Patents by Inventor Ying Yu

Ying Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250004647
    Abstract: A processing device analyzes one or more property and capability characteristics of a plurality of memory devices produced in a development process executed by a memory device development system and identifies respective subsets of the plurality of memory devices having property and capability characteristics that meet respective standards associated with a plurality of different use cases. The processing device further allocates the respective subsets to groups of memory devices corresponding to the different use cases.
    Type: Application
    Filed: May 29, 2024
    Publication date: January 2, 2025
    Inventors: Ying Yu Tai, Jun Wan, Seungjune Jeon, Zhenming Zhou, Jiangli Zhu
  • Patent number: 12182318
    Abstract: Methods, systems, and devices for cryptographic key management are described. A memory device can issue, by a firmware component, a command to generate a first cryptographic key for encrypting or decrypting user data stored on a memory device. The memory device can generate, by a hardware component, the first cryptographic key based on the command. The memory device can encrypt, by the hardware component, the first cryptographic key using a second cryptographic key and an initialization vector. The memory device can store the encrypted first cryptographic key in a nonvolatile memory device separate from the hardware component.
    Type: Grant
    Filed: February 22, 2023
    Date of Patent: December 31, 2024
    Assignee: Micron Technology, Inc.
    Inventors: Juane Li, Jiangli Zhu, Ying Yu Tai
  • Publication number: 20240411647
    Abstract: Snapshots for object storage buckets, including: receiving a command to generate a snapshot of a bucket of object storage of a storage system, wherein the snapshot records a state of the bucket at a particular point in time; and generating, in response to the command, the snapshot.
    Type: Application
    Filed: August 19, 2024
    Publication date: December 12, 2024
    Inventors: RONALD KARR, SHAO-TING CHANG, YING YU LIU, HARVEY RAJA, SHARAD JAIN, MANCHUN ZHENG, VICTOR YIP
  • Patent number: 12164769
    Abstract: Aspects of the present disclosure configure a system component, such as a memory sub-system controller, to provide adaptive media management based on memory component reliabilities. The controller can access configuration data to determine a reliability grade associated with individual groups of the memory components. The controller can then adaptively select between different media management operations based on the reliability grade associated with each individual group of the memory components.
    Type: Grant
    Filed: May 9, 2022
    Date of Patent: December 10, 2024
    Assignee: Micron Technology, Inc.
    Inventors: Zhenming Zhou, Ying Yu Tai
  • Publication number: 20240402147
    Abstract: A method of establishing a cancer screening model is provided, including: providing a plurality of samples and a plurality of corresponding cancer states; analyzing these samples by a low-resolution mass spectrometer to obtain a plurality of mass spectral data, wherein the low-resolution mass spectrometer is undertaken a mass accuracy level above 5 ppm and a mass resolution (m/?m) below 10,000; inputting these mass spectral data into a machine learning algorithm to obtain a plurality of markers by a feature selection method; and using these markers and these cancer states by the machine learning algorithms to establish cancer screening model.
    Type: Application
    Filed: May 28, 2024
    Publication date: December 5, 2024
    Inventors: Cheng-Chih HSU, Hou-Chun HUANG, Hsin-Hsiang CHUNG, Laura Min Xuan CHAI, Yi-Hsin CHEN, Jia-Ying YU, Ming-Yang WANG
  • Publication number: 20240397686
    Abstract: A processor placement tool that prevents removal of the processor module unless the protective cover is in place. In order to prevent engagement of the gripping devices against the processor module, piston interlocks are provided that block rotation of the gripping devices unless the protective cover is in place. The piston interlocks release their blocking when they contact the protective cover.
    Type: Application
    Filed: May 26, 2023
    Publication date: November 28, 2024
    Inventors: Noah Singer, Mark D. Schultz, Yuet-Ying Yu, Scott R. LaPree, Jason R. Eagle
  • Patent number: 12147689
    Abstract: Aspects of the present disclosure configure a system component, such as a memory sub-system controller, to provide adaptive media management based on temperature-related memory component capabilities. The controller can obtain a write temperature associated with an individual group of memory components. Based on the write temperature and a temperature threshold associated with the individual group of memory components, the controller can select an individual media management operation to perform.
    Type: Grant
    Filed: August 3, 2023
    Date of Patent: November 19, 2024
    Assignee: Micron Technology, Inc.
    Inventors: Zhenming Zhou, Ying Yu Tai
  • Publication number: 20240373651
    Abstract: A semiconductor device includes a semiconductor substrate and an interconnection structure. The interconnection structure is disposed over the semiconductor substrate. The interconnection structure includes first conductive lines, second conductive lines, and ovonic threshold switches. The first conductive lines extend parallel to each other in a first direction. The second conductive lines are stacked over the first conductive lines and extend parallel to each other in a second direction perpendicular to the first direction. The ovonic threshold switches are disposed between the first conductive lines and the second conductive lines. The ovonic threshold switches include a ternary GeCTe material. The ternary GeCTe material consists substantially of carbon, germanium, and tellurium. In the ternary GeCTe material, a content of carbon is in a range from 10 to 30 atomic percent and a content of germanium is in a range from 10 to 65 atomic percent.
