Abstract: The present application provides a method for forming a sidewall protection layer in a heavily N-type doped shielding polysilicon for reducing gate to source leakage in a shielded gate trench metal-oxide-semiconductor field effect transistor (SGT MOSFET). In the process of forming a shielding polysilicon sidewall is manufactured by using a secondary oxidation layer forming process, so as to increase a thickness of an oxide in a top region of the shielding polysilicon and a thickness of an oxide of a trench sidewall in a transition region between the shielding polysilicon and an N-type doped gate polysilicon to solve the problem of serious gate to source leakage current.

Abstract: A pixel drive circuit and a drive method thereof, a display panel, and a terminal device, which are applied to the field of terminal technologies. The pixel drive circuit includes a first reset module, a light-emitting control module, and a drive module, and both the first reset module and the light-emitting control module are connected to a light-emitting control signal terminal, where one of the first reset module and the light-emitting control module is turned on when the light-emitting control signal is at a high level, and the other of the first reset module and the light-emitting control module is turned on when the light-emitting control signal is at a low level. Therefore, by increasing the frequency of the light-emitting control signal to greater than 120 Hz, a problem of a phenomenon of frequent flickering on an image during low-brightness display may be improved.

Abstract: An imaging lens assembly includes a plurality of optical elements, an optical axis passing through the optical elements is defined, and the optical elements include at least one mixing optical element. The mixing optical element includes a glass effective optical portion and a plastic outer peripheral portion. The optical axis passes through the glass effective optical portion. The plastic outer peripheral portion surrounds and physically contacts the glass effective optical portion, and forms an aperture hole. The plastic outer peripheral portion has at least three recess structures arranged and disposed along a circumference direction around the optical axis. The recess structures extend from one of the object side and the image side of the imaging lens assembly to the other thereof along a direction parallel to the optical axis. Each of the recess structures includes an outer surface, an inner surface and two side surfaces.

Abstract: An imaging lens assembly module includes an imaging lens assembly, a light path folding element, a first lens barrel, a second lens barrel, a base and a plurality of rolling bearings. The imaging lens assembly includes a plurality of plastic lens elements, and defines a first optical axis passing through the plastic lens elements. The first lens barrel contains one or more of the plastic lens elements. The second lens barrel contains another one or more of the plastic lens elements. The base includes a guiding groove structure, and the guiding groove structure extends continuously along a direction parallel to the first optical axis. The rolling bearings interposed between the first lens barrel and the base and the rolling bearings interposed between the second lens barrel and the base are interposed in the guiding groove structure.

Abstract: An imaging camera driving module includes a lens unit, a driving mechanism, a sensing mechanism and an image surface. At least a part of the driving mechanism is coupled to the lens unit to drive the lens unit to move in a direction parallel to the optical axis. The sensing mechanism includes sensing magnets fixed to the lens unit and sensing elements not facing the driving mechanism. The sensing elements are disposed on an image side of the imaging lens assembly of the lens unit and corresponding to the sensing magnets. The sensing elements are configured to detect a relative position of the sensing magnets. The image surface is disposed on the image side of the imaging lens assembly, and the optical axis passes through the image surface. The sensing mechanism is configured to detect a tilt of the optical axis with respect to the central axis.

Abstract: A method includes forming a dummy gate stack on a semiconductor region, forming gate spacers on sidewalls of the dummy gate stack, removing the dummy gate stack to form a recess between the gate spacers, and forming a silicon oxide layer on the semiconductor region. The silicon oxide layer extends into the recess. A high-k dielectric layer is deposited over the silicon oxide layer, and a silicon layer is deposited over the high-k dielectric layer. The silicon layer extends into the recess. The high-k dielectric layer and the silicon layer are in-situ deposited in a same vacuum environment. The method further includes performing an annealing process on the silicon layer and the high-k dielectric layer, removing the silicon layer, and forming a gate electrode over the high-k dielectric layer. The gate electrode fills the recess.

Abstract: An imaging lens driving module includes a base, a casing, a driving mechanism and a damping element. The base has an opening, and the casing has a central aperture corresponding to the opening. The casing includes a plastic frame portion and a metal structure portion. The plastic frame portion is coupled to the base. The metal structure portion has a plurality of pins extending towards the base. The driving mechanism is disposed in the casing. The driving mechanism is configured to drive the lens unit to move in a direction parallel to an optical axis. The damping element is connected to the pins and the lens unit. The metal structure portion is insert-molded with the plastic frame portion to form the casing. The pins are located closer to the optical axis than the other part of the metal structure portion to the optical axis.

