Patents by Inventor Ying Feng

Ying Feng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220196507
    Abstract: An apparatus is described. The apparatus includes a cover to enclose a junction between respective ends of first and second fluidic conduits. The first and second fluidic conduits transport a coolant fluid within an electronic system. The apparatus also includes a leak detection device to be located within a region that is enclosed by the cover when the junction is enclosed by the cover. The leak detection device is to detect a leak of the coolant fluid at the junction when the junction is enclosed by the cover. The first and second fluidic conduits extend outside the cover when the junction is enclosed by the cover. Another apparatus is also described. The other apparatus includes a leak detection device to detect a leak of coolant fluid from a specific component or junction in a liquid cooling system of an electronic system.
    Type: Application
    Filed: December 23, 2020
    Publication date: June 23, 2022
    Inventors: Prabhakar SUBRAHMANYAM, Yi XIA, Ying-Feng PANG, Victor POLYANKO, Mark BIANCO, Bijoyraj SAHU, Minh T.D. LE, Carlos ALVIZO FLORES, Javier AVALOS GARCIA, Adriana LOPEZ INIGUEZ, Luz Karine SANDOVAL GRANADOS, Michael BERKTOLD, Damion SEARLS, Jin YANG, David SHIA, Samer MELHEM, Jeffrey Ryan CONNER, Hemant DESAI, John RAATZ, Richard DISCHLER, Bergen ANDERSON, Eric W. BUDDRIUS, Kenan ARIK, Barrett M. FANEUF, Lianchang DU, Yuehong FAN, Shengzhen ZHANG, Yuyang XIA, Jun ZHANG, Yuan Li, Catharina BIBER, Kristin L. WELDON, Brendan T. PAVELEK
  • Publication number: 20220163523
    Abstract: The present disclosure provides a test strip for peanut immunofluorescence assay (IFA), use thereof and a detection method, and relates to the technical field of IFA. The test strip of the present disclosure includes a sample pad, a conjugate pad, a nitrocellulose membrane, and a wicking pad arranged successively on a PVC backing card in a left-to-right and end-to-end manner; fluorescent latex microsphere-labeled mixed antibodies are coated on the conjugate pad; anti-Ara h 1 antibody (T1 line), anti-Ara h 2 antibody (T2 line), anti-Ara h 3 antibody (T3 line), anti-total peanut protein (TPP) antibodies (T4 line), and rabbit anti-mouse IgG antibody (C line) are coated on the nitrocellulose membrane, where the T1, T2, T3, and T4 lines are test lines, and the C line is a control line.
    Type: Application
    Filed: March 24, 2021
    Publication date: May 26, 2022
    Inventors: Yong Wu, Xin Li, Xuanyi Meng, Ping Tong, Juanli Yuan, Ying Feng
  • Publication number: 20220146506
    Abstract: The present disclosure provides a test strip for milk immunofluorescence assay (IFA) and use thereof, and relates to the technical field of test strip. The test strip of the present disclosure includes a sample pad, a conjugate pad, a nitrocellulose membrane, and a wicking pad assembled and pasted successively on a PVC backing card; fluorescent latex microsphere-labeled mixed antibodies are coated on the conjugate pad; anti-casein antibody (T1 line), anti-beta-lactoglobulin (BLG) antibody (T2 line), anti-alpha-lactalbumin (ALA) antibody (T3 line), anti-lactoferrin/anti-bovine serum albumin (BSA) antibody (T4 line), and rabbit anti-mouse IgG antibody (C line) are coated on the nitrocellulose membrane, where the T1, T2, T3, and T4 lines are test lines, and the C line is a control line. The test strip of the present disclosure accurately and quantitatively detects the content of casein, BLG, ALA, and lactoferrin/BSA in food, and features easy operation and high accuracy and sensitivity.
    Type: Application
    Filed: March 15, 2021
    Publication date: May 12, 2022
    Inventors: Yong WU, Xin LI, Xuanyi MENG, Ping TONG, Juanli YUAN, Ying FENG
  • Publication number: 20220117112
    Abstract: Embodiments disclosed herein include heatsinks with transpiration cooling features. In an embodiment, a heatsink comprises a body with a first surface, a second surface, and a sidewall surface connecting the first surface to the second surface. In an embodiment, a first hole is formed into the first surface, where the first hole terminates before reaching the second surface. In an embodiment, the heatsink further comprises a second hole into the sidewall surface, where the second hole intersects the first hole.