    Type: Application
    Filed: July 14, 2024
    Publication date: November 7, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chien-Min Lee, Tung-Ying Lee, Cheng-Hsien WU, Xinyu BAO, Hengyuan Lee, Ying-Yu Chen
  • Patent number: 12135876
    Abstract: A computing system having a memory component with an embedded media controller. The memory component is encapsulated within an integrated circuit (IC) package. The embedded controller within the IC package is configured to: receive incoming packets, via a serial communication interface of the controller, from a serial connection outside of the IC package; convert the incoming packets into commands and addresses according to a predetermined serial communication protocol; operate memory units encapsulated within the IC package according to the commands and the addresses; convert results of at least a portion of the commands into outgoing packets; and transmit the outgoing packets via the serial communication interface to the serial connection outside of the IC package.
    Type: Grant
    Filed: October 17, 2018
    Date of Patent: November 5, 2024
    Assignee: Micron Technology, Inc.
    Inventors: Samir Mittal, Gurpreet Anand, Ying Yu Tai, Cheng Yuan Wu
  • Publication number: 20240359118
    Abstract: Systems and methods for separating components of a mixture are provided. The systems can include at least one section that defines a tortured path configured to provide some components in one direction along the section and other components in another direction along the section. Methods can provide for the separation of bubbles within a liquid matrix, liquid separation, liquid/solid separation, and/or solids separation.
    Type: Application
    Filed: July 8, 2024
    Publication date: October 31, 2024
    Applicant: Battelle Memorial Institute
    Inventors: Leonard F. Pease, Xiao-Ying Yu, Timothy G. Veldman, Matthew S. Fountain, Michael J. Minette, Carolyn A. Burns, Nathan R. Phillips, Jason E. Serkowski, Judith A. Bamberger, Raymond S. Addleman
  • Patent number: 12114512
    Abstract: A semiconductor device includes a semiconductor substrate and an interconnection structure. The interconnection structure is disposed over the semiconductor substrate. The interconnection structure includes first conductive lines, second conductive lines, and ovonic threshold switches. The first conductive lines extend parallel to each other in a first direction. The second conductive lines are stacked over the first conductive lines and extend parallel to each other in a second direction perpendicular to the first direction. The ovonic threshold switches are disposed between the first conductive lines and the second conductive lines. The ovonic threshold switches include a ternary GeCTe material. The ternary GeCTe material consists substantially of carbon, germanium, and tellurium. In the ternary GeCTe material, a content of carbon is in a range from 10 to 30 atomic percent and a content of germanium is in a range from 10 to 65 atomic percent.
    Type: Grant
    Filed: July 25, 2023
    Date of Patent: October 8, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chien-Min Lee, Tung-Ying Lee, Cheng-Hsien Wu, Xinyu Bao, Hengyuan Lee, Ying-Yu Chen
  • Patent number: 12098477
    Abstract: The present disclosure provides a manufacturing method of semi-insulating single-crystal silicon carbide powder comprising: providing a semi-insulating single-crystal silicon carbide bulk, wherein the semi-insulating single-crystal silicon carbide bulk has a first silicon-vacancy concentration, and the first silicon-vacancy concentration is greater than 5E11 cm{circumflex over (?)}?3; refining the semi-insulating single-crystal silicon carbide bulk to obtain a semi-insulating single-crystal silicon carbide coarse particle, wherein the semi-insulating single-crystal silicon carbide coarse particle has a second silicon-vacancy concentration and a first particle diameter, the second silicon-vacancy concentration is greater than 5E11 cm{circumflex over (?)}?3, and the first particle diameter is between 50 ?m and 350 ?m; self-impacting the semi-insulating single-crystal silicon carbide coarse particle to obtain a semi-insulating single-crystal silicon carbide powder, wherein the semi-insulating single-crystal sili
    Type: Grant
    Filed: June 3, 2021
    Date of Patent: September 24, 2024
    Assignee: TAISIC MATERIALS CORP.
    Inventors: Dai-Liang Ma, Bang-Ying Yu, Bo-Cheng Lin
  • Patent number: 12039196
    Abstract: A processing device in a memory system determines that a number of commands from an active queue that have been executed on a memory device does not satisfy an executed transaction threshold criterion, that a number of pending commands in an inactive queue satisfies a first promotion threshold criterion, and that a number of pending commands in the active queue does not satisfy a second promotion threshold criterion. In response, the processing device switches an execution grant from the active queue to the inactive queue.
    Type: Grant
    Filed: May 21, 2021
    Date of Patent: July 16, 2024
    Assignee: Micron Technology, Inc.
