Abstract: A method of manufacturing a substrate using a carrier, that includes preparing a carrier having a releasing layer, and insulating layers and metal layers sequentially disposed on both sides of the releasing layer; patterning the metal layers to form base circuit layers; forming buildup layers on the base circuit layers; executing a routing process to separate the insulating layers from the releasing layer; and forming solder resist layers on the buildup layers and forming openings in the solder resist layers and the insulating layers to expose pads.

Abstract: Disclosed herein are a nickel-zinc-copper (NiZnCu) based ferrite composition containing 0.001 to 0.3 parts by weight of bivalent metal, 0.001 to 0.3 parts by weight of trivalent metal, and 0.001 to 0.5 parts by weight of tetravalent metal based on 100 parts by weight of main component containing 47.0 to 50.0 mol % of Fe2O3, 15.0 to 27.0 mol % of NiO, 18.0 to 25.0 mol % of ZnO, and 7.0 to 13.0 mol % of CuO, and a multilayered chip device and a toroidal core using the same. According to exemplary embodiments of the present invention, a bivalent metal, a trivalent metal, and a tetravalent are contained in a NiZuCu ferrite, thereby making it possible to provide a ferrite composition having excellent quality factor (Q) characteristics. Moreover, it is possible to provide a toroidal core and a multilayered chip device having excellent sinterability, permittivity, and quality factor (Q) characteristics using the ferrite composition.

Abstract: There is provided a method of forming a gold thin film, the method including: forming a nickel plating layer on a surface of an object through electroless nickel (Ni) plating; forming a palladium-copper mixture plating layer on the nickel plating layer through electroless plating using a palladium-copper (Pd—Cu) mixture; and forming a first gold thin film by immersing the palladium-copper mixture plating layer in a gold (Au) galvanic electrolytic liquid to replace a portion of copper (Cu) particles in the palladium-copper mixture plating layer with gold particles through a replacement reaction.

Abstract: There is provided a multi-layered chip electronic component including: a multi-layered body formed by stacking a plurality of magnetic layers; and conductive patterns disposed between the plurality of magnetic layers and electrically connected in a lamination direction to form coil patterns, wherein in a case in which a single coil pattern in the coil pattern is projected in the length and width directions of the multi-layered body, when an area of the magnetic layer inside of the coil pattern is defined as Ai and an area of the magnetic layer outside of the coil pattern is defined as Ao, 0.40?Ai:Ao?1.03 is satisfied.

Abstract: There is provided a multi-layered chip electronic component including: a multi-layered body including a 2016-sized or less and a plurality of magnetic layers; conductive patterns electrically connected in a stacking direction to form coil patterns, within the multi-layered body; and non-magnetic gap layers formed over a laminated surface of the multi-layered body between the multi-layered magnetic layers and having a thickness Tg in a range of 1 ?m?Tg?7 ?m, wherein the number of non-magnetic gap layers may have the number of gap layers in a range between at least four layers among the magnetic layers and a turns amount of the coil pattern.

Abstract: There is provided a multi-layered chip electronic component, including: a multi-layered body including a plurality of first magnetic layers on which conductive patterns are formed; and second magnetic layers interposed between the first magnetic layers within the multi-layered body, wherein the conductive patterns are electrically connected to form coil patterns in a stacking direction, and when a thickness of the second magnetic layer is defined as Ts and a thickness of the conductive pattern is defined as Te, 0.1?Ts:Te?0.3 is satisfied.

Abstract: There are provided a non-magnetic composition for a ceramic electronic component, a ceramic electronic component manufactured by using the same, and a manufacturing method thereof. The non-magnetic composition for a ceramic electronic component includes a compound represented by ZnCuTiO4 such that the inductance decreasing rate at the high current and the capacitance rate of change of the magnetic body after the application of current according to the temperature change are insensitive, whereby the stable operational characteristics of the ceramic electronic component may be secured.

Abstract: There are provided a composition for a ceramic electronic component having excellent sinterability and magnetic characteristics (Q), a manufacturing method thereof, and an electronic component using the same. The magnetic material composition for the ceramic electronic component is composed of ferric oxide (Fe2O3) of 47.0 to 49.0 parts by mole, nickel oxide (NiO) of 16.0 to 24.0 parts by mole, zinc oxide (ZnO) of 18.0 to 25.0 parts by mole, and copper oxide (CuO) of 7.0 to 13.0 parts by mole, wherein a portion of ferric oxide may be substituted with boron oxide (B2O3). The ceramic electronic component manufactured by using the magnetic material composition for the ceramic electronic component has an excellent Q.

Abstract: A package substrate includes a solder resist layer having a level surface, a circuit pattern buried in the solder resist layer, and a bump protruding from the solder resist layer.

Abstract: Disclosed herein is a multilayer type power inductor including: a plurality of body layers including internal electrodes and having magnetic material layers stacked therein; and a plurality of gap layers, wherein the gap layer has an asymmetrical structure. In the multilayer type power inductor, portions that are in contact with the body layers have, a non-porous structure, which is a dense structure, and portions that are not in contact with the body layers have a porous structure, such that the gap layer has the asymmetrical structure. Therefore, a magnetic flux propagation path in a coil is dispersed to suppress magnetization at a high current, thereby making it possible to improve a change in inductance (L) value according to the application of current.

