Abstract: Provided is an olefin-based polymer with excellent processability. The olefin-based polymer according to the present invention has a high molecular weight and a broad molecular weight distribution to show excellent processability and improved mechanical properties, thereby being usefully applied according to the intended use.

Abstract: The present disclosure relates to a ligand compound, a catalyst system for oligomerization, and a method for olefin oligomerization using the same. The catalyst system for oligomerization using the ligand compound according to the present disclosure has excellent catalytic activity, exhibits high selectivity to 1-hexene and 1-octene, and greatly reduces the production of the by-products, thereby enabling efficient preparation of alpha-olefin.

Abstract: A technique for controlling an electronic device thereof is provided. The technique includes, in response to an attachment device being selected by an external device from a list of attachment devices, receiving and storing mapping information in which data configured in a first communication format and data configured in a second communication format in relation to one function of the electronic device to which the attachment device is attached are mapped. In addition, in response to the data configured in the first communication format being received from an external device which is communicably connected with the attachment device, the data configured in the second communication format corresponding to the data configured in the first communication format based on the mapping information is acquired, and the data configured in the second communication format to the electronic device to control the one function of the electronic device to be performed is transmitted.

Abstract: A fan-out semiconductor package includes first and second structures. The first structure includes a first semiconductor chip, a first encapsulant, and a connection member. The second structure includes a second semiconductor chip, a second encapsulant, and conductive bumps. The first and second structures are disposed so that active surfaces of the first and second semiconductor chips face each other. The conductive bumps are electrically connected to a redistribution layer, and connection pads of the first and second semiconductor chips are connected to each other through the redistribution layer in a signal manner. Signal transmission times between one point of the redistribution layer and connection pads of each of the first and second semiconductor chips are substantially the same as each other.

Abstract: A semiconductor package and a method of manufacturing a semiconductor package are disclosed. The semiconductor package including a first substrate including a first cavity, a cavity mold configured to be inserted into the first cavity and including a second cavity, an electronic component inserted in the second cavity, and a second substrate formed on a surface of the first substrate, a surface of the cavity mold and a surface of the electronic component.

Abstract: A method is provided for transmitting a signal by a station in a wireless local area network (WLAN). The station obtains a transmission opportunity (TXOP) indicating a time duration used for transmission of a plurality of data units. The station transmits, during the TXOP, an initial data unit of the plurality of data units. The initial data unit comprises a control field indicating a transmit bandwidth of the initial data unit. The station selects a transmit bandwidth of a non-initial data unit of the plurality of data units to be narrower than the transmit bandwidth of the initial data unit. The station transmits, during the TXOP, the non-initial data unit. The non-initial data unit comprises a control field indicating the transmit bandwidth of the non-initial data unit.

Abstract: A portable device having a display, the display including a main surface area, a first curved surface area extending from a first side of the main surface area, and a second curved surface area extending from a second side of the main surface area that is opposite the first side, a sensor configured to detect a state of the portable device, and a controller configured to control the display to display a user interface (UI) on one of the first curved surface and the second curved surface based on the state detected by the sensor.

Abstract: A fan-out semiconductor package includes a semiconductor chip disposed in a through-hole of a first connection member having the through-hole and a second connection member disposed on an active surface of the semiconductor chip. A plurality of dummy vias surrounding the semiconductor chip are disposed in the first connection member.

Abstract: Disclosed is a method for operating a communication node supporting a low power mode in a wireless LAN. A method for operating a station, which includes a PCR and a WURx, comprises the steps of: allowing the WURx, which operates in a wake-up state, to receive a wake-up packet from an access point; transitioning an operating state of the PCR from a sleep state to the wake-up state when the wake-up packet is received; allowing the PCR, which operates in the wake-up state, to receive a data frame from an access point; and allowing the PCR to transmit, to the access point, a response to the data frame.

Abstract: A semiconductor package includes a core member having a cavity penetrating through first and second surfaces, a semiconductor chip disposed in the cavity and having an active surface having connection, a passive component module disposed in the cavity, including a plurality of passive components and a resin portion encapsulating the plurality of passive components, and having a mounting surface from which connection terminals of the passive components are exposed, a connection member on the second surface and including a redistribution layer connected to the connection pads of the semiconductor chip and connection terminals of some of the plurality of passive components, connection terminals of the others of the plurality of passive components not being connected to the redistribution layer.

Abstract: An apparatus and method for providing an artificial intelligence service during a phone call in an electronic device are provided. The electronic device includes a communication module, at least one sound output device, at least one microphone, at least one processor, and a memory. The at least one processor is configured to connect a call with another electronic device through the communication module. In response to receiving a voice command for an artificial intelligence service, the at least one processor is further configured to identify an output mode, based on at least one of information related with the artificial intelligence service or mutual relation information with the other electronic device. The at least one processor is also configured to output a response signal corresponding to the voice command, based on the output mode.

