Patents by Inventor Yikang Deng

Yikang Deng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200211927
    Abstract: Microelectronic assemblies that include a cooling channel, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a package substrate having a surface, a die having a surface, and a fluidic channel between the surface of the die and the surface of the package substrate, wherein a top surface of the fluidic channel is defined by the surface of the die and a bottom surface of the fluidic channel is defined by the surface of the package substrate. In some embodiments, a microelectronic assembly may include a package substrate having a surface; a die having a surface; and an interposer having a fluidic channel between the surface of the die and the surface of the package substrate.
    Type: Application
    Filed: December 27, 2018
    Publication date: July 2, 2020
    Applicant: Intel Corporation
    Inventors: Zhimin Wan, Cheng Xu, Yikang Deng, Junnan Zhao, Ying Wang, Chong Zhang, Kyu Oh Lee, Chandra Mohan Jha, Chia-Pin Chiu
  • Publication number: 20200185300
    Abstract: An integrated circuit (IC) package comprises a substrate comprising a dielectric and a thermal conduit that is embedded within the dielectric. The thermal conduit has a length that extends laterally within the dielectric from a first end to a second end. An IC die is thermally coupled to the first end of the thermal conduit. The IC die comprises an interconnect that is coupled to the first end of the thermal conduit. An integrated heat spreader comprises a lid over the IC die and at least one sidewall extending from the edge of the lid to the substrate that is thermally coupled to the second end of the thermal conduit.
    Type: Application
    Filed: December 10, 2018
    Publication date: June 11, 2020
    Applicant: INTEL CORPORATION
    Inventors: Cheng Xu, Zhimin Wan, Lingtao Liu, Yikang Deng, Junnan Zhao, Chandra Mohan Jha, Kyu-oh Lee
  • Publication number: 20200185289
    Abstract: An apparatus is provided which comprises: a plurality of dielectric layers forming a substrate, a plurality of first conductive contacts on a first surface of the substrate, a cavity in the first surface of the substrate defining a second surface parallel to the first surface, a plurality of second conductive contacts on the second surface of the substrate, one or more integrated circuit die(s) coupled with the second conductive contacts, and mold material at least partially covering the one or more integrated circuit die(s) and the first conductive contacts. Other embodiments are also disclosed and claimed.
    Type: Application
    Filed: December 27, 2016
    Publication date: June 11, 2020
    Applicant: Intel Corporation
    Inventors: Mitul MODI, Robert L. SANKMAN, Debendra MALLIK, Ravindranath V. MAHAJAN, Amruthavalli P. ALUR, Yikang DENG, Eric J. LI
  • Publication number: 20200168384
    Abstract: Described herein are magnetic core inductors (MCI) and methods for manufacturing magnetic core inductors. A first embodiment of the MCI can be a snake-configuration MCI. The snake-configuration MCI can be formed by creating an opening in a base material, such as copper, and providing a nonconductive magnetic material in the opening. The inductor can be further formed by forming plated through holes into the core material. The conductive elements for the inductor can be formed in the plated through holes. The nonconductive magnetic material surrounds each conductive element and plated through hole. In embodiments, a layered coil inductor can be formed by drilling a laminate to form a cavity through the laminate within the metal rings of the layered coil inductor. The nonconductive magnetic material can be provided in the cavity.
    Type: Application
    Filed: September 28, 2017
    Publication date: May 28, 2020
    Applicant: Intel Corporation
    Inventors: Junnan Zhao, Ying Wang, Cheng Xu, Kyu Oh Lee, Sheng Li, Yikang Deng
  • Publication number: 20200119250
    Abstract: A semiconductor device package structure is provided. The semiconductor device package structure includes a substrate, a die coupled to the substrate, and a thermoelectric device. The thermoelectric device may include a P-type semiconductor material, a N-type semiconductor material, and a plurality of interconnect structures to transmit current through the P-type and N-type semiconductor material. In an example, the P-type semiconductor material and the N-type semiconductor material may be at least in part embedded within the substrate. The thermoelectric device has a first side proximal to the die, and a second side separated from the die by the first side.
