Abstract: Provided is a lens assembly driving module including a photographing lens assembly, a first driving mechanism and a second driving mechanism. The photographing lens assembly includes N lens elements and has an optical axis passing through the N lens elements. The first driving mechanism drives at least N/2 said lens elements to move along the optical axis of the photographing lens assembly. The second driving mechanism enables a relative distance along the optical axis of two adjacent ones of the N lens elements to vary. Therefore, any specific one of the lens elements is capable of being driven to optimize optical imaging resolution of various fields of view independently within a real shot at different object distances.

Abstract: A data processing system in embodiments of this application includes a storage layer, a virtual bus, and a service layer. The storage layer includes a plurality of storage devices, and the service layer includes a plurality of services. The storage device and/or service may write registration information into the virtual bus after registration, and the registered storage device or service may discover another device or service. Data may move between the storage devices, between the storage devices and the services, and between the services through the virtual bus. In this way, the plurality of devices can discover and communicate with each other when the devices are not directly connected to each other.

Abstract: An optical display structure is provided, including a basing layer, a lighting source layer and a capping layer. The basing layer includes a substrate and at least one trace configuration layer. The lighting source layer is disposed on the basing layer at d emits a plurality of lights for providing a light source. The capping layer is disposed above the lighting source layer to seal the optical display structure. An upper light shielding layer is alternatively disposed on the lighting source layer to shield cross-talk interferences of the emitted lights. A lower light shielding layer is alternatively disposed below the basing layer to shield reflected light from the back side of the substrate. Preferably, both the upper and lower light shielding layers can be disposed at the same time to shield cross-talk interferences and reflected light for providing an optimized inventive effect of the present invention.

Abstract: Embodiments of this application provide a TFT substrate, a display module, and an electronic device. The TFT substrate includes a base, a first active layer, a first source drain layer, a first gate, a plurality of data lines, and a wiring layer. The wiring layer is disposed on a side that is of the first source drain layer and that is away from the base. The wiring layer includes a plurality of first metal wires. One end of each of the plurality of first metal wires is coupled to each of the plurality of data lines, and the other end of each of the plurality of first metal wires is used to be coupled to a display driver chip.

Abstract: A display apparatus includes a base substrate, a light emitting structure disposed on the base substrate, and a thin film encapsulation layer disposed on the light emitting structure and including at least one inorganic layer and at least one organic layer. The at least one inorganic layer includes a high density layer having a density of greater than or equal to about 2.0 g/cm3 and a low density layer having a density of less than about 2.0 g/cm3. The high density layer and the low density layer are in contact with each other.

Abstract: A packaged semiconductor includes a substrate and a first component disposed on the substrate. The package includes an underfill that is dispensed under and around the first component. The package also includes a second component disposed on the substrate adjacent to the first component that provides a border to the underfill.

Abstract: A memory device includes a substrate, a controller die, a flip chip die, first and second silicon dies, and bond wires. The controller and flip chip dies are attached to the substrate using connection balls and in electrical communication with each other. The first and second silicon dies include respective first and second contact pad surfaces. The bond wires electrically connect the contact pad surfaces to the substrate so the first and second silicon dies communicate with the controller die. The flip chip die and first and second silicon dies are NAND dies, the flip chip die is configured as SLC memory, and the silicon dies are configured as one of MLC memory, TLC memory, or QLC memory.

Abstract: An active stylus receiving circuit receives a vector data signal transmitted by an active stylus. The vector data signal carries vector data. The vector data includes in-phase data and quadrature data. The active stylus receiving circuit includes an analog-to-digital converter, an interpolation circuit and a demodulation circuit. The analog-to-digital converter samples and converts the vector data signal into digital signal with a plurality of sampling points. The interpolation circuit performs interpolating operation on the digital signal, so as to increase the number of sampling points representing the digital signal, and generate interpolated digital signal. The demodulation circuit performs demodulating operation on the interpolated digital signal to generate demodulated in-phase data and demodulated quadrature data, thereby obtaining demodulated vector data.

Abstract: An imaging lens assembly module includes an imaging lens assembly and a variable aperture module. The imaging lens assembly has an optical axis. The variable aperture module includes a light blocking sheet set, a fixed element, a movable element, and an annular light blocking portion. The light blocking sheet set includes at least two light blocking sheets, wherein the at least two light blocking sheets are mutually stacked along a circumferential direction surrounding the optical axis to form a variable aperture opening. The fixed element has a sidewall structure. The annular light blocking portion surrounds the optical axis to form a fixed aperture opening.

Abstract: An imaging lens assembly includes a plastic barrel and an optical element set. The optical element set includes an optical lens element, a light blocking sheet and a light-shielding layer. At least one surface of an object-side peripheral surface and an image-side peripheral surface of the optical lens element includes an annular side wall. An annular abutting surface of the light blocking sheet and the annular side wall of the optical lens element are disposed correspondingly to each other. The light-shielding layer surrounds a central opening of the light blocking sheet and includes an annular concave-curved portion. The annular concave-curved portion is for retaining the light blocking sheet, so that there is no relative displacement in a direction parallel to an optical axis between the annular abutting surface of the light blocking sheet and the annular side wall of the optical lens element.

