Abstract: The present disclosure related to a multilayer composite that may include a first polymethylpentene (TPX) liner, and a silicone-based foam layer overlying the first TPX liner. The silicone-based foam layer may include a component A and a component B, where the component A may include a silicone-based matrix component, a first filler component that may include alumina trihydrate, a second filler component that may include perlite, and a third filler component that may include calcium carbonate, and where the component B may include a silicone-based matrix component, a first filler component that may include alumina trihydrate, a second filler component that may include perlite, a third filler component that may include calcium carbonate, and a fourth filler component that may include zinc borate. The silicone-based foam layer may have a V-0 flammability rating as measured according to ASTM D3801.

Abstract: Embodiments disclosed herein include electronic systems with vias that include a horizontal and vertical portion in order to provide interconnects to stacked components, and methods of forming such systems. In an embodiment, an electronic system comprises a board, a package substrate electrically coupled to the board, and a die electrically coupled to the package substrate. In an embodiment the die comprises a stack of components, and a via adjacent to the stack of components, wherein the via comprises a vertical portion and a horizontal portion.

Abstract: The disclosure features compositions and methods for ameliorating cognitive impairments associated with neuropsychiatric disorders, particularly those associated with anterodorsal (AD) thalamus hyperexcitability in the brain of a subject. Various embodiments of the disclosure provide for personalized and targeted therapeutic approaches for screening, diagnosing, preventing, and treating cognitive impairments and neuropsychiatric disorders.

Abstract: A method includes forming a dielectric layer over a substrate, the dielectric layer having a top surface; etching an opening in the dielectric layer; forming a bottom electrode within the opening, the bottom electrode including a barrier layer; forming a phase-change material (PCM) layer within the opening and on the bottom electrode, wherein a top surface of the PCM layer is level with or below the top surface of the dielectric layer; and forming a top electrode on the PCM layer.

Abstract: A facility for executing a logistics operation comprises a warehouse facility, comprising a level and a plurality of areas defined on the level. The areas comprise a sorting zone and a shipping zone in communication with the sorting zone. A plurality of container reload stations are fixedly arranged at a plurality of predetermined locations in the sorting zone. Each of the container reload stations comprise a sorting robot, and a plurality of first placing points and a second placing point located at a periphery of the sorting robot. A plurality of first robot autonomous guided vehicles are configured to respectively transfer inventory containers to the container reload station. A plurality of second robot autonomous guided vehicles are configured to respectively transfer order containers to be loaded. A server is communicatively connected to the sorting robot, the first robot autonomous guided vehicles, and the second robot autonomous guided vehicles.

Abstract: The present disclosure provides a light-emitting package. The light-emitting package includes a main body, a cavity disposed in the cavity, a base plane in the cavity and a light-emitting element. The light-emitting element is disposed in the cavity and connected to the base plane. The light-emitting element includes a substrate and a semiconductor stack on the substrate. The substrate includes a side wall, and the side wall incudes a first cutting trace. The main body includes a step portion disposed in the cavity and it surrounds the light-emitting element. The step portion comprises a first height relative to base plane, and the first cutting trace comprises a second height relative to the base plane. The second height is greater than the first height.

Abstract: A rotary bearing assembly is disclosed and includes an input shaft, an inner-ring component, an outer-ring component and a load element. The input shaft is configured to combine a rotating shaft of a motor to provide a power input. The inner-ring component includes a gear set, wherein the inner-ring component is sleeved on the input shaft through the gear set and driven by the input shaft. The outer-ring component is sleeved on the inner-ring component through a load element and engaged with the gear set, wherein when the gear set is driven by the input shaft to drive the inner-ring component, the gear set drives the outer-ring component, and the inner-ring component and the outer-ring component are rotated relatively, wherein one of the inner-ring component and the outer-ring component is served to provide a power output, and a rotational speed difference is between the power input and the power output.

Abstract: A method for multi-link operation (MLO) is provided. The method for MLO may be applied to an apparatus. The method for MLO may include the following steps. A multi-chip controller of the apparatus may assign different data to a plurality of chips of the apparatus, wherein each chip corresponds to one link of multi-links. Each chip may determine whether transmission of the assigned data has failed. A first chip of the chips may transmit the assigned data to an access point (AP) in response to the first chip determining that the transmission of the assigned data has not failed.

Abstract: A method of manufacturing a composite article includes providing a polishing pad; rubbing over the polishing pad to produce a polishing pad debris; collecting the polishing pad debris; providing a wood material; and applying a force over the wood material and the polishing pad debris to form the composite article, wherein the composite article includes the wood material and the polishing pad debris, and the rubbing of the polishing pad includes removing a portion of the polishing pad to produce the polishing pad debris.

Abstract: A manufacturing method of an electronic device includes the following steps. First, a curved substrate is formed. Next, a first conductive layer is formed on a first insulating layer. Then, a second conductive layer is formed on a second insulating layer. Thereafter, the first insulating layer and the second insulating layer are bonded to the curved substrate. The manufacturing method of the electronic device may reduce problems such as peeling and/or offset of the manufactured electronic device.

