Patents by Inventor Ying Feng

Ying Feng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240069387
    Abstract: A display device includes a touch panel, an optical adhesive layer, and a front light module that includes a light source and a light guide plate (LGP) including multiple microstructures recessed into the LGP from a first surface of the LGP to form voids. The optical adhesive layer is adhered between the touch panel and a first surface of the LGP. A surface of the optical adhesive layer facing the LGP is in contact with the first surface of the LGP in multiple first regions, and a surface of the optical adhesive layer facing the LGP and the plurality of microstructures being overlapped in multiple second regions. A maximum vertical distance between each void and the first surface is a first depth. A vertical distance between the first regions and the second regions is 0 to 0.7 times the first depth.
    Type: Application
    Filed: July 12, 2023
    Publication date: February 29, 2024
    Applicant: Coretronic Corporation
    Inventors: Tzeng-Ke Shiau, Yu-Feng Lin, Ying-Shun Syu, Che-Jui Hsu
  • Patent number: 11917790
    Abstract: The present disclosure is directed to systems and methods of improving the thermal performance of processor-based devices. Such thermal performance improvement may include limiting the degree of tilt experienced by a semiconductor device as a thermal solution coupled to the semiconductor device is tightened to the substrate. Such thermal performance improvements may include increasing the available heat transfer area associated with a particular heat producing semiconductor device. Such thermal performance improvements may include thermally coupling one or more cool blocks thermally coupled to one or more remote heat-producing devices to a central cool block that may be cooled using a cooling medium or coupled to a central heat-producing semiconductor device.
    Type: Grant
    Filed: April 27, 2020
    Date of Patent: February 27, 2024
    Assignee: Intel Corporation
    Inventors: Prabhakar Subrahmanyam, Casey Winkel, Yingqiong Bu, Ming Zhang, Yuehong Fan, Yi Xia, Ying-Feng Pang
  • Publication number: 20240029539
    Abstract: Methods, systems, apparatus, and articles of manufacture to monitor heat exchangers and associated reservoirs are disclosed. An example apparatus includes programmable circuitry to detect, based on outputs of a sensor associated with a first reservoir, a coolant level of the first reservoir, the first reservoir removably coupled to a second reservoir, the first reservoir to supply coolant to the second reservoir, predict, based on the coolant level, a characteristic associated with operation of a cooling device fluidly coupled to the second reservoir, and cause an output to be presented at a user device based on the predicted characteristic.
    Type: Application
    Filed: September 27, 2023
    Publication date: January 25, 2024
    Inventors: Prabhakar Subrahmanyam, Viktor Polyanko, Vishnu Prasadh Sugumar, Ying-Feng Pang, Mark Lawrence Bianco, Sandeep Ahuja, Tejas Shah
  • Publication number: 20230422389
    Abstract: Cold plates for secondary side components of printed circuit boards are disclosed herein. An example apparatus disclosed herein includes a first printed circuit board, a second printed circuit board coupled to the first printed circuit board, the second printed circuit board having a first side and a second side opposite the first side, the second side facing the first printed circuit board, and a cold plate coupled to the second side of the second printed circuit board.
    Type: Application
    Filed: June 29, 2023
    Publication date: December 28, 2023
    Inventors: Prabhakar Subrahmanyam, Tejas J. Shah, Yi Xia, Ying-Feng Pang, Mark Lawrence Bianco, Vishnu Prasadh Sugumar, Vikas Kundapura Rao, Srinivasa Rao Damaraju, Ridvan Amir Sahan, Emad Shehadeh Al-Momani, Rahima Khatun Mohammed, Mirui Wang, Devdatta Prakash Kulkarni
  • Publication number: 20230420338
    Abstract: Techniques for heat sinks and cold plates for compute systems are disclosed. In one embodiment, a heat sink includes two sub-heat sinks that are mechanically connected but thermally isolated. The two sub-heat sinks can independently cool different dies on the same integrated circuit component. In another embodiment, a system includes an integrated circuit component that is cooled by a first water block and a second water block. The first water block forms a loop with a gap in it, and the second water block has a pedestal that extends through the gap in the first water block to contact the integrated circuit component. The first water block and the second water block can independently cool different dies on the same integrated circuit component.
    Type: Application
    Filed: March 6, 2021
    Publication date: December 28, 2023
    Inventors: Prabhakar SUBRAHMANYAM, Tong Wa CHAO, Ying-Feng PANG, Yi XIA, Rahima K. MOHAMMED, Victor P. POLYANKO, Ridvan A. SAHAN, Guangying ZHANG, Guoliang YING, Chuanlou WANG, Jun LU, Liguang DU, Peng WEI, Xiang QUE
  • Publication number: 20230341847
    Abstract: Disclosed herein are system, method, and computer program product embodiments for multi-sensor perception for resource tracking and quantification. An embodiment operates by receiving resource information indicating a resource identifier, a resource location, and a resource amount. Based on sensor data received from a first sensing device and the resource identifier, a resource removed from the resource location and placed at a predefined location may be tracked. An amount of the resource placed at the predefined location may be determined based on depth information from sensor data received from a second sensing device. A notification that indicates that additional resources that match the resource should stop being removed from the resource location and placed at the predefined location may be generated based on a match between the resource amount and the amount of the resource placed at the predefined location.