    Inventors: Jiangli Zhu, Wei Wang, Ying Yu Tai, Jason Duong, Chih-Kuo Kao
  • Publication number: 20240234337
    Abstract: Disclosed in the present invention are an electromagnetic shielding structure, a manufacturing method and a communication terminal. The electromagnetic shielding structure comprises a module substrate, which is formed with a plurality of grounding holes penetrating through the module substrate, and the plurality of grounding holes jointly define a mounting area; a device to be shielded, which is attached to the module substrate and located in the mounting area; a plurality of grounding bonding pads, which are respectively arranged in the grounding holes in a penetrating manner; and a plurality of wires, wherein the two ends of each wire are respectively connected to two different grounding bonding pads, such that the plurality of wires jointly form a shielding layer erected above the device to be shielded.
    Type: Application
    Filed: January 18, 2024
    Publication date: July 11, 2024
    Applicant: VANCHIP (TIANJIN) TECHNOLOGY CO., LTD.
    Inventors: Ying YU, Yunfang BAI
  • Patent number: 12035542
    Abstract: A semiconductor device includes a semiconductor substrate and an interconnection structure. The interconnection structure is disposed over the semiconductor substrate. The interconnection structure includes first conductive lines, second conductive lines, and ovonic threshold switches. The first conductive lines extend parallel to each other in a first direction. The second conductive lines are stacked over the first conductive lines and extend parallel to each other in a second direction perpendicular to the first direction. The ovonic threshold switches are disposed between the first conductive lines and the second conductive lines. The ovonic threshold switches include a ternary GeCTe material. The ternary GeCTe material consists substantially of carbon, germanium, and tellurium. In the ternary GeCTe material, a content of carbon is in a range from 10 to 30 atomic percent and a content of germanium is in a range from 10 to 65 atomic percent.
    Type: Grant
    Filed: September 22, 2023
    Date of Patent: July 9, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chien-Min Lee, Tung-Ying Lee, Cheng-Hsien Wu, Xinyu Bao, Hengyuan Lee, Ying-Yu Chen
  • Patent number: 12028997
    Abstract: An electronic assembly is provided. The electronic assembly may include an electronic module mounted to a laminate, a cooling apparatus directly above the module, a single thermal interface material positioned between and directly contacting the module and the cooling apparatus, and a rotating cover rotatably attached to a top frame secured to the laminate, wherein the rotating cover includes an open position and a closed position.
    Type: Grant
    Filed: June 28, 2021
    Date of Patent: July 2, 2024
    Assignee: International Business Machines Corporation
    Inventors: Noah Singer, Jeffrey Allen Zitz, Mark D. Schultz, John Torok, William L. Brodsky, Yuet-Ying Yu, Shawn Canfield
  • Publication number: 20240211054
    Abstract: An electronic device includes a case and a shoulder button module. The shoulder button module is movably disposed in the case and includes a keycap, a push switch, and a touch sensing assembly. The keycap is exposed from the case. The push switch is located in the case and disposed under the keycap. When the keycap is pushed downward, the push switch is triggered. The touch sensing assembly is disposed in the keycap so as to sense an input command touched on the keycap.
    Type: Application
    Filed: October 12, 2023
    Publication date: June 27, 2024
    Applicant: ASUSTeK COMPUTER INC.
    Inventors: Tsung-Yi Lin, Chao-Yang Cheng, Shang-Yu Hung, Shiang-Cong Chen, Ying-Yu Chen, Wei-Ting Cheng, Jyun-Miao Hong
  • Publication number: 20240118893
    Abstract: This application relates to a pulse modulation control system, device, and method. The system includes a processor based on a RISC-V open-source instruction set architecture and a pulse modulation interface module. The processor is configured to receive an operation instruction of a user, and generate a data signal based on the operation instruction. The pulse modulation interface module is connected to the processor, and is configured to receive the data signal and output a preset waveform based on the data signal. Based on the RISC-V open-source instruction set architecture, the user may customize operations, which improves efficiency and flexibility of a pulse modulation process, and optimizes power consumption.
    Type: Application
    Filed: December 19, 2023
    Publication date: April 11, 2024
    Inventors: Zhen Xiang, Qishen Lv, Yan Li, Xin Zhang, Ying Yu
  • Publication number: 20240111431
    Abstract: A system can include a memory device a memory device comprising multiple dies, and a processing device, operatively coupled with the memory device, to perform various operations including identifying multiple management units to be programmed, where one management unit contains memory cells from a die having one endurance metric and another management unit contains memory cells from a die having another endurance metric, and determining a value of a media endurance metric for each management unit. The operations further include determining, for each management unit, a respective endurance exhaustion parameter defined by a relationship media endurance metrics, and distributing operations to each management unit based on the endurance exhaustion parameter.
    Type: Application
    Filed: September 30, 2022
    Publication date: April 4, 2024
    Inventors: Ying Yu Tai, Seungjune Jeon
  • Patent number: D1037746
    Type: Grant
    Filed: December 22, 2022
    Date of Patent: August 6, 2024
    Assignee: Starbucks Corporation
    Inventors: Claudia Ying Yu Lee, Sheryl Wing Yan Tu