Patents by Inventor Yi Su

Yi Su has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220256059
    Abstract: An imaging lens system includes a plastic lens element, a lens barrel and a light-absorbing coating layer. The plastic lens element is accommodated in the lens barrel and has an outer annular surface. The lens barrel includes a plate portion and a lateral wall portion. An optical axis of the imaging lens system passes through a light-passable hole of the plate portion. The lateral wall portion is connected to the plate portion and extends along a direction substantially parallel to the optical axis. The light-absorbing coating layer has an inner surface and an outer surface. The inner surface faces and is fixed on the outer annular surface of the plastic lens element. The outer surface is located opposite to the inner surface and in physical contact with the lateral portion of the lens barrel.
    Type: Application
    Filed: May 24, 2021
    Publication date: August 11, 2022
    Applicant: LARGAN PRECISION CO., LTD.
    Inventors: Jyun-Jia CHENG, Heng Yi SU, Ming-Ta CHOU, Chen-Yi HUANG
  • Publication number: 20220248968
    Abstract: A wearable device includes a substrate, at least one light emitting component mounted on one side of the substrate and configured to emit light on at least one optical wavelength band, and at least one lens disposed on an out-light side of the at least one light emitting component, where each lens corresponds to at least one light emitting component, and each lens is capable of reducing a divergence angle of light emitted by the at least one light emitting component corresponding to the lens.
    Type: Application
    Filed: June 20, 2020
    Publication date: August 11, 2022
    Inventors: Yi Xi, Shiyou Sun, Dan Su
  • Publication number: 20220252824
    Abstract: An imaging lens assembly includes a plastic barrel and an optical element set. The optical element set includes an optical lens element, a light blocking sheet and a light-shielding layer. At least one surface of an object-side peripheral surface and an image-side peripheral surface of the optical lens element includes an annular side wall. An annular abutting surface of the light blocking sheet and the annular side wall of the optical lens element are disposed correspondingly to each other. The light-shielding layer surrounds a central opening of the light blocking sheet and includes an annular concave-curved portion. The annular concave-curved portion is for retaining the light blocking sheet, so that there is no relative displacement in a direction parallel to an optical axis between the annular abutting surface of the light blocking sheet and the annular side wall of the optical lens element.
    Type: Application
    Filed: April 29, 2022
    Publication date: August 11, 2022
    Inventors: Jyun-Jia CHENG, Heng-Yi SU, Ming-Ta CHOU, Ming-Shun CHANG
  • Publication number: 20220251218
    Abstract: The invention relates to a method of overcoming immune suppression in tumor microenvironment or stimulating immune response against cancer, comprising administering to a subject a combination of a histone deacetylase (HDAC) inhibitor and a tyrosine kinase inhibitor (TKI).
    Type: Application
    Filed: February 10, 2021
    Publication date: August 11, 2022
    Inventors: Cheng-Han CHOU, Yi-Hong WU, Jia-Shiong CHEN, Ye-Su CHAO, Chia-Nan CHEN
  • Patent number: 11402407
    Abstract: A positionable probe card includes a space transformer, a plurality of positioning pins, and a probe head. The space transformer includes a space transforming substrate, the space transforming substrate includes a plurality of apertures, and the positioning pins are respectively fixed in the apertures. The probe head includes a plurality of positioning holes, and the positioning pins are respectively inserted into corresponding positioning holes. In addition, a method of manufacturing a positionable probe card is also disclosed herein.
    Type: Grant
    Filed: December 10, 2020
    Date of Patent: August 2, 2022
    Assignee: MPI Corporation
    Inventors: Zhi-Wei Su, Tzung-Je Tzeng, Wen-Chi Chen, Huo-Kang Hsu, Hsueh-Chih Wu, Sheng-Wei Lin, Chin-Yi Lin, Che-Wei Lin, Jian-Kai Hong, Shu-Jui Chang
  • Patent number: 11393434
    Abstract: A method, a processing device and a display system for information display are provided. The system includes a display being light transmissive, at least one first information extraction device, at least one second information extraction device, and a processing device. The processing device is connected to the display, the first information extraction device and the second information extraction device. The first information extraction device is configured to extract a user's position information and posture information. The second information extraction device is configured to extract a target object's position information and posture information.