    Type: Application
    Filed: October 11, 2018
    Publication date: April 16, 2020
    Applicant: Intel Corporation
    Inventors: Cheng Xu, Zhimin Wan, Yikang Deng, Junnan Zhao, Chong Zhang, Ying Wang, Kyu-oh Lee
  • Publication number: 20200118990
    Abstract: A semiconductor device package structure is provided. The semiconductor device package structure includes a substrate having a cavity, and phase change material within the cavity. In an example, the phase change material has a phase change temperature lower than 120 degree centigrade. A die may be coupled to the substrate. In an example, the semiconductor device package structure includes one or more interconnect structures that are to couple the die to the phase change material within the cavity.
    Type: Application
    Filed: October 11, 2018
    Publication date: April 16, 2020
    Applicant: Intel Corporation
    Inventors: Cheng Xu, Zhimin Wan, Yikang Deng, Junnan Zhao, Chong Zhang, Chandra Mohan M. Jha, Ying Wang, Kyu-oh Lee
  • Publication number: 20200083153
    Abstract: An electronic device may include a substrate, and the substrate may include one or more layers. The one or more layers may include a first dielectric material and one or more electrical traces. A cavity may be defined in the substrate, and the cavity may be adapted to receive one or more electrical components. One or more lateral traces may extend through a wall of the cavity. The lateral traces may provide electrical communication pathways between the substrate and the electrical components.
    Type: Application
    Filed: September 7, 2018
    Publication date: March 12, 2020
    Inventors: Yikang Deng, Ying Wang, Cheng Xu, Chong Zhang, Junnan Zhao
  • Publication number: 20200066627
    Abstract: A microelectronics package comprises a substrate that comprises a dielectric and at least two conductor layers within the dielectric, and an inductor structure having a magnetic core at least partially within the dielectric and extending at least between a first conductor layer and a second conductor layer. The inductor structure comprises at least one conductor that extends horizontally at least partially within the magnetic core. The conductor extends in the z-direction within the magnetic core between the first conductor layer and the second conductor layer. One or more vias extend within the dielectric adjacent to the magnetic core between the first conductor layer and the second conductor layer. The conductor of the inductor has a length extending through the magnetic core that is greater than a width of the conductor.
    Type: Application
    Filed: August 22, 2018
    Publication date: February 27, 2020
    Applicant: INTEL CORPORATION
    Inventors: Huong Do, Kaladhar Radhakrishnan, Krishna Bharath, Yikang Deng, Amruthavalli P. Alur
  • Publication number: 20200066634
    Abstract: A microelectronics package comprising a substrate, the substrate comprising a dielectric and at least first and second conductor level within the dielectric, where the first and second conductor levels are separated by at least one dielectric layer. The microelectronics package comprises an inductor structure that comprises a magnetic core. The magnetic core is at least partially embedded within the dielectric. The inductor structure comprises a first trace in the first conductor level, a second trace in the second conductor level, and a via interconnect connecting the first and second traces. The first trace and the second trace extend at least partially within the magnetic core.
    Type: Application
    Filed: August 21, 2018
    Publication date: February 27, 2020
    Applicant: Intel Corporation
    Inventors: Huong Do, Kaladhar Radhakrishnan, Krishna Bharath, Yikang Deng, Amruthavalli P. Alur
  • Patent number: 10553453
    Abstract: Various embodiments of the disclosure are directed to a semiconductor package and a method for fabrication of the semiconductor package. Further, disclosed herein are systems and methods that are directed to using a photoimagable dielectric (PID) layer with substantially similar mechanical properties as that of a mold material. The disclosure can be used, for example, in the context of bumpless laserless embedded substrate structures (BLESS) technology for wafer/panel level redistribution layer (RDL) and/or fan-out packaging applications. The disclosed embodiments may reduce the need for multiple dry resist film (DFR) lamination steps during various processing steps for semiconductor packaging and can also facilitate multiple layer counts due to the availability of thin PID materials.
