Patents by Inventor Ying Feng
Ying Feng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240158810Abstract: The disclosure features compositions and methods for ameliorating cognitive impairments associated with neuropsychiatric disorders, particularly those associated with anterodorsal (AD) thalamus hyperexcitability in the brain of a subject. Various embodiments of the disclosure provide for personalized and targeted therapeutic approaches for screening, diagnosing, preventing, and treating cognitive impairments and neuropsychiatric disorders.Type: ApplicationFiled: December 22, 2023Publication date: May 16, 2024Applicants: The Broad Institute, Inc., Massachusetts Institute of TechnologyInventors: Guoping FENG, Dheeraj ROY, Ying ZHANG
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Publication number: 20240156683Abstract: Disclosed is a reusable actuator for use with a drug container including a stopper comprising a container having a closed end, an open end, and a sidewall extending therebetween in a longitudinal direction, an electrode disposed inside the container for use in generating a gas, an actuating element disposed at and closing the open end of the container, the actuating element and the container defining an actuator interior, wherein the actuating element is movable relative to the container in the longitudinal direction by a gas pressure of the gas in the actuator interior, such that the actuating element applies a force to the stopper to cause a drug delivery from the drug container, and a retracting mechanism for use in removing the gas to assist the actuating element's retraction for reuse.Type: ApplicationFiled: November 16, 2023Publication date: May 16, 2024Applicant: MicroMED Co., Ltd.Inventors: Chia-Chi FENG, Po-Ying LI, Hong Jun YEH, Kuang-Hsiang CHENG
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Patent number: 11982996Abstract: A workpiece data processing method and apparatus are for accurately determining a relationship between production equipment processing parameters/ambient condition data and workpiece quality inspection results.Type: GrantFiled: April 29, 2019Date of Patent: May 14, 2024Assignee: SIEMENS AKTIENGESELLSCHAFTInventors: Cheng Feng, Daniel Schneegass, Ying Qu, Peng Wei Tian
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Patent number: 11974640Abstract: Disclosed is wristband and wrist wearable device, including: a wristband body portion, one end is connected to one end of a device body of a wrist wearable device, and the other end is a free end; and a memory metal portion, which is arranged on the wristband body portion and has an arc-shaped memory state in a natural state, so that the wristband body portion is naturally maintained in an arc shape. The memory metal portion comprises a strip-shaped memory metal piece including a first metal segment, a second metal segment, and a third metal segment that are sequentially connected, the first metal segment and the third metal segment extend along a length direction of the wristband body portion in parallel, the second metal segment is arranged at the free end of the wristband body portion and is provided with at least one bent portion.Type: GrantFiled: December 29, 2021Date of Patent: May 7, 2024Assignee: GOERTEK INC.Inventors: Jianning Zhang, Qingru Shao, Huaying Feng, Cheng Zhao, Ying Zhong, Rui Guo, Yao Xue, Chao Zhang, Yawei Li
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Publication number: 20240145260Abstract: An airflow heating module for an equipment front-end module, including: a first perforated plate including a first plurality of holes used as airflow inlets; a second perforated plate including a second plurality of holes used as airflow outlets; a plurality of heaters provided between the first and the second perforated plates; and an active air intake device provided on the first perforated plate to accelerate airflow flowing through the first plurality of holes and past the plurality of heaters, such that the airflow carries heat generated by the heaters and passes through the second plurality of holes. Each of the heaters includes a heating tube and a fin. The fin is formed helically around the heating tube and attached thereto.Type: ApplicationFiled: December 27, 2022Publication date: May 2, 2024Inventors: Yueh-Lin CHIANG, Hsin-Jan PAI, Ying-Feng LEE, Ling-Chiao HUANG
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Publication number: 20240118741Abstract: A power source module for powering a motherboard comprises a rectifier circuit, a controlling unit, and a leakage protection circuit. The rectifier circuit electrically connected with the motherboard converts the input voltage into the first voltage configured for powering the motherboard. The controlling unit electrically connected with the motherboard outputs the control signals based on an operation state of the motherboard. The leakage protection circuit electrically connected with the controlling unit guides the control signals into a signal line before the motherboard being powered. The leakage protection circuit avoids the control signals to the component of the motherboard, and an operation time sequence of the component is not disturbed before being powered. A power distribution board and a server system are also disclosed.Type: ApplicationFiled: April 6, 2023Publication date: April 11, 2024Inventors: HE FENG, YING LI, HUI-BO LIU
