Abstract: A method of transmitting a plurality of data units by a station in a wireless local area network (WLAN), includes performing, by the station, a clear channel assessment (CCA) on a bandwidth of an initial data unit of the plurality of data units; after performing the CCA, transmitting, by the station which has obtained a transmission opportunity (TXOP) for the plurality of data units, the initial data unit of the plurality of data units during the TXOP, wherein the initial data unit comprises a signal field including information on the bandwidth of the initial data unit; selecting, by the station, a bandwidth of a non-initial data unit of the plurality of data units to be narrower than the bandwidth of the initial data unit; and transmitting, by the station during the TXOP, the non-initial data unit, wherein the non-initial data unit comprises a signal field including information on the bandwidth of the non-initial data unit.

Abstract: According to one embodiment, a method for a wireless local area includes: generating a medium access control (MAC) protocol data unit (MPDU) to be transmitted to a target station; generating a physical layer convergence procedure (PLCP) protocol data unit (PPDU) by attaching a PLCP preamble to the MPDU; selecting a transmission channel; and transmitting the PPDU to the target station over the transmission channel. Selecting the transmission channel includes: performing clear channel assessment (CCA) on a first channel to determine whether the first channel is idle; and only after it is determined that the first channel is idle, selecting the first channel and at least one idle second channel as the transmission channel. The PLCP preamble includes channel allocation information indicating a bandwidth of the transmission channel.

Abstract: A fan-out semiconductor package module includes: a structure including a wiring member including wiring patterns, one or more first passive components disposed on the wiring member and electrically connected to the wiring pattern, and a first encapsulant encapsulating at least portions of each of the one or more first passive components, and having a first through-hole penetrating through the wiring member and the first encapsulant; a semiconductor chip disposed in the first through-hole of the structure and having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface; a second encapsulant encapsulating at least portions of the semiconductor chip and filling at least portions of the first through-hole; and a connection member disposed on the structure and the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pads and the wiring patterns.

Abstract: A method performed at the electronic device for identifying an electronic device and peripheral apparatuses is provided. The method acquires image data regarding emitters of the peripheral apparatuses, determines emitting colors emitted from the emitters based on the acquired image data, and acquires identification information of the peripheral apparatuses mapped with the emitting colors.

Abstract: A fan-out fingerprint sensor package includes a first connection member having a through-hole, a fingerprint sensor disposed in the through-hole, an encapsulant encapsulating at least portions of the first connection member and the fingerprint sensor, and a second connection member disposed on the first connection member and an active surface of the fingerprint sensor. The first connection member includes a distribution layer. The second connection member includes a first insulating layer disposed on the distribution layer and the active surface, a redistribution layer disposed on the first insulating layer, a first via connecting the redistribution layer to a connection pad of the fingerprint sensor, and a second via connecting the redistribution layer to the distribution layer. The first via passes through the first insulating layer and at least a portion of the encapsulant, and the second via passes through the first insulating layer.

Abstract: A plasma processing apparatus includes a chamber, a window plate disposed in an upper portion of the chamber and having a fastening hole defined therein, an injector having a body part including a plurality of nozzles and configured to be fastened to the fastening hole, and a flange part extending radially from the body part to partially cover a bottom surface of the window plate when the body part is fastened to the fastening hole, and a stopper configured to be fastened to the body part on an upper surface of the window plate to hold the injector in the fastening hole when the body part is fastened to the fastening hole.

Abstract: The present invention relates to a ligand compound, catalyst system for olefin oligomerization, and a method for oligomerizing olefins using the same. The catalyst system for olefin oligomerization according to the present invention exhibit selectivity to 1-hexene or 1-octene while having excellent catalytic activity, thus enabling more efficient preparation of alpha-olefins.

Abstract: A portable device having a display, the display including a main surface area, a first curved surface area extending from a first side of the main surface area, and a second curved surface area extending from a second side of the main surface area that is opposite the first side, a sensor configured to detect a state of the portable device, and a controller configured to control the display to display a user interface (UI) on one of the first curved surface and the second curved surface based on the state detected by the sensor.

Abstract: The present disclosure provides a V2X antenna and a V2X antenna system. The V2X (Vehicle-to-Everything) antenna system includes: a first antenna arranged in a front surface of an interior of a vehicle, wherein the first antenna is configured to communicate at least one of a V2X signal or an LTE (Long Term Evolution) signal; a second antenna arranged in a rear surface of a roof of the vehicle, wherein the second antenna is configured to communicate at least one of the V2X signal or the LTE signal; and a tuner module configured to perform diversity communication in response to at least one of the V2X signal or the LTE signal received from the first antenna and the second antenna.

Abstract: The present invention relates to to an IEC 61850 information-based agent system for intelligent system management by a digital substation and an operation method therefor. To this end, an operating system-side agent device for sharing switch information, which is used in automatic recovery of a digital substation, between an operating system and an intelligent electronic device (IED) in the digital substation, the device including: a request unit requesting the switch information from an intelligent electronic device-side agent device mounted in the intelligent electronic device (IED); and a communication unit receiving the switch information from the intelligent electronic device-side agent device, the switch information being collected by the intelligent electronic device-side agent device, wherein the operating system-side agent device is provided as a module, and is mounted in the operating system.