Abstract: A method performed by a user equipment (UE) configured with a plurality of antenna panels. Each antenna panel is configured to beamform over a millimeter wave (mmWave) frequency band. The method includes identifying a predetermined condition corresponding to a first antenna panel of the plurality of antenna panels, selecting a second antenna panel of the plurality of antenna panels based on identifying the predetermined condition corresponding to the first antenna panel and transmitting a beam via the second antenna panel based on the selection.

Abstract: High voltage semiconductor devices are described herein. An exemplary semiconductor device includes a first doped region and a second doped region disposed in a substrate. The first doped region and the second doped region are oppositely doped and adjacently disposed in the substrate. A first isolation structure and a second isolation structure are disposed over the substrate, such that each are disposed at least partially over the first doped region. The first isolation structure is spaced apart from the second isolation structure. A resistor is disposed over a portion of the first isolation structure and electrically coupled to the first doped region. A field plate disposed over a portion of the second doped region and electrically coupled to the second doped region.

Abstract: Devices and methods related to metal oxide varistor (MOV) having modified edge. In some embodiments, a MOV can include a metal oxide layer having first side and second sides, first and second electrodes implemented on the first and second sides of the metal oxide layer, respectively, with each electrode including a laterally inner portion and an edge portion. The edge portion of at least the first electrode can have a flared profile. In some embodiments, two of such MOVs can be joined to provide a sealed chamber defined by shapes of the first sides of the respective metal oxide layers and enclosing a gas therein, such that the sealed chamber with the gas and the first electrodes of the two MOVs form a gas discharge tube (GDT).

Abstract: Methods for depositing a thin film with improved film qualities on a hydrogen-terminated surface of a substrate are disclosed. The methods may comprise an atomic layer deposition (ALD) process comprising a plurality of deposition cycles comprising contacting the substrate with a first vapor phase metal halide or metalorganic reactant, contacting the substrate with the second vapor phase reactant, and contacting the substrate with a growth inhibitor. A growth inhibitor may be a non-consumable agent that is not incorporated into the deposited film during the deposition process and helps improve the properties of the deposited film. The growth inhibitor may comprise a vapor phase halide, such as HCl, or an organic molecule.

Abstract: An imaging lens driving module includes a base, a casing, a driving mechanism and a damping element. The base has an opening, and the casing has a central aperture corresponding to the opening. The casing includes a plastic frame portion and a metal structure portion. The plastic frame portion is coupled to the base. The metal structure portion has a plurality of pins extending towards the base. The driving mechanism is disposed in the casing. The driving mechanism is configured to drive the lens unit to move in a direction parallel to an optical axis. The damping element is connected to the pins and the lens unit. The metal structure portion is insert-molded with the plastic frame portion to form the casing. The pins are located closer to the optical axis than the other part of the metal structure portion to the optical axis.

Abstract: A lens driving apparatus includes an imaging lens assembly, a driving mechanism and a carrier element. The imaging lens assembly includes at least one plastic lens element. The plastic element includes an effective optical portion, a peripheral portion and a light-shielding layer. The peripheral portion surrounds the effective optical portion. The light-shielding layer is disposed on an object side of the peripheral and surrounds the effective optical portion. The driving mechanism includes at least one coil and at least one magnet. The magnet is disposed correspondingly with the coil. Both of the plastic element and the one of the coil and the magnet are directly connected with the carrier element. An outer surface of the carrier element includes an assembling structure. The assembling structure is directly contacted with one of the coil and the magnet. The assembling structure and the carrier element are made integrally.

Abstract: An imaging lens system includes a plastic lens element, a lens barrel and a light-absorbing layer. The plastic lens element is accommodated in the lens barrel and has an outer annular surface. The lens barrel includes a plate portion and a lateral wall portion. An optical axis of the imaging lens system passes through a light-passable hole of the plate portion. The lateral wall portion is connected to the plate portion and extends along a direction substantially parallel to the optical axis. The light-absorbing layer has an inner surface and an outer surface. The inner surface faces and is fixed on the outer annular surface of the plastic lens element. The outer surface is located opposite to the inner surface and in physical contact with the lateral portion of the lens barrel.