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Patent number: 11955861Abstract: A stator of a brushless motor is disclosed which includes a stator core, an insulating frame arranged on the stator core, and a plurality of windings wound around the insulating frame. The stator core includes a ring-shaped yoke part and a pole part mounted to the radial inner side of the yoke part. The pole part includes a plurality of teeth spaced-apart from each other along the circumferential direction, and a ring-shaped portion arranged at and connected to the radial inner side of the teeth. The radial outer sides of the teeth abut against the radial inner side of the yoke part. The insulating frame is arranged on the pole part. A plurality of power terminals are fixed to one axial end of the insulating frame and respectively electrically connected to the windings.Type: GrantFiled: July 27, 2020Date of Patent: April 9, 2024Assignee: JOHNSON ELECTRIC INTERNATIONAL AGInventors: Ying Feng, Yick Kun Kenny Tsui, Ping Wo Poon, Kam Ting Ko, Siu Kin Tam, Da Wei Zhou
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Patent number: 11956733Abstract: Various aspects of the present disclosure generally relate to wireless communication. In some aspects, a user equipment may determine at least one of a downlink path loss value or an uplink path loss value associated with a base station; receive system information, a semi-persistently configured grant via RRC or a dynamic uplink grant via DCI from the base station, wherein the RRC signaling or the dynamic uplink grant identifies a power control value associated with one user or a plurality of users associated with the base station; and determine a transmit power for a data or control transmission based at least in part on at least one of the downlink path loss value or the uplink path loss value and the power control value. Numerous other aspects are provided.Type: GrantFiled: January 21, 2022Date of Patent: April 9, 2024Assignee: QUALCOMM IncorporatedInventors: Jing Lei, Tingfang Ji, Peter Gaal, Xiao Feng Wang, Joseph Binamira Soriaga, Seyong Park, Gabi Sarkis, Wanshi Chen, Naga Bhushan, Ying Wang, Jay Kumar Sundararajan
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Patent number: 11953156Abstract: Disclosed are a corrugated plate having a smooth top surface and drawbeads, and a storage container. The corrugated plate includes a corrugated plate body, a longitudinal corrugation, a transverse corrugation, and an intersection portion. The intersection portion includes a smooth top surface and four drawbeads extending from the top surface to the corrugated plate body. The top surface transitions to the drawbeads smoothly. An overall extension direction of each of the drawbeads intersects a transverse direction, a longitudinal direction, and a height direction perpendicular to the corrugated plate body.Type: GrantFiled: August 30, 2023Date of Patent: April 9, 2024Assignee: SINOTECH ENERGY CO., LTD.Inventors: Ying Wei, Xiangao Feng, Wei He, Kang Wang, Jinlin Zhang
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Patent number: 11944412Abstract: A blood pressure detection device manufactured by a semiconductor process includes a substrate, a microelectromechanical element, a gas-pressure-sensing element, a driving-chip element, an encapsulation layer and a valve layer. The substrate includes inlet apertures. The microelectromechanical element and the gas-pressure-sensing element are stacked and integrally formed on the substrate. The encapsulation layer is encapsulated and positioned on the substrate. A flowing-channel space is formed above the microelectromechanical element and the gas-pressure-sensing element. The encapsulation layer includes an outlet aperture in communication with an airbag. The driving-chip element controls the microelectromechanical element, the gas-pressure-sensing element and valve units to transport gas.Type: GrantFiled: June 2, 2021Date of Patent: April 2, 2024Assignee: MICROJET TECHNOLOGY CO., LTD.Inventors: Hao-Jan Mou, Ying-Lun Chang, Ching-Sung Lin, Chi-Feng Huang, Yung-Lung Han, Chang-Yen Tsai, Wei-Ming Lee, Chun-Yi Kuo, Tsung-I Lin