Abstract: There are provided a non-magnetic composition for a ceramic electronic component, a ceramic electronic component using the same, and a method of manufacturing the same. The non-magnetic composition includes a compound represented by Chemical Formula Zn1-xCuxMn2O4. Therefore, DC bias characteristics of the ceramic electronic component may be improved by employing the non-magnetic composition having no magnetic characteristics.

Abstract: A package substrate and a method of manufacturing the package substrate are disclosed. The method of manufacturing the package substrate may include stacking a second metal layer in which at least one hole is formed over a first metal layer, stacking a barrier layer over the first metal layer exposed in the hole and over the second metal layer, forming at least one bump by filling the hole with a conductive metal, stacking an insulation layer over the bump and forming a circuit pattern over the insulation layer, and removing the first metal layer, the second metal layer, and the barrier layer.

Abstract: There is provided a multilayered inductor, including: an inductor body; a coil part formed on the inductor body and having a conductive circuit and a conductive via; and external electrodes formed on both end surfaces of the inductor body, wherein the inductor body includes 65 to 95 wt % of a metallic magnetic material and 5 to 35 wt % of an organic material.

Abstract: There is provided a laminated inductor including: a body in which a plurality of magnetic layers are stacked; at least one non-magnetic layers interposed between the magnetic layers and including a Al2O3 dielectric material and a K—B—Si-based glass; and a plurality of internal electrodes formed on the magnetic layers.

Abstract: Disclosed herein are a nickel-zinc-copper (NiZnCu) based ferrite composition containing 0.001 to 0.3 parts by weight of bivalent metal, 0.001 to 0.3 parts by weight of trivalent metal, and 0.001 to 0.5 parts by weight of tetravalent metal based on 100 parts by weight of main component containing 47.0 to 50.0 mol % of Fe2O3, 15.0 to 27.0 mol % of NiO, 18.0 to 25.0 mol % of ZnO, and 7.0 to 13.0 mol % of CuO, and a multilayered chip device and a toroidal core using the same. According to exemplary embodiments of the present invention, a bivalent metal, a trivalent metal, and a tetravalent are contained in a NiZuCu ferrite, thereby making it possible to provide a ferrite composition having excellent quality factor (Q) characteristics. Moreover, it is possible to provide a toroidal core and a multilayered chip device having excellent sinterability, permittivity, and quality factor (Q) characteristics using the ferrite composition.

Abstract: Disclosed herein are a ferrite powder having a core-shell structure, the core being made of iron (Fe) or iron-based compounds comprising iron (Fe) and the shell being made of metal oxides, a ferrite material comprising the ferrite powder and the glass, and multilayered chip components including the ferrite layer using the ferrite material, inner electrodes, and outer electrodes. According to the exemplary embodiments of the present invention, it is possible to provide the ferrite material capable of improving the change in the inductance L value in response to applied current by suppressing magnetization at high current. The multilayered chip components including the ferrite material according to the exemplary embodiment of the present invention can also be used in a band of MHz.

Abstract: Disclosed herein are a multilayer power inductor and a method of manufacturing the same. The multilayer power inductor includes a multilayer body formed by multi-layering a plurality of body sheets; a coil portion including internal electrode patterns that are respectively formed on the plurality of body sheets; and external electrodes that are disposed on lateral surfaces of the multilayer body and are electrically connected to both ends of the coil portion, wherein a space portion is formed in the internal electrode pattern to correspond to contraction of the plurality of body sheet. The multilayer power inductor relieves internal stress generated in a product through the space portion so as to prevent the body sheet from being magnetized due to the internal stress, thereby preventing a reduction in inductance. The multilayer inductor may also be manufactured by using conventional manufacturing processes themselves without any influence on the productivity of a product.

Abstract: Disclosed herein are a multilayered power inductor including a magnetic layer having a structure in which a metal magnetic powder is distributed on a glass substrate, a composition for the magnetic layer, and a method for preparing a multilayered power inductor. According to an exemplary embodiment of the present invention, the multilayered power inductor including a magnetic layer obtained by mixing the metal magnetic powder having high Ms with the glass substrate has excellent bias characteristics having small variations in capacity even when high current is applied. In addition, the exemplary embodiment of the present invention can use Cu as an inner electrode, instead of an expensive precious metal Ag.

Abstract: Disclosed are a multilayered power inductor, including: a body in which a plurality of magnetic layers formed with inner electrodes are stacked; and a plurality of gap layers, wherein the plurality of gap layers are formed so as not to contact external electrodes formed at both sides of the body, and a gap composition of the multilayered power inductor. In addition, as the gap composition, the exemplary embodiment of present invention can prepare tetravalent or tetravalent dielectric oxide into the paste type and applies the gap layer structure thereto, thereby facilitating the structural design and the thickness control of the gap layer as compared with the case of forming the gap layer in the sheet shape of the related art and improving the DC-bias characteristics by maximally suppressing the diffusion with the body.

Abstract: Disclosed herein is a multilayer type power inductor including: a plurality of body layers including internal electrodes and having magnetic material layers stacked therein; and a plurality of gap layers, wherein the gap layer has an asymmetrical structure. In the multilayer type power inductor, portions that are in contact with the body layers have, a non-porous structure, which is a dense structure, and portions that are not in contact with the body layers have a porous structure, such that the gap layer has the asymmetrical structure. Therefore, a magnetic flux propagation path in a coil is dispersed to suppress magnetization at a high current, thereby making it possible to improve a change in inductance (L) value according to the application of current.