    Type: Application
    Filed: April 22, 2022
    Publication date: October 26, 2023
    Inventors: Ying FENG, Jingting HUI, Matthew TORRES
  • Publication number: 20230312261
    Abstract: A three-dimensional conveying device and method for a plate glass production line relate to the technical field of glass production. The device includes: a plate receiving device, arranged at a tail end of an original plate production line; a vertical height-adjustable device, including a vertical height-adjustable rail and not fewer than two layers of vertical roller beds, each vertical roller bed may ascend or descend in a height direction of a vertical height-adjustable rail, the vertical roller bed is opposite to the plate receiving roller bed, and the plate glass is movable in a horizontal direction of the vertical roller bed; and a plate sending device, arranged at a head end of a deep processing line or a stacking machine roller bed. The three-dimensional conveying device and method for a plate glass production line can improve the utilization efficiency of workshop space, and improve the overall manufacturing efficiency.
    Type: Application
    Filed: October 27, 2021
    Publication date: October 5, 2023
    Applicant: CHINA TRIUMPH INTERNATIONAL ENGINEERING CO., LTD.
    Inventors: HONGHAN DING, RUI LIU, MING CHENG, CHUNXIAO LI, PEIGUANG YANG, YING FENG, KUN YANG
  • Publication number: 20230260870
    Abstract: Embodiments disclosed herein include a thermal testing unit. In an embodiment, the thermal testing unit comprises a nozzle frame, and a nozzle plate within the frame. In an embodiment, the nozzle plate comprises a plurality of orifices through a thickness of the nozzle plate. In an embodiment, the thermal testing unit further comprises a housing attached to the nozzle plate.
    Type: Application
    Filed: April 21, 2023
    Publication date: August 17, 2023
    Inventors: Prabhakar SUBRAHMANYAM, Tewodros WONDIMU, Ying-Feng PANG, Muhammad AHMAD, Paul DIGLIO, David SHIA, Pooya TADAYON
  • Patent number: 11624746
    Abstract: The present disclosure provides a test strip for milk immunofluorescence assay (IFA) and use thereof, and relates to the technical field of test strip. The test strip of the present disclosure includes a sample pad, a conjugate pad, a nitrocellulose membrane, and a wicking pad assembled and pasted successively on a PVC backing card; fluorescent latex microsphere-labeled mixed antibodies are coated on the conjugate pad; anti-casein antibody (T1 line), anti-beta-lactoglobulin (BLG) antibody (T2 line), anti-alpha-lactalbumin (ALA) antibody (T3 line), anti-lactoferrin/anti-bovine serum albumin (BSA) antibody (T4 line), and rabbit anti-mouse IgG antibody (C line) are coated on the nitrocellulose membrane, where the T1, T2, T3, and T4 lines are test lines, and the C line is a control line. The test strip of the present disclosure accurately and quantitatively detects the content of casein, BLG, ALA, and lactoferrin/BSA in food, and features easy operation and high accuracy and sensitivity.
    Type: Grant
    Filed: March 15, 2021
    Date of Patent: April 11, 2023
    Assignee: Hangzhou Fudemin Biotechnology Co., Ltd.
    Inventors: Yong Wu, Xin Li, Xuanyi Meng, Ping Tong, Juanli Yuan, Ying Feng
  • Publication number: 20230025369
    Abstract: Methods and apparatus for an autonomous stage-switching multi-stage cooling device are disclosed are disclosed. A disclosed example coolant distribution unit (CDU) includes an enclosure, an inlet and an outlet of the CDU to be fluidly coupled to a cooling block associated with a heat generating source, at least one sensor to measure a first temperature corresponding to the inlet and a second temperature corresponding to the outlet, and a plurality of valves to be controlled by a controller to control a flow of fluid from the inlet to at least one of an ambient cooler or a sub-ambient cooler based on: (i) a comparison of the first temperature to an ambient temperature and (ii) a comparison of the second temperature to a target temperature.