Abstract: An electronic component package includes first and second wiring parts including insulating layers, conductive patterns formed in the insulating layers, and conductive vias penetrating through the insulating layers, to be connected to the conductive patterns, respectively; a frame disposed between the first and second wiring parts and having conductive connection parts electrically connecting one or more through-holes with the first and second wiring parts and an electronic component disposed to be surrounded by the through-hole, to thereby be connected to the first wiring part, wherein the conductive patterns formed to be adjacent to the electronic component among the conductive patterns of the first wiring part are embedded in the insulating layer of the first wiring part.

Abstract: The present invention relates to a method and device for generating an engineering topology of a digital substation. The method may include: generating, by a single line diagram generation module, a single line diagram of the digital substation based on input information regarding a plurality of substation component devices and connection relations therebetween; converting, by a topology conversion module, the single line diagram of the digital substation into an engineering topology conforming to international standards by use of conversion conditions stored in a topology component management module; verifying, by a topology verification module, whether the engineering topology is suitable for the digital substation based on the international standards; and generating, by an international standard file generation module, a single line diagram engineering file of the digital substation as a system specification description (SSS) by use of the verified engineering topology.

Abstract: A fan-out sensor package includes: an image sensor chip including an integrated circuit (IC) for an image sensor having a first surface having first connection pads disposed thereon, a second surface opposing the first surface and having second connection pads disposed thereon, and through-silicon-vias (TSVs) penetrating between the first surface and the second surface and electrically connecting the first and second connection pads to each other and an optical portion disposed on the first surface of the IC for an image sensor and having a plurality of lens layers; an encapsulant covering at least portions of the second surface of the IC for an image sensor; a redistribution layer disposed on the encapsulant; and vias penetrating through at least portions of the encapsulant and electrically connecting the redistribution layer and the second connection pads to each other.

Abstract: An antenna module includes a connection member, an integrated circuit (IC), a dielectric layer, antenna members, feed vias, and a plating member. The connection member includes one or more wiring layer(s) and insulating layer(s). The IC is disposed on one surface of the connection member and is electrically connected to the wiring layer(s). The dielectric layer is disposed on another surface of the connection member. The antenna members are disposed in the dielectric layer, and the feed vias are disposed in the dielectric layer so that each has one end electrically connected to a corresponding antenna member and the other end electrically connected to a corresponding one of the wiring layer(s). The plating member is disposed in the dielectric layer to surround side surfaces of the feed vias. The dielectric layer has a dielectric constant Dk greater than that of at least one insulating layer.

Abstract: A source driver includes a digital-to-analog converter configured to receive a data signal, convert the received data signal into an analog signal, and output the analog signal, an output unit including amplifiers configured to amplify the analog signal, a control signal provision unit configured to output at least one control signal based on or in response to a first bias signal, at least one level shifter configured to shift a level of the control signal(s) based on or in response to a second bias signal having a higher voltage than the first bias signal and output at least one level-shifted control signal, and a protector configured to detect a voltage of the first bias signal and turn off the amplifiers and the level shifter when the detected voltage of the first bias signal is less than a predetermined reference voltage.

Abstract: An antenna module includes a connection member including at least one wiring layer and at least one insulating layer; an integrated circuit (IC) package disposed on a first surface of the connection member; and an antenna package including a plurality of antenna members and a plurality of feed vias, and disposed on a second surface of the connection member, wherein the IC package includes: an IC having an active surface electrically connected to at least one wiring layer and an inactive surface opposing the active surface, and generating the RF signal; a heat sink member disposed on the inactive surface of the IC; and an encapsulant encapsulating at least portions of the IC and the heat sink member.

Abstract: Semiconductor light emitting diodes (LEDs) formed as (Al)GaN-based nanowire structures have a first semiconductor layer, a second semiconductor layer, and a thin metallic layer fabricated therebetween. The structures, operating in the deep ultraviolet (UV) spectral range, exhibit high photoluminescence efficiency at room temperature. The structures may be formed of an epitaxial metal tunnel junction operating as a reflector that enhances carrier transport to and from the semiconductor alloy layers, capable of producing external quantum efficiencies at least one order of magnitude higher than convention devices.

Abstract: A fan-out semiconductor package includes a first connection member having a through-hole, a semiconductor chip disposed in the through-hole and including an active surface having connection pads disposed thereon and an inactive surface opposing the active surface, a second connection member disposed on the active surface of the semiconductor chip and including a redistribution layer electrically connected to the semiconductor chip, and an encapsulant encapsulating the semiconductor chip and having a cavity disposed above the inactive surface of the semiconductor chip.

Abstract: A method for determining an uplink (UL) channel quality by a base station (BS) includes obtaining a coverage class (CC) value of a user equipment (UE), receiving a random access (RA) signal from the UE, determining an UL channel quality of a band in which the RA signal is transmitted, based on the CC value and the RA signal, and generating UL resource allocation information based on the UL channel quality and transmitting the UL resource allocation information to the UE. The BS includes a transceiver configured to obtain a CC value of a UE and to receive a RA signal from the UE, and a controller configured to determine an UL channel quality of a band in which the RA signal is transmitted, based on the CC value and the RA signal. A UE includes determines a CC value of the UE based on a DL signal.