    Type: Application
    Filed: October 12, 2020
    Publication date: April 14, 2022
    Inventors: Prabhakar SUBRAHMANYAM, Ying-Feng PANG, Yi XIA, Muhammad AHMAD
  • Publication number: 20220077023
    Abstract: An apparatus is described. The apparatus includes a metallic chamber having a first outer surface with first Peltier devices and a second outer surface with second Peltier devices. The first and second outer surfaces face in opposite directions such that the first Peltier devices are to cool first semiconductor chips that face the first outer surface and the second Peltier devices are to cool second semiconductor chips that face the second outer surface.
    Type: Application
    Filed: November 12, 2021
    Publication date: March 10, 2022
    Inventors: Prabhakar SUBRAHMANYAM, Yi XIA, Ying-Feng PANG, Ridvan A. SAHAN
  • Publication number: 20210351106
    Abstract: Embodiments disclosed herein include a thermal testing unit. In an embodiment, the thermal testing unit comprises a nozzle frame, and a nozzle plate within the frame. In an embodiment, the nozzle plate comprises a plurality of orifices through a thickness of the nozzle plate. In an embodiment, the thermal testing unit further comprises a housing attached to the nozzle plate.
    Type: Application
    Filed: May 11, 2020
    Publication date: November 11, 2021
    Inventors: Prabhakar SUBRAHMANYAM, Tewodros WONDIMU, Ying-Feng PANG, Muhammad AHMAD, Paul DIGLIO, David SHIA, Pooya TADAYON
  • Publication number: 20210289659
    Abstract: The present disclosure is directed to systems and methods of improving the thermal performance of processor-based devices. Such thermal performance improvement may include limiting the degree of tilt experienced by a semiconductor device as a thermal solution coupled to the semiconductor device is tightened to the substrate. Such thermal performance improvements may include increasing the available heat transfer area associated with a particular heat producing semiconductor device. Such thermal performance improvements may include thermally coupling one or more cool blocks thermally coupled to one or more remote heat-producing devices to a central cool block that may be cooled using a cooling medium or coupled to a central heat-producing semiconductor device.
    Type: Application
    Filed: April 27, 2020
    Publication date: September 16, 2021
    Applicant: Intel Corporation
    Inventors: Prabhakar SUBRAHMANYAM, Casey WINKEL, Yingqiong BU, Ming ZHANG, Yuehong FAN, Yi XIA, Ying-Feng PANG
  • Patent number: 11108143
    Abstract: An antenna including a dielectric block with a groove, and a conductor arranged in the groove. The antenna is arranged to be excited to operate as a dielectric resonator antenna and a Fabry-Perot resonator antenna.
    Type: Grant
    Filed: September 4, 2019
    Date of Patent: August 31, 2021
    Assignee: City University of Hong Kong
    Inventors: Kwok Wa Leung, Li Ying Feng
  • Publication number: 20210116391
    Abstract: An apparatus is described. The apparatus includes an electronic system having a printed circuit board with electronic components mounted thereon. At least some of the electronic components are coupled to components of a liquid cooling system. The electronic system has a light source and a photosensitive element. The light source is to illuminate an illuminated region of the printed circuit board and/or at least one of the electronic components. The photosensitive element is to detect a change in reflection from the illuminated region in response to the presence of coolant that has leaked from the liquid cooling system within the illuminated region.
    Type: Application
    Filed: December 23, 2020
    Publication date: April 22, 2021
    Inventors: Prabhakar SUBRAHMANYAM, Ying-Feng PANG, Yi XIA, Mark BIANCO, Victor POLYANKO
  • Publication number: 20210120703
    Abstract: An apparatus is described. The apparatus includes a liquid cooling system having multiple heat-exchangers and multiple valves. The multiple valves are to enable/disable participation of individual ones of the heat-exchangers within the liquid cooling system. The apparatus includes an information keeping device to store information that correlates a number of the multiple heat exchangers to be enabled to realize one or more semiconductor chips' target temperature for a power consumption of the one or more semiconductor chips for a plurality of combinations of target temperature and power consumption.
    Type: Application
    Filed: December 26, 2020
    Publication date: April 22, 2021
    Inventors: Prabhakar SUBRAHMANYAM, Arun KRISHNAMOORTHY, Victor POLYANKO, Ying-Feng PANG, Yi XIA, Pooya TADAYON, Muhammad AHMAD, Rahima K. MOHAMMED
  • Publication number: 20210066789
    Abstract: An antenna including a dielectric block with a groove, and a conductor arranged in the groove. The antenna is arranged to be excited to operate as a dielectric resonator antenna and a Fabry-Perot resonator antenna.