Abstract: The present disclosure provides a three-dimensional NAND memory device, comprising a NAND string including a memory cell to be inhibited to program, a word line driver, and a controller configured to control the word line driver to perform a programming operation on the memory cell controlled by a selected word line of a plurality of word lines including a first unselected word line adjacent to the selected word line, a first plurality of unselected word lines adjacent to the first unselected word line, and a second plurality of unselected word lines adjacent to the first plurality of unselected word lines. The programming operation includes applying a programming voltage signal to the selected word line; applying a first pass voltage to the first plurality of unselected word lines; and applying a second pass voltage to the second plurality of unselected word lines, the first pass voltage is different from the second pass voltage.

Abstract: A method for a user equipment (UE) communicating with a non-terrestrial network (NTN) node is provided. The method transmits one or more parameters to a ground-based base station (BS) communicatively coupled to the NTN node, the one or more parameters transmitted through at least one of uplink control information (UCI), a periodic Channel State Information (CSI) report with CSI information, a Medium Access Control (MAC) Control Element (CE), and a Physical Uplink Control Channel (PUCCH). The one or more parameters are transmitted to the ground-based BS for indicating accuracy of time and frequency synchronization associated with communication between the UE and the NTN node.

Abstract: The disclosure provides a configuration method, data integration method, apparatus, device and storage medium of data integration strategy. The method includes obtaining a data structure of a data source based on an access credential of the data source; and configuring a data structure of an external object for the data structure of the data source, wherein there is a mapping relationship between the data structure of the external object and the data structure of the data source.

Abstract: A method of generating an IC layout diagram includes receiving an IC layout diagram including a gate region and a gate via, the gate via being positioned at a location within an active region and along a width of the gate region extending across the active region, receiving a first gate resistance value of the gate region, retrieving a second gate resistance value from a resistance value reference based on the location and the width, using the first and second resistance values to determine that the IC layout diagram does not comply with a design specification, and based on the non-compliance with the design specification, modifying the IC layout diagram.

Abstract: A system may automatically conduct hygiene cycles for a confined space such an interior space of a box suitable for storing and/or carrying packaged food. The system may include a hygiene device that can be attached to the box to conduct the hygiene cycles. The system may also automatically collect information related to the hygiene cycles and transmit the collected information to a network.

Abstract: In some implementations, a device may obtain an input that identifies a device type. The device may obtain, based on the input, information indicating a configuration associated with the device type. The device may determine, using a plurality of machine learning models respectively associated with a plurality of memory types, compatibilities between the plurality of memory types and the device type based on the configuration associated with the device type. Each of the plurality of machine learning models may be trained to determine a compatibility of a respective memory type, of the plurality of memory types, with a given configuration. The device may determine a recommendation of one or more memory types for the device type based on the compatibilities between the plurality of memory types and the device type. The device may transmit an indication of the recommendation of the one or more memory types.

Abstract: A semiconductor device includes a substrate, two first voltage-to-current converters, two second voltage-to-current converters and two third voltage-to-current converters. The substrate includes six layout regions arranged as an array having a plurality of columns and a plurality of rows, the array is line-symmetrical with respect to a first axis and a second axis which are perpendicularly intersected at an array center point of the array. The two first voltage-to-current converters, the two second voltage-to-current converters and the two third voltage-to-current converters are respectively arranged in the six layout regions. With respect to the array center point, layouts of the two first voltage-to-current converters are point-symmetrical, layouts of the two second voltage-to-current converters are point-symmetrical, and layouts of the two third voltage-to-current converters are point-symmetrical.

Abstract: In some embodiments, the present disclosure relates to an integrated chip including a substrate and a first die disposed over the substrate. A first plurality of die stopper bumps are disposed along a backside of the first die. The first plurality of die stopper bumps directly contact the backside of the first die, and the first plurality of die stopper bumps are arranged as a plurality of groups of die stopper bumps. A plurality of adhesive structures are also present. Each of the plurality of adhesive structures surrounds a corresponding group of the plurality of groups of die stopper bumps.

Abstract: An electronic device is provided. The electronic device includes a first substrate, an insulating layer, a first conductive layer and a second conductive layer. The insulating layer is overlapped with the first substrate. The second conductive layer contacts with the first conductive layer. The first conductive layer and the second conductive layer are disposed between the first substrate and the insulating layer. The second conductive layer is disposed between the first conductive layer and the insulating layer. Moreover, a thermal expansion coefficient of the second conductive layer is between a thermal expansion coefficient of the first conductive layer and a thermal expansion coefficient of the insulating layer.

Abstract: An image processing method including obtaining a fake template sample group comprising a first source image, a real labeled image, and a fake template image, inputting the fake template image into an identity swapping model to obtain a first identity swapping image of the fake template image, obtaining a fake labeled sample group comprising a second source image, a real template image, and a fake labeled image, the fake labeled image being based on identity swapping processing of the real template image, inputting the real template image into the identity swapping model to obtain a second identity swapping image of the real template image, and training the identity swapping model based on the fake template sample group, the first identity swapping image, the fake labeled sample group, and the second identity swapping image to generate a trained identity swapping model.