Abstract: An imaging lens assembly includes a lens barrel, optical lens elements, an annular retaining element and a nano-microstructure. The optical lens elements include at least one optical lens element disposed in the lens barrel. The annular retaining element is physically contacted with the optical lens element, and the annular retaining element includes an object-side surface, an image-side surface, an outer diameter surface and a light-through hole. The outer diameter surface is connected to the object-side surface and the image-side surface. The light-through hole is formed by gradually tapering from the object-side surface and the image-side surface towards the optical axis. The nano-microstructure has a plurality of irregular ridged convexes. The nano-microstructure is located between a lens barrel area defined via the lens barrel and a lens element area defined via the optical lens element on a direction vertical to the optical axis.

Abstract: A LED display structure and its display module thereof are provided. The LED display module includes a LED array, a substrate disposed below the LED array, and at least one trace configuration layer, which is disposed below the LED array and adjacent to the substrate. The at least one trace configuration layer includes a plurality of wires, and a distribution density of the wires varies according to a distance between the wires and the LED array. When the distance increases, the distribution density of the wires is denser. Otherwise, the distribution density is sparse when the wires are closer to the LED array. In view of the simulation experimental analyses of the present invention, it is believed that at least 30% of the stray light ratio can be reduced so as to enhance the LED display structure with better transparency and image quality.

Abstract: Embodiments of this application provide a refresh rate switching method, an electronic device, and a system. After being in a communication connection to a stylus, the electronic device may display a picture at a first refresh rate. The user may operate the electronic device, so that a refresh rate of the electronic device is switched from the first refresh rate to a second refresh rate. When the user holds the stylus again to approach a screen, the electronic device switches from the second refresh rate to a third refresh rate, where the first frequency is an integer multiple of the third refresh rate; and then after the electronic device sends a wake-up signal to the stylus, the stylus may intercept the wake-up signal, to send an uplink signal, and then the electronic device may receive the uplink signal from the stylus, and may keep signal synchronization with the stylus.

Abstract: Various embodiments of the present disclosure are directed towards a method for forming a semiconductor structure, the method includes forming a buffer layer over a substrate. An active layer is formed on the buffer layer. A top electrode is formed on the active layer. An etch process is performed on the buffer layer and the substrate to define a plurality of pillar structures. The plurality of pillar structures include a first pillar structure laterally offset from a second pillar structure. At least portions of the first and second pillar structures are spaced laterally between sidewalls of the top electrode.

Abstract: Embodiments of this application provide a display panel and a terminal device, and are applied to the field of terminal technologies. The display panel is provided with a connection line, a signal line in an edge display area is extended to a center display area through the connection line and connected to a fan-out lead, and a sequence of input first display data is changed by using a drive chip, so that when an arrangement number of each fan-out lead is different from an arrangement number of a signal line connected to the fan-out lead, second display data output by the drive chip can be transmitted to a correct signal line. In addition, a same drive chip can be applied to different terminal devices, to improve utilization of the drive chip and reduce design costs of the drive chip.

Abstract: A pixel drive circuit and a drive method thereof, a display panel, and a terminal device, which are applied to the field of terminal technologies. The pixel drive circuit includes a first reset module, a light-emitting control module, and a drive module, and both the first reset module and the light-emitting control module are connected to a light-emitting control signal terminal, where one of the first reset module and the light-emitting control module is turned on when the light-emitting control signal is at a high level, and the other of the first reset module and the light-emitting control module is turned on when the light-emitting control signal is at a low level. Therefore, by increasing the frequency of the light-emitting control signal to greater than 120 Hz, a problem of a phenomenon of frequent flickering on an image during low-brightness display may be improved.

Abstract: A display apparatus includes a base substrate, a light emitting structure disposed on the base substrate, and a thin film encapsulation layer disposed on the light emitting structure and including at least one inorganic layer and at least one organic layer. The at least one inorganic layer includes a high density layer having a density of greater than or equal to about 2.0 g/cm3 and a low density layer having a density of less than about 2.0 g/cm3. The high density layer and the low density layer are in contact with each other.

Abstract: Provided is a lens assembly driving module including a photographing lens assembly, a first driving mechanism and a second driving mechanism. The photographing lens assembly includes N lens elements and has an optical axis passing through the N lens elements. The first driving mechanism drives at least N/2 said lens elements to move along the optical axis of the photographing lens assembly. The second driving mechanism enables a relative distance along the optical axis of two adjacent ones of the N lens elements to vary. Therefore, any specific one of the lens elements is capable of being driven to optimize optical imaging resolution of various fields of view independently within a real shot at different object distances.

Abstract: An imaging lens module includes a casing, an imaging lens disposed to the casing, a lens carrier supporting the image lens, an elastic element connected to the lens carrier to provide the lens carrier with a translational degree of freedom along an optical axis, a frame connected to the elastic element such that the lens carrier is movable along the optical axis with respect to the frame, a variable through hole module coupled to the imaging lens and having a light passable hole with a variable aperture size, and a wiring assembly including a fixed wiring part at least partially located closer to the opening than the elastic element and a movable wiring part electrically connected to the fixed wiring part and the variable through hole module. The optical axis passes through lens elements of the imaging lens and the center of the variable through hole module.