    Type: Application
    Filed: September 4, 2019
    Publication date: March 4, 2021
    Inventors: Kwok Wa Leung, Li Ying Feng
  • Patent number: 10930575
    Abstract: Reconfigurable cooling assemblies for thermal management of integrated circuitry are provided. Such assemblies can be modular and can permit or otherwise facilitate scalable thermal performance with respect to power dissipation demands. In some embodiments, a reconfigurable modular cooling assembly can be reversibly configured to adjust reversibly the cooling capacity of the assembly for a defined power dissipation requirement. A form factor of a reconfigurable modular cooling assembly can be based at least on the defined power dissipation requirement. In some embodiments, a reconfigurable modular cooling assembly can include a pedestal member and multiple attachment members that can be reversibly coupled to or reversibly decoupled from the pedestal based at least on a power dissipation condition and/or a change thereof in a dissipative electronic component included in a semiconductor package.
    Type: Grant
    Filed: September 30, 2016
    Date of Patent: February 23, 2021
    Assignee: Intel Corporation
    Inventors: Prabhakar Subrahmanyam, Tong W. Chao, Stephanie L. Seaman, Ridvan A. Sahan, Ying-Feng Pang
  • Patent number: 10923818
    Abstract: Systems and methods which provide a hollow dielectric block dual-fed dual-frequency antenna configuration, such as may be utilized for wireless device communication in multiple RF bands, multi-frequency radar applications, etc., are described. Embodiments of a hollow dielectric block dual-fed dual-frequency antenna provide operation with respect to widely separated frequencies, such as to operate at frequencies in both a millimeter-wave band and a microwave band. A hollow dielectric block dual-fed dual-frequency antenna of embodiments of the invention may be fabricated from a single hollow dielectric block configured to integrate a dielectric resonator antenna (DRA) and a Fabry-Perot resonator antenna (FPRA), wherein the hollow dielectric block may be configured to serve as the resonator for the DRA and the superstrate for the FPRA simultaneously. The resonant frequencies of the DRA and FPRA of a hollow dielectric block dual-fed dual-frequency antenna of embodiments can be determined independently.
    Type: Grant
    Filed: September 21, 2017
    Date of Patent: February 16, 2021
    Assignee: City University of Hong Kong
    Inventors: Kwok Wa Leung, Li Ying Feng
  • Publication number: 20210029868
    Abstract: A directional garlic seed throwing mechanism includes a base, a rotating device, a vision sensor, a seed throwing guide plate, a seed guide pipe and a plurality of bulbil adjusting devices. The rotating device includes a rotating motor detachably connected to the base and a turntable connected to an output end of the rotating motor. The seed throwing guide plate is arranged on the turntable to enable garlic seeds of seed containing bowls to fall into the seed guide pipe. The seed guide pipe has an upper port right below the bulbil adjusting devices and arranged on the base. An even number of the bulbil adjusting devices are fixed on the turntable uniformly and symmetrically and include the seed containing bowls and bulbil direction control devices for driving the bowls to rotate 180 degrees.
    Type: Application
    Filed: September 19, 2018
    Publication date: February 4, 2021
    Applicants: SHANDONG ACADEMY AGRICULTURAL MACHINERY SCIENCES, Shandong University
    Inventors: JINGXIN SHEN, YITIAN SUN, YONGJIA SUN, GANG CHEN, QING LONG LI, Xian Ying FENG, Jun Zhou, Peng Yan
  • Publication number: 20210028666
    Abstract: A stator of a brushless motor is disclosed which includes a stator core, an insulating frame arranged on the stator core, and a plurality of windings wound around the insulating frame. The stator core includes a ring-shaped yoke part and a pole part mounted to the radial inner side of the yoke part. The pole part includes a plurality of teeth spaced-apart from each other along the circumferential direction, and a ring-shaped portion arranged at and connected to the radial inner side of the teeth. The radial outer sides of the teeth abut against the radial inner side of the yoke part. The insulating frame is arranged on the pole part. A plurality of power terminals are fixed to one axial end of the insulating frame and respectively electrically connected to the windings.