Abstract: A liquid crystal display according to an exemplary embodiment of the present invention includes a substrate, a plurality of pixels arranged in a matrix on the substrate where each pixel includes a switching element, a plurality of gate lines that are connected to the switching elements and extend in a row direction, and a gate driver that is connected to the gate lines and is formed on the substrate as an integrated circuit. In the liquid crystal display, the gate driver includes a first region and a second region that is not aligned with the first region.

Abstract: A thermochemical sensor is provided. The thermochemical sensor comprises: a substrate structure comprising a thermoelectric surface having concave portions and convex portions; a base fiber disposed on the thermoelectric surface of the substrate structure; and a catalyst layer that conformally covers the thermoelectric surface of the substrate structure and the base fiber.

Abstract: A method for operating a plurality of carriers by a user equipment in a wireless communication system supporting a primary carrier and at least one secondary carrier, the method includes transmitting, to a base station, carrier capability information; receiving, from the base station, carrier configuration information, the carrier configuration information including an index of the at least one secondary carrier configured for the user equipment, the carrier configuration information being based upon the carrier capability information of the user equipment, the primary carrier being configured as a carrier for performing an initial network entry procedure; receiving, from the base station, a control channel including information regarding multi-carrier operation through the primary carrier; and transmitting, to the base station, traffic through one of the at least one secondary carrier based on the information regarding multi-carrier operation.

Abstract: A fan-out sensor package includes: a first semiconductor chip module including a first connection member having a first through-hole and a first wiring layer, a first semiconductor chip disposed in the first through-hole and having an active surface on which a sensing region and first connection pads are disposed, and an encapsulant encapsulating at least portions of the first connection member and the first semiconductor chip and filling at least portions of the first through-hole; a redistribution module having a second through-hole exposing at least a portion of the sensing region and including a redistribution layer; and electrical connection structures electrically connecting the first wiring layer and the first connection pads to the redistribution layer.

Abstract: An electronic component package includes first and second wiring parts including insulating layers, conductive patterns formed in the insulating layers, and conductive vias penetrating through the insulating layers, to be connected to the conductive patterns, respectively; a frame disposed between the first and second wiring parts and having conductive connection parts electrically connecting one or more through-holes with the first and second wiring parts and an electronic component disposed to be surrounded by the through-hole, to thereby be connected to the first wiring part, wherein the conductive patterns formed to be adjacent to the electronic component among the conductive patterns of the first wiring part are embedded in the insulating layer of the first wiring part.

Abstract: An antenna module includes a connection member including at least one wiring layer and at least one insulating layer; an integrated circuit (IC) disposed on a first surface of the connection member and electrically connected to at least one wiring layer; and an antenna package disposed on a second surface of the connection member, and including a dielectric layer, a plurality of antenna members, and a plurality of feed vias, wherein the antenna package further includes a chip antenna including a dielectric body and first and second electrodes, respectively disposed on first and second surfaces of the dielectric body, wherein the chip antenna is disposed to be spaced apart from the plurality of feed vias within the dielectric layer so that at least one of the first electrode or the second electrode is electrically connected to a corresponding wire of the at least one wiring layer.

Abstract: A method for transmitting a data unit and a device suing the same is provided. The device generates a physical layer protocol data unit (PPDU) that includes a first part and a second part. The first and second part are generated with different fast Fourier transform (FFT) size. A phase rotation of the second part is different from a phase rotation of the first part.

Abstract: An air conditioner includes a housing having a suction port and a discharge port, a main fan configured to draw air into the housing through the suction port and discharge air from the housing through the discharge port, an auxiliary fan configured to draw, into the housing, air discharged by the main fan and a controller configured to control a rotational speed of the auxiliary fan to change a direction in which air is discharged from the housing.

Abstract: A fan-out semiconductor package includes first and second structures. The first structure includes a first semiconductor chip, a first encapsulant, and a connection member. The second structure includes a second semiconductor chip, a second encapsulant, and conductive bumps. The first and second structures are disposed so that active surfaces of the first and second semiconductor chips face each other. The conductive bumps are electrically connected to a redistribution layer, and connection pads of the first and second semiconductor chips are connected to each other through the redistribution layer in a signal manner. Signal transmission times between one point of the redistribution layer and connection pads of each of the first and second semiconductor chips are substantially the same as each other.

Abstract: A composite antenna substrate and semiconductor package module includes: a fan-out semiconductor package including a semiconductor chip, an encapsulant encapsulating at least portions of the semiconductor chip, and a connection member including a redistribution layer electrically connected to connection pads; and an antenna substrate including an antenna member including antenna patterns, ground patterns, and feed lines, and a wiring member disposed below the antenna member and including wiring layers including feeding patterns electrically connected to the feed lines.