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Publication number: 20240101784Abstract: A novel additive for recycling thermoset materials, its related recyclable thermoset composition and its application are disclosed. Specifically, the composition of the additive comprises at least one copolymer that has at least one carbamate group, at least one carbonate group and/or at least one urea group, and a number-average molecular weight of the copolymer is between 100 and 50,000 Da.Type: ApplicationFiled: September 5, 2023Publication date: March 28, 2024Inventors: Chien-Hsin Wu, Ying-Chi Huang, Ying-Feng Lin, Wen-Chang Chen, Ho-Ching Huang, Ru-Jong Jeng
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Publication number: 20240104072Abstract: Various embodiments of the teachings herein include a method for detecting data anomalies. A method may include: receiving test data; and matching the test data with a data rule determined on the basis of historical data having a shared data type with the test data. The data rule contains an antecedent and a consequent predicate set. An intersection of the antecedent predicate set and the consequent predicate set is an empty set. The antecedent predicate set contains at least one antecedent predicate. The consequent predicate set contains at least one consequent predicate. When the data to be tested satisfies all the antecedent predicates in the antecedent predicate set and fails to satisfy at least one consequent predicate in the consequent predicate set, the test data is flagged as anomalous due to failure to satisfy the data rule.Type: ApplicationFiled: September 13, 2023Publication date: March 28, 2024Applicant: Siemens AktiengesellschaftInventors: Cheng Feng, Ying Qu
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Publication number: 20240096068Abstract: At least one computer processor can replace visual words of an unsupervised machine learning classification model with visual objects of an image. At least two co-occurring single visual objects adjacent to each other in pixels of the image can be combined to obtain a compound visual object. The unsupervised machine learning classification model can be augmented to model the image as a mixture of subjects, where each subject is represented through placements of the visual objects in a mixture of concentric spheres centering on a mixture of intersections on a mixture of horizontal layers. At least one processor can learn latent relationships between the placements of the visual objects in a three-dimensional space depicted in the image and image semantics. Learning the latent relationships trains the unsupervised machine learning classification model to perform image subject classification through the placements of the visual objects in a new image.Type: ApplicationFiled: September 21, 2022Publication date: March 21, 2024Inventors: Ying Li, Fang Lu, Yuan Yuan Gong, Wen Ting Li, Shi Hui Gui, Xiao Feng Ji
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Publication number: 20240096848Abstract: A method of manufacturing a semiconductor device includes forming a first bonding layer over a substrate of a first wafer, the first wafer including a first semiconductor die and a second semiconductor die, performing a first dicing process to form two grooves that extend through the first bonding layer, the two grooves being disposed between the first semiconductor die and the second semiconductor die, performing a second dicing process to form a trench that extends through the first bonding layer and partially through the substrate of the first wafer, where the trench is disposed between the two grooves, and thinning a backside of the substrate of the first wafer until the first semiconductor die is singulated from the second semiconductor die.Type: ApplicationFiled: January 4, 2023Publication date: March 21, 2024Inventors: Chih-Wei Wu, Ching-Feng Yang, Ying-Ching Shih, An-Jhih Su, Wen-Chih Chiou
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Publication number: 20240083575Abstract: An amphibious robot includes a housing including a first shell and a second shell and having a first configuration and a second configuration, a rack disposed in an inner cavity of the housing, a telescopic assembly disposed on the rack and connected between the first shell and the second shell, and a rotary wing assembly disposed on the rack and having a folded configuration and a flight configuration. The rotary wing assembly includes: a folding arm with one end rotatably connected to the rack, a rotary wing, and a tilting arm connected between the rotary wing and the folding arm, the tilting arm and the rotary wing are extended to an outside of the housing to be adapted to drive the robot to fly in the flight configuration, and the tilting arm is rotatable relative to the folding arm to adjust a rotation direction of the rotary wing.Type: ApplicationFiled: July 26, 2023Publication date: March 14, 2024Inventors: Long Ma, Wenzhen Wu, Weizhen Zhang, Qingyong Meng, Ying Feng, Desheng Zhang, Weijian Xu, Qingfeng Rong, Yuliang Ma, Jie Zheng