    Type: Application
    Filed: September 29, 2022
    Publication date: January 26, 2023
    Inventors: Prabhakar Subrahmanyam, Tong Chao, Yi Xia, Ying-Feng Pang, Victor Polyanko, Arunima Panigrahy, Mark Bianco
  • Publication number: 20230016098
    Abstract: Example field replaceable fan assemblies for peripheral processing units and related systems and methods are disclosed. An example apparatus includes a temperature sensor; a fan having a base; at least one memory; machine readable instructions; and processor circuitry to execute operations corresponding to the machine readable instructions to determine a first temperature based on an output of the temperature sensor; and cause the base of the fan to move based on the first temperature.
    Type: Application
    Filed: September 30, 2022
    Publication date: January 19, 2023
    Inventors: Navneeth Jayaraj, Prabhakar Subrahmanyam, Nagaraj K, Gopinath K, Paniraj Gururaja, Mahammad Yaseen Mulla, Nitesh Gupta, Ying-Feng Pang
  • Publication number: 20220356636
    Abstract: A drying air duct, a clothing treatment device and a method for cleaning a drying air duct are provided. The drying air duct includes a condensing section air duct, a heating section air duct and a fan; the fan is provided at a connection position of the condensing section air duct and the heating section air duct, a cleaning device is provided in the condensing section air duct, the cleaning device is provided at an end of the condensing section air duct adjacent to the fan and is capable of cleaning a side of the condensing section air duct away from the fan. The drying air duct can effectively clean the pipe sudden expansion area of the condensing section air duct, preventing the accumulation of soft flocks in the condensing section air duct.
    Type: Application
    Filed: June 8, 2020
    Publication date: November 10, 2022
    Inventors: Jian LIU, Binhua LONG, Weifeng ZHU, Ying FENG, Tan CHEN
  • Patent number: 11419259
    Abstract: A directional garlic seed throwing mechanism includes a base, a rotating device, a vision sensor, a seed throwing guide plate, a seed guide pipe and a plurality of bulbil adjusting devices. The rotating device includes a rotating motor detachably connected to the base and a turntable connected to an output end of the rotating motor. The seed throwing guide plate is arranged on the turntable to enable garlic seeds of seed containing bowls to fall into the seed guide pipe. The seed guide pipe has an upper port right below the bulbil adjusting devices and arranged on the base. An even number of the bulbil adjusting devices are fixed on the turntable uniformly and symmetrically and include the seed containing bowls and bulbil direction control devices for driving the bowls to rotate 180 degrees.
    Type: Grant
    Filed: September 19, 2018
    Date of Patent: August 23, 2022
    Assignees: SHANDONG ACADEMY AGRICULTURAL MACHINERY SCIENCES, Shandong University
    Inventors: Jingxin Shen, Yitian Sun, Yongjia Sun, Gang Chen, Qing Long Li, Xian Ying Feng, Jun Zhou, Peng Yan
  • Publication number: 20220225542
    Abstract: A dual in-line memory module (DIMM) cooling apparatus is described. The DIMM cooling assembly includes a first heat spreader to be thermally coupled to respective memory chips of a first side of the DIMM. The DIMM cooling assembly includes a second heat spreader to be thermally coupled to respective memory chips of a second side of the DIMM. The DIMM cooling assembly includes a heat sink element. The heat sink element is to reside above the DIMM. The heat sink element is to receive heat from the first and second heat spreaders. The heat sink element has thermal transfer structures to lower thermal resistance between the heat sink element and the heat sink element's ambient.
    Type: Application
    Filed: March 31, 2022
    Publication date: July 14, 2022
    Inventors: Prabhakar SUBRAHMANYAM, Yi XIA, Ying-Feng PANG, Tong Wa CHAO, Mark BIANCO, Yanbing SUN, Ming ZHANG, Guixiang TAN, Devdatta P. KULKARNI, Guocheng ZHANG, Hao ZHOU
  • Publication number: 20220196507
    Abstract: An apparatus is described. The apparatus includes a cover to enclose a junction between respective ends of first and second fluidic conduits. The first and second fluidic conduits transport a coolant fluid within an electronic system. The apparatus also includes a leak detection device to be located within a region that is enclosed by the cover when the junction is enclosed by the cover. The leak detection device is to detect a leak of the coolant fluid at the junction when the junction is enclosed by the cover. The first and second fluidic conduits extend outside the cover when the junction is enclosed by the cover. Another apparatus is also described. The other apparatus includes a leak detection device to detect a leak of coolant fluid from a specific component or junction in a liquid cooling system of an electronic system.
