Abstract: The present invention relates to semiconductor device manufacturing techniques, and specifically to a field of device packaging techniques at wafer level. More specifically, it relates to a cap wafer for wafer bonding application that is bonded to top part of a device wafer. The method of the present invention excludes the use of deep reactive ion etching of silicon to form a through silicon via. The present invention provides a method for the preparation of cap wafer for wafer bonding application with a simple process of through silicon via interconnection and a wafer level packaging method using the same.

Abstract: An internal voltage generating apparatus for a semiconductor integrated circuit includes a detecting circuit configured to detect levels of a plurality of internal voltages, to generate a plurality of voltage enable signals and a pump enable signal. A pump circuit performs a voltage pumping operation in response to the pump enable signal and outputs the plurality of internal voltages in response to the plurality of voltage enable signals.

Abstract: The present invention relates to a micro USB memory package and a method for manufacturing the same. The object of the present invention is to provide a micro USB memory package and a method for manufacturing the same, which can meet the USB standard specification, can have light, thin, short and small configuration, can have various applications, and can simply expand the memory capacity thereof.

Abstract: Disclosed is a memory device including self-ID information. The memory device has a storage unit for storing information related to the memory device, such as a manufacturing factory, a manufacturing date, a wafer number, coordinates on a wafer and the like. Each bank of the memory device stores self-ID information related to the memory device and outputs the self-ID information out of a chip when an address is applied thereto during a test mode.

Abstract: The present invention relates to a manufacturing method of a package substrate. A manufacturing method of a package substrate for mounting an electric component by connecting electrodes of the electric component to bonding pads, includes: manufacturing a buried pattern substrate having a circuit pattern and bonding pads buried in an insulating layer and having a seed layer laminated on the insulating layer, laminating a dry film onto the seed layer and removing the seed layer and the dry film of the upper side of the bonding pads, performing surface-treatment using the remaining seed layer as a plating lead; and removing the remaining seed layer and the dry film such that the circuit pattern is exposed.

Abstract: Provided is a decoding circuit for a memory device which is improved in an operation of chip so as to enable the operation to be predictable by making a decoded result corresponding to an undefined code get a specific value. The decoding circuit for a memory device generates address signals by control signals set with a mode, and comprises a first logical circuit for decoding and outputting a result value defined by logically-combining the address signals corresponding to a first group and a second logical circuit for performing a decoding operation to have address signals with a specific value included in the defined result value by logically-combining address signals corresponding to a second group, by dividing the address signals into the first group corresponding to at least one defined result value and the second group corresponding to an undefined result value.

Abstract: A semiconductor chip package comprising a substrate with mounting leads and a manufacturing method thereof are provided. The semiconductor chip package comprises a substrate having a lower surface and an upper surface. A semiconductor chip with a plurality of bonding pads on an active surface is disposed on the upper surface of the substrate. The substrate includes a plurality of electrode pads on the upper surface and electrode terminals on the sides of the lower surface. Each of said electrode pads is electrically connected to a corresponding one of bonding pads and each of said electrode terminals is electrically connected to a corresponding one of the electrode pads. Further, the package includes a plurality of mounting leads, each having one end electrically connected to a corresponding one of said electrode terminals and the other end extending outwardly from the substrate to serve as external connection terminals.

Abstract: An arc suppressing device for a cathode ray tube having an evacuated glass envelope which includes a funnel with a neck and a panel provided with a shadow mask. An electron gun is housed in the neck and includes a cathode and a plurality of electrodes supported by supporting beads. On the outer surface of the focusing electrode, at least one or more projecting metallic pieces pass through the supporting beads so that the ends thereof are exposed to the outside of the supporting bead. Between the ends of the projecting pieces and the inner surface of the neck, an electric field is formed to effectively prevent the occurrence of arcing in the bead channels.

Abstract: A photoelectrically controlled corner light system for a vehicle includes corner lights adjacent to headlights which are disposed in the right and left corners of the vehicle. The corner lights switched by operating a headlight turn lever are connected to a light detecting sensor for operatively controlling the brightness of its illumination. The light detecting sensors detects the light of headlights from opposing vehicles and controls the brightness of the illumination in the light system to prevent the view of a driver of the opposing vehicle from being disturbed.