    Type: Grant
    Filed: November 30, 2020
    Date of Patent: July 19, 2022
    Assignee: Industrial Technology Research Institute
    Inventors: Yu-Hsuan Su, Tzu-Yi Yu, Yu-Hsiang Tsai, Kuan-Ting Chen
  • Patent number: 11392749
    Abstract: A method of generating a netlist of an IC device includes receiving gate region information of the IC device. The gate region information includes a width of the gate region, the width extending at least from a first edge of an active region to a second edge of the active region, a location of a gate via positioned within the active region and along the width, and a first gate resistance value corresponding to the gate region. The method includes determining a second gate resistance value based on the location and the width, and modifying the netlist based on the second gate resistance value.
    Type: Grant
    Filed: November 18, 2020
    Date of Patent: July 19, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Ke-Ying Su, Jon-Hsu Ho, Ke-Wei Su, Liang-Yi Chen, Wen-Hsing Hsieh, Wen-Koi Lai, Keng-Hua Kuo, KuoPei Lu, Lester Chang, Ze-Ming Wu
  • Publication number: 20220223703
    Abstract: The present application provides a method for forming a sidewall protection layer in a heavily N-type doped shielding polysilicon for reducing gate to source leakage in a shielded gate trench metal-oxide-semiconductor field effect transistor (SGT MOSFET). In the process of forming a shielding polysilicon sidewall is manufactured by using a secondary oxidation layer forming process, so as to increase a thickness of an oxide in a top region of the shielding polysilicon and a thickness of an oxide of a trench sidewall in a transition region between the shielding polysilicon and an N-type doped gate polysilicon to solve the problem of serious gate to source leakage current.
    Type: Application
    Filed: January 11, 2021
    Publication date: July 14, 2022
    Inventors: Yi Su, Hong Chang
  • Publication number: 20220223708
    Abstract: The present application provides a shielded gate trench (SGT) semiconductor apparatus and a manufacturing method thereof. The SGT semiconductor apparatus includes a heavily N-type doped semiconductor substrate; an N-type epitaxial layer formed on the semiconductor substrate; at least one trench structure formed on the epitaxial layer and accommodating at least one gate polysilicon layer, where the trench structure includes a shielding polysilicon layer and an inter-polysilicon oxide layer; a P-type doped body and an N-type doped source layer formed on the epitaxial layer; a contact region formed for the source and the shield polysilicon connected to a source metal and the gate polysilicon connected to a gate meal. The SGT semiconductor apparatus is surrounded by a shield polysilicon termination trench; the gate polysilicon connected to the gate metal bus line is made outside the active region across the shield polysilicon termination trench.
    Type: Application
    Filed: January 11, 2021
    Publication date: July 14, 2022
    Inventor: Yi SU
  • Publication number: 20220216103
    Abstract: A method includes the following steps. A seed layer is formed over a structure having at least one semiconductor die. A first patterned photoresist layer is formed over the seed layer, wherein the first patterned photoresist layer includes a first opening exposing a portion of the seed layer. A metallic wiring is formed in the first opening and on the exposed portion of the seed layer. A second patterned photoresist layer is formed on the first patterned photoresist layer and covers the metallic wiring, wherein the second patterned photoresist layer includes a second opening exposing a portion of the metallic wiring. A conductive via is formed in the second opening and on the exposed portion of the metallic wiring. The first patterned photoresist layer and the second patterned photoresist layer are removed. The metallic wiring and the conductive via are laterally wrapped around with an encapsulant.
    Type: Application
    Filed: March 27, 2022
    Publication date: July 7, 2022
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Po-Yuan Teng, Bor-Rung Su, De-Yuan Lu, Hao-Yi Tsai, Tin-Hao Kuo, Tzung-Hui Lee, Tai-Min Chang
  • Publication number: 20220216307
    Abstract: A method includes forming a gate dielectric comprising a portion extending on a semiconductor region, forming a barrier layer comprising a portion extending over the portion of the gate dielectric, forming a work function tuning layer comprising a portion over the portion of the barrier layer, doping a doping element into the work function tuning layer, removing the portion of the work function tuning layer, thinning the portion of the barrier layer, and forming a work function layer over the portion of the barrier layer.
