Abstract: A liquid crystal display device including opposite first and second substrates, and column spacers between the first and second substrates, the column spacers formed such that the column spacers differ in size as positions of the column spacers differ, thereby accommodating the variation in gap between substrates when liquid crystal is concentrated at a lower end of the display due to gravity when a large LCD panel is in a vertical position.

Abstract: Disclosed are an apparatus for inspecting defect of a rubbing cloth and a rubbing apparatus with the same. The apparatus for inspecting defect of the rubbing cloth includes a housing surrounding the periphery of the rubbing cloth, a transfer unit connected to the upper portion of the housing for transferring the housing along a length direction of a rubbing roll, an illumination unit installed at one side in the housing for illuminating the rubbing cloth, and a camera unit installed at the other side in the housing to correspond to the illumination unit on the basis of the rubbing roll. The apparatus for inspecting defect of the rubbing cloth can rapidly and precisely detect the defect of the rubbing cloth by using the illumination unit and the camera unit.

Abstract: A medium supplying apparatus of an image forming device capable of removing static electricity generating in medium supplying operation by a ground. The medium supplying apparatus includes a medium supplying cassette mounted in a main body of the image forming device, a knock-up plate disposed to be movable up and down in the medium supplying cassette by at least one elastic member and to support printing media, a pickup roller to pick up the printing media loaded on the knock-up plate, a separating unit disposed on medium supplying cassette to separate the printing media one by one when the printing media are picked up, and a ground unit to ground the knock-up plate and the separating unit to the main body.

Abstract: Disclosed are a digital-analog converter and a camera module having the same. The digital-analog converter includes a plurality of decoders for receiving bits of a digital input signal by dividing the bits in a predetermined bit unit except for lower bits of the digital input signal, and decoding the bits into thermometer code signals, a delay unit for delaying output of the lower bits of the digital input signal, a latch unit for synchronizing output signals of the decoders with an output signal of the delay unit, and a current source for converting a digital signal output from the latch unit into an analog signal.

Abstract: A key testing apparatus (100) is provided. The key testing apparatus includes a base (11) and an actuator (12). The actuator includes a testing member (17) and a mounting member (18). The mounting member includes at least one base board (181) fixed to the base, a lower board (182), a mounting board (183), and a mounting sheet (185). The lower board is adjustably attached to the base board. The mounting board is adjustably attached to the lower board. The mounting sheet is adjustably attached to the mounting board. The clamping device includes a base desk (131), a clamping platform (132), at least one first clamping board (133) and second clamping board (134). The base desk is adjustably attached to the base. The clamping platform, at least one first clamping board, and at least one second clamping board are adjustably attached to the base desk.

Abstract: A method of fabricating a micro-vertical structure is provided. The method includes bonding a second crystalline silicon (Si) substrate onto a first crystalline Si substrate by interposing an insulating layer pattern and a cavity, etching the second crystalline Si substrate using a deep reactive ion etch (DRIE) process along a [111] crystal plane vertical to the second crystalline Si substrate, and etching an etched vertical surface of the second crystalline Si substrate using a crystalline wet etching process to improve the surface roughness and flatness of the etched vertical surface. As a result, no morphological defects occur on the etched vertical surface. Also, footings do not occur at an etch end-point due to the insulating layer pattern. In addition, the micro-vertical structure does not float in the air but is fixed to the first crystalline Si substrate, thereby facilitating subsequent processes.

Abstract: A memory device comprising an optimization component that facilitates erasing memory cells in a substantially homogeneous electromagnetic field and methods that facilitate erasing memory cells in a substantially homogeneous electromagnetic field are presented. The optimization component facilitates selecting a subset of memory cells to be erased at the same time, such that a memory cell in the subset of memory cells has two neighbor memory cells adjacent thereto that are in the subset of memory, or one neighbor memory cell adjacent thereto when the memory cell is an end-row memory cell. The optimization component facilitates performing a Fowler-Nordheim channel erase to erase the subset of memory cells, and a predetermined voltage potential associated with an erase command is applied to each cell of the subset of memory cells to facilitate reducing fringing effect associated with the electromagnetic fields applied to the cells during the erase.

Abstract: A secondary battery includes: an electrode assembly including positive and negative electrodes; a container adapted to receive the electrode assembly; a cap assembly having at least two terminals exposed outside the container, the cap assembly being adapted to be fixed to the container to seal the container; and lead elements adapted to electrically connect the terminals and the electrode assembly. A center of the terminals are aligned with a center of the electrode assembly, and the lead elements are spaced apart from the center of their respective terminals and adapted to be connected to their respective terminals and the electrode assembly.