    Type: Grant
    Filed: July 14, 2016
    Date of Patent: February 4, 2020
    Assignee: Intel Corporation
    Inventors: Sri Chaitra Chavali, Siddharth K. Alur, Amanda E. Schuckman, Amruthavalli Palla Alur, Islam A. Salama, Yikang Deng, Kristof Darmawikarta
  • Publication number: 20200027728
    Abstract: Embodiments may relate to a semiconductor package that includes a die and a glass core coupled with the die. The glass core may include a cavity with an interconnect structure therein. The interconnect structure may include pads on a first side that are coupled with the die, and pads on a second side opposite the first side. Other embodiments may be described and/or claimed.
    Type: Application
    Filed: July 23, 2018
    Publication date: January 23, 2020
    Applicant: Intel Corporation
    Inventors: Ying Wang, Chong Zhang, Meizi Jiao, Junnan Zhao, Cheng Xu, Yikang Deng
  • Publication number: 20190393143
    Abstract: Embodiments include a package substrate, a method of forming the package substrate, and a semiconductor package. A package substrate includes a conductive layer in a dielectric, a first trace and a first via pad of the conductive layer having a first thickness, and a second trace and a second via pad of the conductive layer having a second thickness. The second thickness of second trace and second via pad may be greater than the first thickness of the first trace and first via pad. The dielectric may include a first dielectric thickness and a second dielectric thickness, where the second dielectric thickness may be less than the first dielectric thickness. The package substrate may include a third via having a third thickness on the first via pad, and a fourth via having a fourth thickness on the second via pad, wherein the third thickness is greater than the fourth thickness.
    Type: Application
    Filed: June 25, 2018
    Publication date: December 26, 2019
    Inventors: Jonathan ROSCH, Wei-Lun JEN, Cheng XU, Liwei CHENG, Andrew BROWN, Yikang DENG
  • Publication number: 20190385780
    Abstract: Techniques are provided for an inductor at a first level interface between a first die and a second die. In an example, the inductor can include a winding and a core disposed inside the winding. The winding can include first conductive traces of a first die, second conductive traces of a second die, and a plurality of connectors configured to connect the first die with the second die. Each connector of the plurality of connecters can be located between a trace of the first conductive traces and a corresponding trace of the second conductive traces.
    Type: Application
    Filed: June 19, 2018
    Publication date: December 19, 2019
    Inventors: Cheng Xu, Yikang Deng, Kyu Oh Lee, Ji Yong Park, Srinivas Pietambaram, Ying Wang, Chong Zhang, Rui Zhang, Junnan Zhao
  • Publication number: 20190385959
    Abstract: Techniques are provided for an inductor at a second level interface between a first substrate and a second substrate. In an example, the inductor can include a winding and a core disposed inside the winding. The winding can include first conductive traces of a first substrate, second conductive traces of a second non-semiconductor substrate, and a plurality of connectors configured to connect the first substrate with the second substrate. Each connector of the plurality of connecters can be located between a trace of the first conductive traces and a corresponding trace of the second conductive traces.
    Type: Application
    Filed: June 19, 2018
    Publication date: December 19, 2019
    Inventors: Cheng Xu, Yikang Deng, Kyu Oh Lee, Ji Yong Park, Srinivas Pietambaram, Ying Wang, Chong Zhang, Rui Zhang, Junnan Zhao
  • Publication number: 20190371744
    Abstract: Disclosed herein are magnetic structures in integrated circuit (IC) package supports, as well as related methods and devices. For example, in some embodiments, an IC package support may include a conductive line and a magnetic structure around a top surface of the conductive line and side surfaces of the conductive line. The magnetic structure may have a tapered shape that narrows toward the conductive line.
    Type: Application
    Filed: June 5, 2018
    Publication date: December 5, 2019
    Applicant: Intel Corporation
    Inventors: Andrew James Brown, Ying Wang, Chong Zhang, Lauren Ashley Link, Yikang Deng
  • Publication number: 20190355654
    Abstract: Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a package substrate having a core substrate with a first conductive structure having a first thickness on the core substrate, and a second conductive structure having a second thickness on the core substrate, where the first thickness is different than the second thickness.