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Patent number: 11921276Abstract: Provided are a method and apparatus for evaluating image relative definition, a device and a medium, relating to technologies such as computer vision, deep learning and intelligent medical. A specific implementation solution is: extracting a multi-scale feature of each image in an image set, where the multi-scale feature is used for representing definition features of objects having different sizes in an image; and scoring relative definition of each image in the image set according to the multi-scale feature by using a relative definition scoring model pre-trained, where the purpose for training the relative definition scoring model is to learn a feature related to image definition in the multi-scale feature.Type: GrantFiled: July 19, 2021Date of Patent: March 5, 2024Assignee: Beijing Baidu Netcom Science and Technology Co., Ltd.Inventors: Xiang Long, Yan Peng, Shufei Lin, Ying Xin, Bin Zhang, Pengcheng Yuan, Xiaodi Wang, Yuan Feng, Shumin Han
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Publication number: 20240069387Abstract: A display device includes a touch panel, an optical adhesive layer, and a front light module that includes a light source and a light guide plate (LGP) including multiple microstructures recessed into the LGP from a first surface of the LGP to form voids. The optical adhesive layer is adhered between the touch panel and a first surface of the LGP. A surface of the optical adhesive layer facing the LGP is in contact with the first surface of the LGP in multiple first regions, and a surface of the optical adhesive layer facing the LGP and the plurality of microstructures being overlapped in multiple second regions. A maximum vertical distance between each void and the first surface is a first depth. A vertical distance between the first regions and the second regions is 0 to 0.7 times the first depth.Type: ApplicationFiled: July 12, 2023Publication date: February 29, 2024Applicant: Coretronic CorporationInventors: Tzeng-Ke Shiau, Yu-Feng Lin, Ying-Shun Syu, Che-Jui Hsu
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Patent number: 11917790Abstract: The present disclosure is directed to systems and methods of improving the thermal performance of processor-based devices. Such thermal performance improvement may include limiting the degree of tilt experienced by a semiconductor device as a thermal solution coupled to the semiconductor device is tightened to the substrate. Such thermal performance improvements may include increasing the available heat transfer area associated with a particular heat producing semiconductor device. Such thermal performance improvements may include thermally coupling one or more cool blocks thermally coupled to one or more remote heat-producing devices to a central cool block that may be cooled using a cooling medium or coupled to a central heat-producing semiconductor device.Type: GrantFiled: April 27, 2020Date of Patent: February 27, 2024Assignee: Intel CorporationInventors: Prabhakar Subrahmanyam, Casey Winkel, Yingqiong Bu, Ming Zhang, Yuehong Fan, Yi Xia, Ying-Feng Pang
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Publication number: 20240029539Abstract: Methods, systems, apparatus, and articles of manufacture to monitor heat exchangers and associated reservoirs are disclosed. An example apparatus includes programmable circuitry to detect, based on outputs of a sensor associated with a first reservoir, a coolant level of the first reservoir, the first reservoir removably coupled to a second reservoir, the first reservoir to supply coolant to the second reservoir, predict, based on the coolant level, a characteristic associated with operation of a cooling device fluidly coupled to the second reservoir, and cause an output to be presented at a user device based on the predicted characteristic.Type: ApplicationFiled: September 27, 2023Publication date: January 25, 2024Inventors: Prabhakar Subrahmanyam, Viktor Polyanko, Vishnu Prasadh Sugumar, Ying-Feng Pang, Mark Lawrence Bianco, Sandeep Ahuja, Tejas Shah
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Publication number: 20230422389Abstract: Cold plates for secondary side components of printed circuit boards are disclosed herein. An example apparatus disclosed herein includes a first printed circuit board, a second printed circuit board coupled to the first printed circuit board, the second printed circuit board having a first side and a second side opposite the first side, the second side facing the first printed circuit board, and a cold plate coupled to the second side of the second printed circuit board.Type: ApplicationFiled: June 29, 2023Publication date: December 28, 2023Inventors: Prabhakar Subrahmanyam, Tejas J. Shah, Yi Xia, Ying-Feng Pang, Mark Lawrence Bianco, Vishnu Prasadh Sugumar, Vikas Kundapura Rao, Srinivasa Rao Damaraju, Ridvan Amir Sahan, Emad Shehadeh Al-Momani, Rahima Khatun Mohammed, Mirui Wang, Devdatta Prakash Kulkarni