Abstract: The present invention relates to a field coil assembly of an electromagnetic clutch for a compressor. A field coil assembly according to the present invention includes a field coil member 20 having a coil wire 22 extending outward; a power connecting member 30 having a sleeve 35 with a terminal 40 protruding out, the terminal electrically connecting the coil wire 22 to an external power source; a flange 28 coupled to one side of the field coil member 20 with the coil wire 22 drawn therefrom, the flange 28 having a catching portion 29 coupled with the sleeve 35, the flange 28 having electric conductivity; and a ground terminal 50 provided in the sleeve 35 and electrically connected to the terminal 40, the ground terminal 50 having at least a portion contacted with the catching portion 29.

Abstract: The present invention provides a process for producing reagents for a chemical reaction by introducing a fuel containing hydrocarbons into a flash distillation process wherein the fuel is separated into a first component having a lower average molecular weight and a second component having a higher average molecular weight. The first component is then reformed to produce synthesis gas wherein the synthesis gas is reacted catalytically to produce the desire reagent.

Abstract: Provided are a semiconductor package and a semiconductor package module including the same. The semiconductor package may include a plurality of semiconductor chips, a plurality of leads connected to pads of the semiconductor chips and externally exposed, wherein the plurality of leads may be classified into a plurality of pin groups, and the plurality of semiconductor chips may be classified into a plurality of chip groups, and the pads of the semiconductor chips of like chip groups may be connected to the leads of like pin groups.

Abstract: A multi-display digital photo frame is provided. The multi-display digital photo frame includes a front cover, a rear cover, and a body. The front cover includes at least two apertures, the body includes at least two holding components for placing LCDs, the bottom of each holding component mounted a LCD further for mounting a processor, wherein the processor is connected to the corresponding LCD through a bus.

Abstract: A method for transmitting a message from a mobile terminal in a mobile communication system. The method includes displaying a list of messages attempted to be transmitted, selecting a message from the list of transmitted messages that was unsuccessfully transmitted, and displaying detailed information about the selected message that was unsuccessfully transmitted.

Abstract: A secondary battery module includes a unit battery aggregate having a plurality of unit batteries arranged spaced from each other; a housing adapted to receive the unit battery aggregate; and a communicating member installed inside the housing, the communicating member adapted to supply a cooling medium flowing into the housing between a plurality of the unit batteries. The housing includes an inlet for flowing temperature control air into the unit battery aggregate, an outlet for flowing out the air passing through the unit battery, and a communicating member arranged perpendicular to the direction of inflow and outflow of the air with respect to the inlet and the outlet to communicate with a flowing channel between unit batteries, respectively.

Abstract: A semiconductor die package. Embodiments of the package can include a substrate with solid conductive pins disposed throughout. A semiconductor die can be attached to a surface of the substrate. Electrical connection to the semiconductor die can be provided by the solid conductive pins.

Abstract: A reflective-transmissive liquid crystal display (LCD) device with an improved display quality is achieved by forming a reflective area and a transmissive area having a cell gap greater than greater than that of the reflective area. A liquid crystal layer is disposed in a liquid crystal cell between the first and second substrates. The liquid crystal molecules are normally aligned at an angle equal to greater than about 45° with respect to a line parallel to the first substrate. The LCD device operates in a normally black mode.

Abstract: A semiconductor device according to an embodiment includes: a substrate on which a source/drain region is formed; a gate oxide that includes a first oxide formed on the substrate and implanted with fluorine impurity, and a second oxide formed on the first oxide; a gate electrode that is formed on the gate oxide; and a spacer that is formed on a side of the gate electrode.

Abstract: Disclosed herein is a method of building a map of a mobile platform moving in a dynamic environment and detecting an object using a 3D camera sensor, e.g., an IR TOF camera sensor, for localization. A localization technology to separate and map a dynamic object and a static object is applied to a mobile platform, such as an unmanned vehicle or a mobile robot. Consequently, the present method is capable of accurately building map information based on the static object in a dynamic environment having a large number of dynamic objects and achieving a dynamic object avoidance or chasing function using position information acquired to build the map.

Abstract: A method of manufacturing a MIM capacitor of a semiconductor device and a MIM capacitor. A MIM structure and a metal layer may be formed using a single process. A method of manufacturing a MIM capacitor may include forming a hole on and/or over a lower metal wire region. A method of manufacturing a MIM capacitor may include forming a lower metal layer, an inter-metal dielectric and/or an upper metal layer on and/or over a hole to form a MIM structure. Patterns to form a MIM structure and a metal layer may be formed at substantially the same time. If etching is performed with a photoresist pattern as a mask, a MIM structure and a metal layer structure may be formed at substantially the same time using a single mask.

Abstract: The present invention relates to a method and apparatus for accomplishing a requested operation selectively based upon features of other equipment between equippments connected through a digital interface such as the IEEE 1394.