    Type: Application
    Filed: December 23, 2020
    Publication date: June 23, 2022
    Inventors: Prabhakar SUBRAHMANYAM, Yi XIA, Ying-Feng PANG, Victor POLYANKO, Mark BIANCO, Bijoyraj SAHU, Minh T.D. LE, Carlos ALVIZO FLORES, Javier AVALOS GARCIA, Adriana LOPEZ INIGUEZ, Luz Karine SANDOVAL GRANADOS, Michael BERKTOLD, Damion SEARLS, Jin YANG, David SHIA, Samer MELHEM, Jeffrey Ryan CONNER, Hemant DESAI, John RAATZ, Richard DISCHLER, Bergen ANDERSON, Eric W. BUDDRIUS, Kenan ARIK, Barrett M. FANEUF, Lianchang DU, Yuehong FAN, Shengzhen ZHANG, Yuyang XIA, Jun ZHANG, Yuan Li, Catharina BIBER, Kristin L. WELDON, Brendan T. PAVELEK
  • Publication number: 20220163523
    Abstract: The present disclosure provides a test strip for peanut immunofluorescence assay (IFA), use thereof and a detection method, and relates to the technical field of IFA. The test strip of the present disclosure includes a sample pad, a conjugate pad, a nitrocellulose membrane, and a wicking pad arranged successively on a PVC backing card in a left-to-right and end-to-end manner; fluorescent latex microsphere-labeled mixed antibodies are coated on the conjugate pad; anti-Ara h 1 antibody (T1 line), anti-Ara h 2 antibody (T2 line), anti-Ara h 3 antibody (T3 line), anti-total peanut protein (TPP) antibodies (T4 line), and rabbit anti-mouse IgG antibody (C line) are coated on the nitrocellulose membrane, where the T1, T2, T3, and T4 lines are test lines, and the C line is a control line.
    Type: Application
    Filed: March 24, 2021
    Publication date: May 26, 2022
    Inventors: Yong Wu, Xin Li, Xuanyi Meng, Ping Tong, Juanli Yuan, Ying Feng
  • Publication number: 20220146506
    Abstract: The present disclosure provides a test strip for milk immunofluorescence assay (IFA) and use thereof, and relates to the technical field of test strip. The test strip of the present disclosure includes a sample pad, a conjugate pad, a nitrocellulose membrane, and a wicking pad assembled and pasted successively on a PVC backing card; fluorescent latex microsphere-labeled mixed antibodies are coated on the conjugate pad; anti-casein antibody (T1 line), anti-beta-lactoglobulin (BLG) antibody (T2 line), anti-alpha-lactalbumin (ALA) antibody (T3 line), anti-lactoferrin/anti-bovine serum albumin (BSA) antibody (T4 line), and rabbit anti-mouse IgG antibody (C line) are coated on the nitrocellulose membrane, where the T1, T2, T3, and T4 lines are test lines, and the C line is a control line. The test strip of the present disclosure accurately and quantitatively detects the content of casein, BLG, ALA, and lactoferrin/BSA in food, and features easy operation and high accuracy and sensitivity.
    Type: Application
    Filed: March 15, 2021
    Publication date: May 12, 2022
    Inventors: Yong WU, Xin LI, Xuanyi MENG, Ping TONG, Juanli YUAN, Ying FENG
  • Publication number: 20220117112
    Abstract: Embodiments disclosed herein include heatsinks with transpiration cooling features. In an embodiment, a heatsink comprises a body with a first surface, a second surface, and a sidewall surface connecting the first surface to the second surface. In an embodiment, a first hole is formed into the first surface, where the first hole terminates before reaching the second surface. In an embodiment, the heatsink further comprises a second hole into the sidewall surface, where the second hole intersects the first hole.
    Type: Application
    Filed: October 12, 2020
    Publication date: April 14, 2022
    Inventors: Prabhakar SUBRAHMANYAM, Ying-Feng PANG, Yi XIA, Muhammad AHMAD
  • Publication number: 20220077023
    Abstract: An apparatus is described. The apparatus includes a metallic chamber having a first outer surface with first Peltier devices and a second outer surface with second Peltier devices. The first and second outer surfaces face in opposite directions such that the first Peltier devices are to cool first semiconductor chips that face the first outer surface and the second Peltier devices are to cool second semiconductor chips that face the second outer surface.
    Type: Application
    Filed: November 12, 2021
    Publication date: March 10, 2022
    Inventors: Prabhakar SUBRAHMANYAM, Yi XIA, Ying-Feng PANG, Ridvan A. SAHAN
  • Publication number: 20210351106
    Abstract: Embodiments disclosed herein include a thermal testing unit. In an embodiment, the thermal testing unit comprises a nozzle frame, and a nozzle plate within the frame. In an embodiment, the nozzle plate comprises a plurality of orifices through a thickness of the nozzle plate. In an embodiment, the thermal testing unit further comprises a housing attached to the nozzle plate.
    Type: Application
    Filed: May 11, 2020
    Publication date: November 11, 2021
    Inventors: Prabhakar SUBRAHMANYAM, Tewodros WONDIMU, Ying-Feng PANG, Muhammad AHMAD, Paul DIGLIO, David SHIA, Pooya TADAYON