Abstract: A multi-ported register comprises a Global Bit Line (GBL) to couple a gate to a data output line via an output transistor. A Local bit Line (LBL) couples the gate to a first register file cell and a second register file cell, said second register file cell disposed closer to the data output line than the first register file cell. At least one transistor in the first register file cell having a stronger drive current than the at least one transistor in the second register file cell. At least one of, the output transistor, the gate, and the first register file cell of a first bank have a stronger drive current than the corresponding output transistor, the gate and the first register file cell of a second bank said second bank being closer to the data output line.

Abstract: According to some embodiments, provided are a memory cell, a bit-line coupled to the memory cell, a pre-charge circuit coupled to the bit-line to pre-charge the bit-line, and a discharge device coupled to the bit-line to discharge the bit-line prior to a read of the memory cell.

Abstract: A method and apparatus for bus repeater tapering. The sizing of repeaters on a portion of one transmission line is chosen to propagate a signal transition at a particular rate. The sizing of repeaters on a substantially parallel portion of another transmission line, is chosen to propagate a second signal transition at a different rate. Thus, the worst-case capacitance coupling factor between the two transmission lines may be reduced.

Abstract: According to some embodiments, provided are a first signal line, the first signal line coupled to a first repeater, the first repeater to convert a first signal from a received signal level to an output signal level, the first repeater to convert from a first signal level to a second signal level slower than from the second signal level to the first signal level, and a second signal line adjacent to the first signal line, the second signal line coupled to a second repeater adjacent to the first repeater, the second repeater to convert a second signal from a second received signal level to a second output signal level, the second repeater to convert from the first signal level to the second signal level slower than from the second signal level to the first signal level, wherein the received signal level is substantially equivalent to the second output signal level and wherein the second received signal level is substantially equivalent to the output signal level.

Abstract: An approach for power reduction of an integrated circuit device. In response to detecting a change in an activity factor associated with an integrated circuit device from a first activity factor to a second activity factor, a supply voltage and a body bias associated with the integrated circuit device are adjusted based on the second activity factor to reduce power consumption. For one aspect, the supply voltage and body bias are adjusted to maintain a substantially constant operating frequency for the integrated circuit device.

Abstract: An offset line to substantially cancel the capacitive coupling effects of a select line to a memory cell. When the select line transitions to cause a stored memory state in the memory cell to be placed onto a sense line, capacitive coupling from the select line to the sense line is substantially cancelled by capacitive coupling, of an opposite polarity, from an offset line to the sense line. Without the opposing effects of the offset line, the capacitive coupling from the select line would raise the pre-charge voltage level on the sense line, which would then require a longer time to discharge down to the input threshold of a sense gate that detects the stored state that was in the memory cell.

Abstract: A system and method to reduce leakage power while minimizing performance penalties and noise is disclosed. In accordance with one embodiment of the invention, the system includes at least one sleep transistor operatively coupleable between a system power supply and at least one circuit powered by the system power supply to control the application of power to the circuit. The sleep transistor is also operatively coupleable to receive a sleep control signal to turn the sleep transistor on and off. A body bias voltage generator is operatively coupleable to a body of the at least one sleep transistor to substantially reduce leakage current when the sleep transistor is non-operational or idle and to improve the operational characteristics of the sleep transistor when the transistor is operational by reducing the performance penalty of the sleep transistor and by reducing impact of noise on the circuit and other devices.

Abstract: A SRAM with reduced subthreshold leakage current, the SRAM comprising a pMOSFET with its gate at VSS and its source at VCC, and a diode-connected pMOSFET with its source at VCC, where the drains of the pMOSFET and the diode-connected pMOSFET are connected together to provide a voltage VCCL, where VSS<VCCL<VCC. The beta of the diode-connected pMOSFET is substantially larger than the beta of the pMOSFET. The wordline associated with each memory cell is driven to a voltage −VEE during a read operation, where −VEE<VSS and VEE≦VCC−VCCL. Each memory cell has cross-coupled inverters to store a data bit, where the cross-coupled inverters have pMOSFETs with their sources at VCCL.

Abstract: A leakage compensation approach enabling full Vcc precharge. An array of memory cells is coupled between a pair of bit lines. A precharge circuit precharges the pair of bit lines to substantially a supply voltage level and a leakage compensation circuit supplies a first compensation current to a first one of the bit lines to substantially compensate for leakage current supplied by the first bit line during a memory access operation directed to one of the plurality of memory cells.

Abstract: A power management device and static random access memory (SRAM) architecture with dynamic supply voltages reduce active power leakage in SRAM cells. When a cell is inactive, a low level supply voltage is applied to the source line connected to the cell to maintain the data stored in the cell. However, before a cell is accessed (e.g., during a read or write operation), the source line is raised to a high level supply voltage.

