissipates heat generated by an electronic component (not shown), such as a CPU. The heat dissipation device comprises a substrate 10 attached to the electronic component, a fan 20 fixed on the substrate 10 by a clip 30, three heat pipes 40 and a fin assembly 50 located on the substrate 10.

Also referring to FIG. 2, the substrate 10 comprises a substantially square plate 12, two parallel and spaced panels 16 and a rectangular plate 14 positioned therebetween, all extending from the front end of the square plate 12.

The square plate 12 defines a rectangular hatch (not labeled) receiving a base 122 therein. The base 122 is near a right side and far from a left side of the square plate 12. The base 122 comprises a center core 124, with a bottom surface thereof attached to the electronic component. Three grooves 1240 are defined in a top surface of the center core 124 receiving the heat pipes 40 therein. A supporting bar 126 bends upwardly from the left side of the square plate 12 with a step 1262 formed on a top thereof. Length of the supporting bar 126 is similar to that of the left side of the square plate 12.

The rectangular plate 14 is substantially coplanar with the square plate 12. Two triangular blocks 142 are formed on the rectangular plate 14. The two blocks 142 are positioned between and respectively connected to the two panels 16. The blocks 142 are perpendicular to the rectangular plate 14 and the panels 16. Front faces of the two blocks 142 are behind a front edge of the rectangular plate 14 and are coplanar with each other for attaching to the fan 20. A columned bulge 144 extends perpendicularly and forwards from the front face of each of the blocks 142.

The panels 16 are perpendicular to the square plate 12 and the rectangular plate 14, and have a height similar to the blocks 142. A distance between the two panels 16 is similar to a length of the fan 20, fixing the fan 20 therebetween. A top arm 164 and a bottom arm 165 extend forwards from a free end of each panel 16, with a slot 162 defined therebetween. A columned pin 18 is vertically received in the top and bottom arms 164, 165 and through the slot 162. Specifically, one pin 18 is permanently fixed in the right side panel 16 and a second pin 18 is detachably fixed in the left side panel 16, passing a through hole 166 defined in the top arm 164 and a blind hole 168 defined in the bottom arm 165 of the left side panel 16. The second pin 18 is long enough to prevent disengagement from the top arm 164 of the left side panel 16.

The clip 30 presses on the fan 20 and is fixed with the two panels 16. The clip 30 is integrally punched by a piece of metal plate and comprises a pressing plate 32 and two flexible plates 33 bending from two opposite ends of the pressing plate 32 and apart from the rectangular plate 14. A claw 34 extends from a free end of each of the flexible plates 33 and bends towards the rectangular plate 14. A hook 36 is formed at a free end of the claw 34 corresponding to the pin 18 at the right side panel 16 for engagement therewith. A sleeve 35 is formed at a free end of another claw 34 corresponding to the second pin 18 at the left side panel 16 and receiving the second pin 18 therein.

The heat pipes 40 are U-shaped, each comprising a horizontal heat absorption portion 42 and two heat dissipation portions 44 extending upwardly from two opposite ends of the heat absorption portion 42. The heat absorption portions 42 of the heat pipes 40 are close to each other and received in the grooves 1240 of the base 122, absorbing heat from the electronic component. The heat dissipation portions 44 are parallel and received in the fin assembly 50.

The fin assembly 50 comprises a first fin unit 52, a second fin unit 54 and a third fin unit 56. The third fin unit 56 is arranged on the substrate 10. The second fin unit 54 is arranged on the third fin unit 56. The first fin unit 52 is arranged on the second fin unit 54.

The first, second and third fin units 52, 54, 56 are substantially rectangular metal plates, with a plurality of channels (not labeled) defined thereamongst. The first fin unit 52 comprises a plurality of parallel fins each having a rectangular first main body 520 and two first flanges 57 extending downwardly from two lateral sides of the first main body 520. The second fin unit 54 comprises a plurality of parallel fins each having a rectangular second main body 540 and two second flanges 58 extending downwardly from two lateral sides of the second main body 540. The third fin unit 56 comprises a third main body 560 and two flanges 59 extending downwardly from two lateral sides of the third main body 560. The first, second and third main bodies 520, 540, 560 are of identical size. A plurality of holes 51, 53 is defined in the first, second and third main bodies 520, 540, 560. A rectangular opening 55 is defined in each of the first, second and third main bodies 520, 540, 560 near a right lateral side and a front end thereof. The first flanges 57 are the same height as the second flanges 58, and the third flanges 59 are taller than the first and second flanges 57, 58. A bottom of the third flange 59 at the left lateral side of the third fin unit 56 is located on the step 1262 of the supporting bar 126.

A receiving hole 562 is defined in a front end of each of the second and third main bodies 540, 560 and adjacent to the opening 55. The receiving holes 562 cooperatively define a receiving space 510, receiving the fan 20 therein. A fixing hole 24 is defined in each corner of the fan 20.

Also referring to FIGS. 3 and 4, in assembly, the heat absorption portions 42 of the heat pipes 40 are fixed in the grooves 1240 of the base 122 by solder. The second pin 18 passes the through hole 166 of the top arm 164 of the left side panel 16 and the sleeve 35 of the clip 30, and further enters the blind hole 168 of the bottom arm 165 of the left side panel 16, engages the clip 30 and the left side panel 16. The clip 30 is pivoted about the second pin 18. The fan 20 is located on the rectangular plate 14, positioned between the two panels 16 and attached to the blocks 142, with the bulges 144 received in the fixing holes 24 of the fan 20. The clip 30 rotates about the second pin 18, with the hook 36 engaging the pin 18 at the right side panel 16, and the pressing plate 32 pressing the fan 20 to fix the fan 20 on the substrate 10. The heat dissipation portions 44 of the heat pipes 40 are received in the holes 51 of the fin assembly 50. The third flange 59 at the left lateral side of the third fin unit 56 is located on the step 1262 of the supporting bar 126, whereby the fin assembly 50 is supported by the supporting bar 126. The fan 20 is received in the receiving space 510 of the fin assembly 50 and spaced from the fin assembly 50. In other words, the fan 20 has no contact with the fin assembly 50.

