Abstract: Embodiments of this specification provide for generating dialogue annotation data. A method includes: obtaining grammar that has been pre-generated in a target scenario, the grammar including a first phrase and a second phrase; the first phrase includes a first intent operation and a first variable of a first intent, where the first variable invokes other phrases. The second phrase assigns a value to the first variable and includes a property acquisition operation and a second variable of a second intent. Generating a target meaning representation of nested phrases for simulating a certain human-machine dialogue by invoking the first phrase and the second phrase in the grammar. Performing the first intent operations based on a property value corresponding to the first variable of the second variable assigned to the first variable.

Abstract: An example method for monitoring volume dependencies for security threats comprises: detecting a request to perform an operation with respect to a volume included in a plurality of volumes included in a storage system; determining, based on a dependency mapping that specifies dependencies between the plurality of volumes, that performance of the operation would affect a dependency between the volume and one or more other volumes included in the plurality of volumes; and determining, based on the determining that the performance of the operation would affect the dependency between the volume and the one or more other volumes, that the request is possibly associated with a security threat against data stored by the storage system.

Abstract: Properly parking personal mobility vehicles (PMVs) is an important for safety and public satisfaction. The large number of daily rides of ride-share PMVs makes it impossible to verify manually that each PMV is properly parked. Aspects of this disclosure include systems and methods for verifying that PMVs are properly parked. These systems and methods can include training a machine learning model on a server. The system can request that users submit images to the server, such that the server can verify that the user properly parked the PMV. The server can transmit a finished indication when it determines that the user properly parked the vehicle. The server can transmit instructions to the user to take various actions when it determines that the user improperly parked the vehicle or when the image is insufficient to determine whether the user properly parked the vehicle.

Abstract: An example method for monitoring for security threats in a container system comprises: monitoring, by a container storage management system configured to manage storage resources for containerized applications deployed on one or more nodes within a container system, activity within the container system; detecting, by the container storage management system based on the monitoring, an anomaly associated with the activity; and determining, by the container storage management system based on the detecting the anomaly, that data stored by the one or more storage resources is possibly being targeted by a security threat.

Abstract: A positive electrode and a battery employing the same encapsulant composition are provided. The positive electrode includes a positive electrode active layer and a first layer, wherein the first layer is disposed on the positive electrode active layer, and the first layer includes a lithium-iron-phosphorus-containing oxide and a first binder. The electric resistance ratio of the first layer to the positive electrode active layer is greater than or equal to 100.

Abstract: An active stylus receiving circuit receives a vector data signal transmitted by an active stylus. The vector data signal carries vector data. The vector data includes in-phase data and quadrature data. The active stylus receiving circuit includes an analog-to-digital converter, an interpolation circuit and a demodulation circuit. The analog-to-digital converter samples and converts the vector data signal into digital signal with a plurality of sampling points. The interpolation circuit performs interpolating operation on the digital signal, so as to increase the number of sampling points representing the digital signal, and generate interpolated digital signal. The demodulation circuit performs demodulating operation on the interpolated digital signal to generate demodulated in-phase data and demodulated quadrature data, thereby obtaining demodulated vector data.

Abstract: An image stabilization lens module includes a lens holder, a light-folding element, a movable carrier, a fixed base, a swing element and a driving mechanism. The movable carrier carries the light-folding element. The fixed base connects the movable carrier via an elastic element. The swing element between the movable carrier and the fixed base includes a main body, a carrier support structure and a base auxiliary structure on a carrier corresponsive surface of the main body, and a base support structure and a carrier auxiliary structure on a base corresponsive surface of the main body. The carrier support structure supports the movable carrier. The base support structure contacts the fixed base. The driving mechanism is for driving the movable carrier to rotate. The carrier auxiliary structure, the base auxiliary structure and the main body are formed in one piece.

Abstract: In a method for writing data to a solid-state drive, both a byte-level write interface and a page-level write interface are provided. Full-page input/output (I/O) data is written to a flash chip through the page-level interface, and small I/O data is written to a storage class memory (SCM) chip through the byte-level interface.

Abstract: Devices, systems and methods are provided to improve pairing between first and second devices to mitigate risk that either device pairs with an unintended device by reducing transmit power to limit communication range between devices to be paired, using minimum and maximum received signal strength thresholds to reject unintended devices, and instructing user to move to another location when multiple devices are detected for pairing. The second device scanning time for detecting advertising signals from the first device is adjusted to detect multiple device co-existence. Pairing is controlled to occur when the second device is the only device that the first device detects.

Abstract: An exposure module includes a light source, a photomask situated optically downstream of the light source, and a wafer table situated optically downstream of the photomask. The wafer table includes a plurality of silicon carbide (SiC) crystalline structures separated from each other by trenches. The exposure module further includes a cleaning scrubber operative to clean the wafer table. The cleaning scrubber includes a circular surface and a plurality of microstructures extending from the circular surface. The microstructures are tapered from a first width to a second width in a direction away from the circular surface. The second width is less than a width of the plurality of trenches between the SiC crystalline structures of the wafer table.

Abstract: High voltage semiconductor devices are described herein. An exemplary semiconductor device includes a substrate, a first doped region disposed in the substrate and doped with a first doping polarity, and a second doped region disposed in the substrate and horizontally outside the first doped region. The second doped region is doped with a second doping polarity opposite to the first doping polarity. The semiconductor device further includes a third doped region disposed completely within the first doped region. The third doped region is doped with the second doping polarity. The semiconductor device further includes a first isolation structure disposed over the first doped region and spaced apart from the second doped region and the third doped region, a second isolation structure disposed over the first doped region and the third doped region, and a resistor disposed over the first isolation structure.