    Type: Application
    Filed: July 27, 2020
    Publication date: January 28, 2021
    Inventors: Ying FENG, Yick Kun Kenny TSUI, Ping Wo POON, Kam Ting KO, Siu Kin TAM, Da Wei ZHOU
  • Patent number: 10899014
    Abstract: A multiple lens-based smart mechanical arm, wherein it comprises a multi joint multi-functional mechanical arm, a CCD camera for collecting PCB board images to be assembled, a bio-contact device, and a computer; the CCD camera is mounted on the multi joint multi-functional mechanical arm, the bio-contact device is mounted on the fingertip of the multi joint multi-functional mechanical arm, and the CCD camera, and the bio-contact device and the multi joint multi-functional mechanical arm are connected to the computer. The invention adds a biological tactile device on the basis of the binocular positioning to accurately locate the assembly target area and improve the accuracy of the assembly of the irregular parts. The conversion relationship between the pressure and electric output of the sensitive material in the bio-contact device and the mathematical model of pressure and position is applied.
    Type: Grant
    Filed: December 7, 2016
    Date of Patent: January 26, 2021
    Inventors: Juan Du, Jiansheng Tan, Ying Feng
  • Publication number: 20200027808
    Abstract: Reconfigurable cooling assemblies for thermal management of integrated circuitry are provided. Such assemblies can be modular and can permit or otherwise facilitate scalable thermal performance with respect to power dissipation demands. In some embodiments, a reconfigurable modular cooling assembly can be reversibly configured to adjust reversibly the cooling capacity of the assembly for a defined power dissipation requirement. A form factor of a reconfigurable modular cooling assembly can be based at least on the defined power dissipation requirement. In some embodiments, a reconfigurable modular cooling assembly can include a pedestal member and multiple attachment members that can be reversibly coupled to or reversibly decoupled from the pedestal based at least on a power dissipation condition and/or a change thereof in a dissipative electronic component included in a semiconductor package.
    Type: Application
    Filed: September 30, 2016
    Publication date: January 23, 2020
    Inventors: Prabhakar SUBRAHMANYAM, Tong W. CHAO, Stephanie L. SEAMAN, Ridvan A. SAHAN, Ying-Feng PANG
  • Patent number: 10493078
    Abstract: A compound having the structure set forth in Formula (I) and Formula (II): wherein the substituents Y, Z, A, B, R1, R2, R3, R4 and R5 are as defined herein. Provided herein are inhibitors of poly(ADP-ribose)polymerase activity. Also described herein are pharmaceutical compositions that include at least one compound described herein and the use of a compound or pharmaceutical composition described herein to treat diseases, disorders and conditions associated with a PTEN deficiency that are ameliorated by the inhibition of PARP activity.
    Type: Grant
    Filed: August 3, 2018
    Date of Patent: December 3, 2019
    Assignee: Medivation Technologies LLC
    Inventors: Daniel Chu, Bing Wang, Ying Feng, Yuqiao Shen, Leonard E. Post
  • Patent number: 10452443
    Abstract: Generally, this disclosure provides systems, devices, methods and computer readable media for dynamic tuning of multiprocessor and multicore computing systems to improve application performance and scalability. A system may include a number of processing units (CPUs) and profiling circuitry configured to detect the existence of a scalability problem associated with the execution of an application on CPUs and to determine if the scalability problem is associated with an access contention or a resource constraint. The system may also include scheduling circuitry configured to bind the application to a subset of the total number of CPUs if the scalability problem is associated with access contention.
    Type: Grant
    Filed: August 7, 2017
    Date of Patent: October 22, 2019
    Assignee: Intel Corporation
    Inventors: Keqiang Wu, Kingsum Chow, Ying Feng, Khun Ban
  • Publication number: 20190089056
    Abstract: Systems and methods which provide a hollow dielectric block dual-fed dual-frequency antenna configuration, such as may be utilized for wireless device communication in multiple RF bands, multi-frequency radar applications, etc., are described. Embodiments of a hollow dielectric block dual-fed dual-frequency antenna provide operation with respect to widely separated frequencies, such as to operate at frequencies in both a millimeter-wave band and a microwave band. A hollow dielectric block dual-fed dual-frequency antenna of embodiments of the invention may be fabricated from a single hollow dielectric block configured to integrate a dielectric resonator antenna (DRA) and a Fabry-Perot resonator antenna (FPRA), wherein the hollow dielectric block may be configured to serve as the resonator for the DRA and the superstrate for the FPRA simultaneously. The resonant frequencies of the DRA and FPRA of a hollow dielectric block dual-fed dual-frequency antenna of embodiments can be determined independently.
    Type: Application
    Filed: September 21, 2017
    Publication date: March 21, 2019
    Inventors: Kwok Wa Leung, Li Ying Feng