In use, cooling air generated by the fan 20 flows not only through the channels of the fin assembly 50, but also through the holes 53 and the openings 55 of the fin assembly 50. The fan 20 is directly fixed on the rectangular plate 14 of the substrate 10, but not to the fin assembly 50. The vibration of the fan 20 is now isolated from the fin assembly 50, and undesirable noise generated by the vibration of the fin assembly 50 is eliminated.

It is believed that the present disclosure and its advantages will be understood from the foregoing description, and it will be apparent that various changes may be made thereto without departing from the spirit and scope of the disclosure or sacrificing all of its material advantages, the examples hereinbefore described merely being preferred or exemplary embodiments of the disclosure.

Claims

1. A heat dissipation device comprising:

a substrate comprising two blocks formed thereon and two panels extending therefrom;

a fin assembly comprising a plurality of parallel fins located on the substrate with a plurality of channels defined thereamong with a receiving space being defined in the fin assembly; and

a fan located on the substrate, the fan being attached to the two blocks and positioned between the two panels and received in the receiving space of the fin assembly and spaced from the fin assembly.

2. The heat dissipation device as claimed in claim 1, further comprising a plurality of heat pipes connecting the substrate and the fin assembly.

3. The heat dissipation device as claimed in claim 1, wherein the substrate comprises a square plate and a rectangular plate extending from an end thereof, the two panels sandwiching the rectangular plate and the blocks being formed on the rectangular plate and the fan being located on the rectangular plate.

4. The heat dissipation device as claimed in claim 3, wherein the two blocks connect the two panels, respectively.

5. The heat dissipation device as claimed in claim 4, wherein a bulge extends from each of the blocks and passes a corner of the fan.

6. The heat dissipation device as claimed in claim 3, wherein a slot is defined in a free end of each of the two panels, and a pin is received in the slot.

7. The heat dissipation device as claimed in claim 6, further comprising a clip fixing the fan onto the substrate, the clip having one end pivotably engaged with the pin at one panel, and another end engaged with the pin at another panel.

8. The heat dissipation device as claimed in claim 7, wherein the clip comprises a pressing plate, two flexible plates extending from two opposite ends of the pressing plate, and two claws extending from a free end of each of the flexible plates, a sleeve being formed at a free end of one claw corresponding to one panel, receiving the pin at the one panel, and a hook being formed at a free end of another claw corresponding to the another panel for engaging the pin at the another panel.

9. The heat dissipation device as claimed in claim 1, wherein each of the fins of the fin assembly comprises a main body and two flanges extending downwardly from two lateral sides of the main body.

10. The heat dissipation device as claimed in claim 9, further comprising a supporting bar bending upwardly from a lateral side of the substrate and a step formed on a top of the supporting bar for supporting one of the flanges of one of the fins thereon.

11. A heat dissipation device comprising:

a substrate;

a fin assembly comprising a first fin unit, a second fin unit, and a third fin unit, the third fin unit located on the substrate, the second fin unit located on the third fin unit, the first fin unit located on the first fin unit, and a receiving space being defined in the second and third fin units;

a plurality of heat pipes each comprising a heat absorption portion arranged on the substrate and two heat dissipation portions extending upwardly from two ends of the heat absorption and inserting into the first, second and third fin units; and

a fan fixed on the substrate by a clip, the fan being received in the receiving space of the fin assembly and spaced from the fin assembly.

12. The heat dissipation device as claimed in claim 11, wherein the first and second fin units each comprise a plurality of parallel main bodies and two flanges bending downwardly from two lateral sides of each of the main bodies, and the third fin unit comprises a main body and two flanges bending downwardly from two lateral sides of the main body of the third fin unit, the flanges of the third fin unit being higher than the flanges of the first and second fin units.

13. The heat dissipation device as claimed in claim 12, wherein a supporting bar bends upwardly from a lateral side of the substrate and a step is formed on a top of the supporting bar for supporting one of the flanges of the third fin unit thereon.

14. The heat dissipation device as claimed in claim 12, wherein a receiving hole is defined near an end of each of the main bodies of the second and third fin units to cooperatively define the receiving space.

15. The heat dissipation device as claimed in claim 12, wherein an opening and a plurality of holes are defined in each of the main bodies of the first, second and third fin units, and for cooling air generated by the fan to flow.

16. The heat dissipation device as claimed in claim 11, wherein the substrate comprises a square plate, two panels extending from an end of the square plate, and a rectangular plate extending from the end of the square plate and positioned between the two panels, the fan located on the rectangular plate and between the two panels.

17. The heat dissipation device as claimed in claim 16, wherein two blocks are formed on the rectangular plate securing the fan, and two bulges are respectively formed on the two blocks for insertion into corners of the fan.

18. The heat dissipation device as claimed in claim 17, wherein two pins are received in free ends of the two panels respectively, and the clip presses the fan with one end thereof pivoted to one pin, and another end thereof remains engaged with the other pin.