Abstract: Off-policy evaluation of a new “target” policy is performed using historical data gathered based on a previous “logging” policy to estimate the performance of the target policy. An estimator may be used, wherein either a quality-based estimator or a quality-agnostic estimator is used to weight the difference between an observed reward in the historical data and an estimated reward generated by the target policy. A quality-agnostic estimator may be used to evaluate an importance weight according to a threshold. In such examples, when the importance weight exceeds the threshold, the quality-agnostic estimator clips the importance weight at the threshold, thereby providing an fixed upper bound irrespective of the quality of the reward predictor. In other examples, a quality-based estimator is used, in which an upper bound incorporates the quality of the reward predictor in order to modify an importance weight used by the estimator.

Abstract: Various embodiments of the present application are directed towards an integrated circuit (IC) in which a high voltage metal-oxide-semiconductor (HVMOS) device is integrated with a high voltage junction termination (HVJT) device. In some embodiments, a first drift well and a second drift well are in a substrate. The first and second drift wells border in a ring-shaped pattern and have a first doping type. A peripheral well is in the substrate and has a second doping type opposite the first doping type. The peripheral well surrounds and separates the first and second drift wells. A body well is in the substrate and has the second doping type. Further, the body well overlies the first drift well and is spaced from the peripheral well by the first drift well. A gate electrode overlies a junction between the first drift well and the body well.

Abstract: An imaging lens assembly includes a first optical element and a low-reflection layer. The first optical element has a central opening, and includes a first surface, a second surface and a first outer diameter surface. The first outer diameter surface is connected to the first surface and the second surface. The low-reflection layer is located on at least one of the first surface and the second surface, and includes a carbon black layer, a nano-microstructure and a coating layer. The nano-microstructure is directly contacted with and connected to the carbon black layer, and the nano-microstructure is farther from the first optical element than the carbon black layer from the first optical element. The coating layer is directly contacted with and connected to the nano-microstructure, and the coating layer is farther from the first optical element than the nano-microstructure from the first optical element.

Abstract: A semiconductor structure and method for manufacturing thereof are provided. The semiconductor structure includes a silicon substrate having a first surface, a III-V layer on the first surface of the silicon substrate and over a first active region, and an isolation region in a portion of the III-V layer extended beyond the first active region. The first active region is in proximal to the first surface. The method includes the following operations. A silicon substrate having a first device region and a second device region is provided, a first active region is defined in the first device region, a III-V layer is formed on the silicon substrate, an isolation region is defined across a material interface in the III-V layer by an implantation operation, and an interconnect penetrating through the isolation region is formed.

Abstract: Bonding a full-bridge device and an LLC device in a stack, or forming the full-bridge device and the LLC device on a same substrate, rather than connecting the devices, reduces a chip area associated with a power converter including the full-bridge device and the LLC device. Additionally, the full-bridge device and the LLC device consume less power because parasitic inductance and capacitance are reduced. Additionally, raw materials and production time are conserved that would otherwise have been used to connect the full-bridge device and the LLC device (e.g., via wires).

Abstract: An imaging lens assembly includes optical elements and a light path folding mechanism. The light path folding mechanism is disposed on the optical axis to fold an optical axis at least once, and includes a light folding element, a light blocking structure and a nanostructure layer. The light folding element includes a reflecting surface, an incident surface and an exit surface. The reflecting surface is configured to fold an incident light path towards an exit light path. The light blocking structure is disposed on at least one of the incident surface and the exit surface, and includes a main light blocking portion located on a peripheral portion closest to the optical axis on a cross section passing through the optical axis. The nanostructure layer is continuously distributed over at least one of the incident surface and the exit surface and the main light blocking portion.

Abstract: An imaging lens assembly, having an optical axis, includes an imaging lens set and a lens holding member. The lens holding member accommodates the imaging lens set for aligning the imaging lens set with the optical axis. The lens holding member includes a plurality of light-blocking structures, which are disposed on an object side of the imaging lens set and surround the optical axis for forming a light passing hole. Each of the light-blocking structures is a straight-line shape and has two end points and one central point, and the central point is closer to the optical axis than each of the two end points thereto. A maximum radius of the light passing hole is defined by a position near each of the two end points, and a minimum radius thereof is defined by a position near the central point.

Abstract: The various described embodiments provide a CMP system and a method of using the same. The CMP system includes an imaging device, such as a laser scanner, that obtains an image of a dresser of the CMP system in real time or in-situ with a CMP process. A processing device of the CMP system compares the obtained image with one or more of reference images to determine whether or not the dresser has a defect. The processing device then adjusts the CMP process based on whether or not the dresser includes a defect.

Abstract: An imaging lens assembly module includes an imaging lens assembly, a light path folding element, a first lens barrel, a second lens barrel, a base and a plurality of rolling bearings. The imaging lens assembly includes a plurality of plastic lens elements, and defines a first optical axis passing through the plastic lens elements. The first lens barrel contains one or more of the plastic lens elements. The second lens barrel contains another one or more of the plastic lens elements. The base includes a guiding groove structure, and the guiding groove structure extends continuously along a direction parallel to the first optical axis. The rolling bearings interposed between the first lens barrel and the base and the rolling bearings interposed between the second lens barrel and the base are interposed in the guiding groove structure.