    Type: Application
    Filed: March 28, 2022
    Publication date: July 7, 2022
    Inventors: Hsin-Yi Lee, Ya-Huei Li, Da-Yuan Lee, Ching-Hwanq Su
  • Publication number: 20220214351
    Abstract: A fluorescent dye, as well as a preparation method and uses thereof, wherein the fluorescent dye is sensitive and specific to viscosity and has low background fluorescence; it can also be used as a fluorescent activated and lighted probe used for fluorescent labeling, quantification or monitoring of protein, enzymes or nucleic acid.
    Type: Application
    Filed: April 27, 2020
    Publication date: July 7, 2022
    Inventors: Linyong ZHU, Yi YANG, Dasheng ZHANG, Xianjun CHEN, Qiuning LIN, Ni SU
  • Publication number: 20220214379
    Abstract: A probe head includes a middle die, upper and lower die units, at least one of which includes inner and outer dies detachably fastened to the middle die and each other, and a plurality of buckled probes inserted through the upper and lower die units. The inner die has an outer connecting surface connected with an inner surface of the outer die, where an installation recess is provided, an inner connecting surface connected with the middle die, and a probe installation section having a protruding portion protruding from the outer connecting surface and located in the installation recess, and a recessed portion recessed from the inner connecting surface and located correspondingly to the protruding portion. The protruding portion and the installation recess have a horizontal distance therebetween. Therefore, the outer die is horizontally fine adjustable to make the positions of the probes meet the requirement.
    Type: Application
    Filed: December 29, 2021
    Publication date: July 7, 2022
    Applicant: MPI CORPORATION
    Inventors: CHIN-YI LIN, KENG-MIN SU, CHE-WEI LIN, HSIN-CHENG HUNG
  • Publication number: 20220214380
    Abstract: A heat dissipatable die unit includes an outer die, a metal heat dissipating layer and an inner die piled in order. The inner die includes a probe installation section, and a peripheral portion surrounding the probe installation section and having an inner connecting surface for being connected to a die and an outer connecting surface opposite thereto. The probe installation section has a recessed portion recessed from the inner connecting surface, and a protruding portion protruding from the outer connecting surface, thereby forming a level difference portion bordering the peripheral portion. The outer die includes an installation recess and a supporting portion surrounding the installation recess. The installation recess is recessed from an inner surface of the supporting portion and accommodates the protruding portion of the inner die. The metal heat dissipating layer is disposed between the peripheral portion and the supporting portion to attain heat dissipating effect.
    Type: Application
    Filed: January 5, 2022
    Publication date: July 7, 2022
    Applicant: MPI CORPORATION
    Inventors: CHIN-YI LIN, KENG-MIN SU, CHE-WEI LIN, KO-CHUN WU
  • Publication number: 20220203544
    Abstract: A mechanical arm calibration system and a mechanical arm calibration method are provided. The method includes: locating a position of an end point of a mechanical arm in a three-dimensional space to calculate an actual motion trajectory of the end point when the mechanical arm is operating; retrieving link parameters of the mechanical arm, randomly generating sets of particles including compensation amounts for the link parameters through particle swarm optimization (PSO), importing the compensation amounts of each of the sets of particles into forward kinematics after addition of the corresponding link parameters, to calculate an adaptive motion trajectory of the end point; calculating position errors between the adaptive motion trajectory and the actual motion trajectory of each of the sets of particles for a fitness value of the PSO to estimate a group best position; and updating the link parameters by the compensation amounts corresponding to the group best position.