Abstract: Devices, systems and methods are provided to implement key generation for secure pairing between first and second devices using embedded out-of-band (OOB) key generation and without requiring the devices to have input/output (IO) capability to enter authentication information. Bluetooth Smart or Low Energy (BLE) OOB pairing option can be used for pairing medical devices with added security of OOB key generation. The OOB key generation comprises providing first and second devices with the same predefined credential and secure hashing algorithm, and making input of the hashing algorithm of the first and second devices the same. The first device transmits unique data to second device (e.g., via BLE advertising) to share and compute a similar input. The first and second devices use the credential and shared data with the hashing function to generate a key that is the same at each of first and second devices.

Abstract: Embodiments include a user equipment (UE) and methods performed by the UE. The methods include receiving a measurement configuration request from a network, in response to the measurement configuration request, measuring a quality of one or more uplink (UL) carrier aggregation (CA) combinations, wherein each UL CA combination comprises a plurality of component carriers, generating a message that includes the quality of the one or more UL CA combinations and transmitting the message to the network. Further embodiments include the above operations being performed as a set of instructions executed by a processor or an integrated circuit that includes circuitry to perform the operations.

Abstract: An imaging camera driving module includes a lens unit, a driving mechanism, a sensing mechanism and an image surface. At least a part of the driving mechanism is coupled to the lens unit to drive the lens unit to move in a direction parallel to the optical axis. The sensing mechanism includes sensing magnets fixed to the lens unit and sensing elements not facing the driving mechanism. The sensing elements are disposed on an image side of the imaging lens assembly of the lens unit and corresponding to the sensing magnets. The sensing elements are configured to detect a relative position of the sensing magnets. The image surface is disposed on the image side of the imaging lens assembly, and the optical axis passes through the image surface. The sensing mechanism is configured to detect a tilt of the optical axis with respect to the central axis.

Abstract: A system and method for predicting mild cognitive impairment (MCI) related diagnosis and prognosis utilizing deep learning. More specifically, the system and method produce predictions of MCI conversions to Alzheimer's/dementia and prognosis related thereof. Using available medical imaging and non-imaging data a diagnosis and prognosis model is a deep learned model trained using transfer learning. An MCI-DAP server may then receive a request from a clinician to process predictions related to a target patient's diagnosis or prognosis. The target patient's medical data is retrieved and used to create a model for the target patient. Then details of the target patient's model and the diagnosis and prognosis model are compared, a prediction is generated, and the prediction is returned to the clinician. As new medical data becomes available it is fed into the respective model to improve accuracy and update predictions.

Abstract: The present application provides a shielded gate trench (SGT) semiconductor apparatus and a manufacturing method thereof. The SGT semiconductor apparatus includes a heavily N-type doped semiconductor substrate; an N-type epitaxial layer formed on the semiconductor substrate; at least one trench structure formed on the epitaxial layer and accommodating at least one gate polysilicon layer, where the trench structure includes a shielding polysilicon layer and an inter-polysilicon oxide layer; a P-type doped body and an N-type doped source layer formed on the epitaxial layer; a contact region formed for the source and the shield polysilicon connected to a source metal and the gate polysilicon connected to a gate meal. The SGT semiconductor apparatus is surrounded by a shield polysilicon termination trench; the gate polysilicon connected to the gate metal bus line is made outside the active region across the shield polysilicon termination trench.

Abstract: An imaging lens system includes a plastic lens element. The plastic lens element includes an optical effective portion and an outer ring portion. The optical axis passes through the optical effective portion. The outer ring portion surrounds the optical effective portion and includes an annular groove structure, a conical surface, a flat abutting portion and a full-circle connecting portion. The annular groove structure is tapered off. Each of the conical surface and the flat abutting portion is located closer to the optical effective portion than the annular groove structure. The flat abutting portion is in physical contact with an optical element. The full-circle connecting portion is connected to the annular groove structure and located farther away from the optical effective portion than the annular groove structure. The annular groove structure has an annular bottom end surface extending in a direction substantially perpendicular to the optical axis.