Abstract: Leakage current from non-selected memory cells is substantially eliminated by placing a negative voltage on the selection line of the non-selected cells. This negative voltage on the gate of the access transistors in the cells reduces the leakage current that would otherwise leak onto a shared sense line if the selection line were biased at 0 volts. In one embodiment the pre-charge voltage on the affected sense line is reduced so that the difference between the pre-charge voltage and the negative voltage does not exceed the design voltage of the transistors in the memory cells.

Abstract: A method and device are provided for stress testing a chip. The chip may be partitioned into at least a first block and a second block. Burn-in stress testing may be performed on electronic devices within the first block without simultaneously performing burn-in stress testing on electronic devices within the second block. A burn-in stress testing device may perform the burn-in testing. A control device may be coupled to the burn-in stress testing device to enable burn-in stress testing on electronic devices within at least the first block of the chip without simultaneously enabling burn-in stress testing on the second block of the chip.

Abstract: A domino logic circuit is provided. The circuit includes an n-channel clock transistor coupled between a dynamic output node and a high voltage connection, the gate of the clock transistor further coupled to receive an inverse clock signal. A first inverter has an input connected to the dynamic output node. A second inverter with an input connected to the dynamic output node comprises a static CMOS circuit stage which serves as an output receiver circuit, the output of which is the output of the domino logic circuit. An n-channel level keeper transistor is connected between the dynamic output node and the high voltage connection, and the gate of the level keeper transistor is connected to the output of the first inverter. A pull-down circuit is connected between the dynamic output node and a low-voltage connection. An output predischarge transistor is connected between the output of the static CMOS circuit and the low voltage connection, and is coupled to and controlled by a clock signal at its gate.

Abstract: An apparatus is described having a plurality of storage cells coupled between a first bit line and a second bit line. The apparatus also has a first transistor that pre-charges the first bit line and provides a first supply of current for one or more leakage currents drawn from the first bit line by any of the plurality of storage cells. The apparatus also has a second transistor that pre-charges the second bit line and provides a second supply of current for one or more leakage currents drawn from the second bit line by any of the plurality of storage cells.

Abstract: A power management device and static random access memory (SRAM) architecture with dynamic supply voltages reduce active power leakage in SRAM cells. When a cell is inactive, a low level supply voltage is applied to the source line connected to the cell to maintain the data stored in the cell. However, before a cell is accessed (e.g., during a read or write operation), the source line is raised to a high level supply voltage.

Abstract: An apparatus is described having a plurality of storage cells coupled between a first bit line and a second bit line. The apparatus also has a first transistor that pre-charges the first bit line and provides a first supply of current for one or more leakage currents drawn from the first bit line by any of the plurality of storage cells. The apparatus also has a second transistor that pre-charges the second bit line and provides a second supply of current for one or more leakage currents drawn from the second bit line by any of the plurality of storage cells.

Abstract: A domino logic circuit is provided. The circuit includes an n-channel clock transistor coupled between a dynamic output node and a high voltage connection, with the gate of the clock transistor coupled to receive an inverse clock signal. A first inverter and a second inverter are connected in series such that the input of the first inverter is connected to the output of the second inverter. The input of the second inverter is connected to the dynamic output node. An n-channel level keeper transistor is connected between the dynamic output node and the high voltage connection, and the gate of the level keeper transistor is connected to the output of the first inverter. A pull-down circuit is connected between the dynamic output node and a low-voltage connection.

Abstract: A domino logic circuit is provided. The circuit includes an n-channel clock transistor coupled between a dynamic output node and a high voltage connection, the gate of the clock transistor further coupled to receive an inverse clock signal. A first inverter has an input connected to the dynamic output node. A second inverter with an input connected to the dynamic output node comprises a static CMOS circuit stage which serves as an output receiver circuit, the output of which is the output of the domino logic circuit. An n-channel level keeper transistor is connected between the dynamic output node and the high voltage connection, and the gate of the level keeper transistor is connected to the output of the first inverter. A pull-down circuit is connected between the dynamic output node and a low-voltage connection. An output predischarge transistor is connected between the output of the static CMOS circuit and the low voltage connection, and is coupled to and controlled by a clock signal at its gate.

Abstract: A six transistor SRAM cell for single-ended sensing is described along with related memory architecture. The cell comprises a bistable circuit connected to complementary bit lines through a pair of passgate transistors. One of the passgate transistors has a lower threshold voltage than the other transistor. The lower threshold voltage is used to couple the cell to a single-ended sense amplifier through one of the bit lines. In one embodiment fewer than all the bit lines in an array are precharged in order to reduce power consumption in the array.

Abstract: A method and apparatus for reducing leakage current in an integrated circuit includes a supply voltage line, a virtual supply voltage line, a ground voltage line, a virtual ground voltage line, a first logic circuit coupled to the ground voltage line and selectively coupled to the virtual supply voltage line, a second logic circuit coupled to the supply voltage line and selectively coupled to the virtual ground voltage line, and a switch circuit configured to control the selective coupling of the first logic circuit to the virtual supply line voltage and the second logic circuit to the virtual ground voltage line.