    Type: Application
    Filed: April 1, 2021
    Publication date: June 30, 2022
    Applicant: Industrial Technology Research Institute
    Inventors: Jun-Yi Jiang, Yen-Cheng Chen, Chung-Yin Chang, Guan-Wei Su, Qi-Zheng Yang
  • Patent number: 11369690
    Abstract: Disclosed herein is a bi-specific antibody that specifically directs a therapeutic agent to a cancer cell by targeting a tumor antigen of the cancer cell, and thereby suppressing the growth of the cancer or blocking the invasion or metastasis of the cancer. The bi-specific antibody of the present disclosure includes a first antigen binding site that binds to polyethylene glycol (PEG); and a second antigen binding site that binds to a target ligand, such as a tumor antigen.
    Type: Grant
    Filed: August 24, 2018
    Date of Patent: June 28, 2022
    Assignee: ACADEMIA SINICA & KAOHSIUNG MEDICAL UNIVERSITY
    Inventors: Steven R Roffler, Tian-Lu Cheng, Chien-Han Kao, Bing-Mae Chen, Yu-Cheng Su, Hsin-Yi Tung, Kuo-Hsiang Chuang
  • Patent number: 11374127
    Abstract: A device, structure, and method are provided whereby an insert layer is utilized to provide additional support for weaker and softer dielectric layer. The insert layer may be applied between two weaker dielectric layers or the insert layer may be used with a single layer of dielectric material. Once formed, trenches and vias are formed within the composite layers, and the insert layer will help to provide support that will limit or eliminate undesired bending or other structural motions that could hamper subsequent process steps, such as filling the trenches and vias with conductive material.
    Type: Grant
    Filed: July 27, 2020
    Date of Patent: June 28, 2022
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yao-Jen Chang, Chih-Chien Chi, Chen-Yuan Kao, Hung-Wen Su, Kai-Shiang Kuo, Po-Cheng Shih, Jun-Yi Ruan
  • Patent number: 11360839
    Abstract: A system and method for logging error data from a central processing unit on a computer system using a dedicated crash dump device, is disclosed. The central processing unit has a management engine. The central processing unit sends an error signal. The dedicated crash dump device is coupled to the central processing unit to receive the error signal. A storage device is coupled to the crash dump device. The crash dump device sends a request to the central processing unit for error data. The crash dump device receives error data from the central processing unit. The crash dump device stores the error data in the storage device.
    Type: Grant
    Filed: February 26, 2021
    Date of Patent: June 14, 2022
    Assignee: QUANTA COMPUTER INC.
    Inventors: Ming-Chih Hsiao, Chih-Chia Huang, Tsai-I Yen, Ting-Yi Su
  • Patent number: 11353676
    Abstract: An imaging lens assembly includes a plastic barrel and an optical element set. The optical element set includes an optical lens element, a light blocking sheet and a light-shielding layer. At least one surface of an object-side peripheral surface and an image-side peripheral surface of the optical lens element includes an annular side wall. An annular abutting surface of the light blocking sheet and the annular side wall of the optical lens element are disposed correspondingly to each other. The light-shielding layer surrounds a central opening of the light blocking sheet and includes an annular concave-curved portion. The annular concave-curved portion is for retaining the light blocking sheet, so that there is no relative displacement in a direction parallel to an optical axis between the annular abutting surface of the light blocking sheet and the annular side wall of the optical lens element.
    Type: Grant
    Filed: July 30, 2020
    Date of Patent: June 7, 2022
    Assignee: LARGAN PRECISION CO., LTD.
    Inventors: Jyun-Jia Cheng, Heng-Yi Su, Ming-Ta Chou, Ming-Shun Chang
  • Patent number: 11349094
    Abstract: An organic light emitting element includes a first electrode a second electrode that faces the first electrode, an emission layer between the first electrode and the second electrode, the emission layer including quantum dots, and a hole transport layer between the first electrode and the emission layer. The quantum dots include at least one of a Group I-VI compound, a Group II-VI compound, and a Group III-VI compound. The hole transport layer includes at least one of a p-doped Group I-VI compound, a p-doped Group II-VI compound, and a p-doped Group III-VI compound.
    Type: Grant
    Filed: December 1, 2016
    Date of Patent: May 31, 2022
    Assignee: Samsung Display Co., Ltd.
    Inventors: Dong Chan Kim, Yi Su Kim, Byoung Duk Lee, Yoon Hyeung Cho