    Type: Application
    Filed: May 21, 2018
    Publication date: November 21, 2019
    Applicant: Intel Corporation
    Inventors: Cheng Xu, Jiwei Sun, Ji Yong Park, Kyu Oh Lee, Yikang Deng, Zhichao Zhang, Liwei Cheng, Andrew James Brown
  • Publication number: 20190317285
    Abstract: An optoelectronic apparatus is presented. In embodiments, the apparatus may include a package including a substrate with a first side and a second side opposite the first side, wherein the first side comprises a ball grid array (BGA) field. The apparatus may further include one or more integrated circuits (ICs) disposed on the first side of the substrate, inside the BGA field, that thermally interface with a printed circuit board (PCB), to which the package is to be coupled, one or more optical ICs coupled to the second side and communicatively coupled with the one or more ICs via interconnects provided in the substrate, wherein at least one of the optical ICs is at least partially covered by an integrated heat spreader (IHS), to provide dissipation of heat produced by the at least one optical IC.
    Type: Application
    Filed: September 12, 2017
    Publication date: October 17, 2019
    Inventors: Shawna M. LIFF, Henning BRAUNISCH, Timothy A. GOSSELIN, Prasanna RAGHAVAN, Yikang DENG, Zhiguo QIAN
  • Publication number: 20190311916
    Abstract: Various embodiments of the disclosure are directed to a semiconductor package and a method for fabrication of the semiconductor package. Further, disclosed herein are systems and methods that are directed to using a photoimageable dielectric (PID) layer with substantially similar mechanical properties as that of a mold material. The disclosure can be used, for example, in the context of bumpless laserless embedded substrate structures (BLESS) technology for wafer/panel level redistribution layer (RDL) and/or fan-out packaging applications. The disclosed embodiments may reduce the need for multiple dry resist film (DFR) lamination steps during various processing steps for semiconductor packaging and can also facilitate multiple layer counts due to the availability of thin PID materials.
    Type: Application
    Filed: July 14, 2016
    Publication date: October 10, 2019
    Inventors: Sri Chaitra CHAVALI, Siddharth K. ALUR, Amanda E. SCHUCKMAN, Amruthavalli Palla ALUR, Islam A. SALAMA, Yikang DENG, Kristof DARMAWIKARTA
  • Publication number: 20190295937
    Abstract: Embodiments include semiconductor packages and a method of forming the semiconductor packages. A semiconductor package includes a trace disposed on a conductive layer. The semiconductor package has one or more adhesion anchoring points and a plurality of portions on the trace. An adhesion anchoring point is between two portions on the trace. A surface roughness of an adhesion anchoring point is greater than a surface roughness of a portion on the trace. The trace may be a high-speed input/output (HSIO) trace. The semiconductor package may include via pads disposed on each end of the trace, and a dielectric disposed on the trace. The dielectric is patterned to form openings on the dielectric that expose second portions on the trace. The dielectric remains over the portions. The semiconductor package may have a chemical treatment disposed on the exposed openings on the trace to form the adhesion anchoring points.
    Type: Application
    Filed: March 20, 2018
    Publication date: September 26, 2019
    Inventors: Chong ZHANG, Ying WANG, Cheng XU, Hongxia FENG, Meizi JIAO, Junnan ZHAO, Yikang DENG
  • Publication number: 20190287815
    Abstract: The systems and methods described herein provide for the fabrication of semiconductor package substrates having magnetic inductors formed in at least a portion of the through-holes formed in the semiconductor package substrate. Such magnetic inductors are formed without exposing the magnetic material disposed in the through-hole to any wet chemistry (desmear, electro-less plating, etc.) processes by sealing the magnetic material with a patterned sealant (e.g., patterned dry film resist) which seals the magnetic material prior to performing steps involving wet chemistry on the semiconductor package substrate. Such beneficially minimizes or even eliminates the contamination of wet chemistry reagents by the magnetic material should the magnetic material remain exposed during the wet chemistry processes. The patterned sealant is removed subsequent to the semiconductor package processing steps involving wet chemistry.
    Type: Application
    Filed: March 14, 2018
    Publication date: September 19, 2019
    Applicant: Intel Corporation
    Inventors: CHENG XU, CHONG ZHANG, YIKANG DENG, JUNNAN ZHAO, YING WANG