Abstract: A method for determining an uplink (UL) channel quality by a base station (BS) includes obtaining a coverage class (CC) value of a user equipment (UE), receiving a random access (RA) signal from the UE, determining an UL channel quality of a band in which the RA signal is transmitted, based on the CC value and the RA signal, and generating UL resource allocation information based on the UL channel quality and transmitting the UL resource allocation information to the UE. The BS includes a transceiver configured to obtain a CC value of a UE and to receive a RA signal from the UE, and a controller configured to determine an UL channel quality of a band in which the RA signal is transmitted, based on the CC value and the RA signal. A UE includes determines a CC value of the UE based on a DL signal.

Abstract: A method for operating a resource in a base station (BS) in a wireless communication system supporting multi-carrier is disclosed. The method includes acquiring reference information related to at least one resource block (RB) to be allocated to a user equipment (UE), determining a RB type to be used in the at least one RB based on the reference information, and transmitting, to the UE, information related to the RB type to be used in the at least one RB. The present disclosure relates to a communication method and system for converging a 5th-generation (5G) communication system for supporting higher data rates beyond a 4th-generation (4G) system with a technology for internet of things (IoT), which may be applied to intelligent services based on the 5G communication technology and the IoT-related technology.

Abstract: A semiconductor device includes an active pattern, a gate electrode, a gate capping pattern, and a gate spacer. The active pattern extends in a first direction parallel to a top surface of the substrate. The gate electrode extends in a second direction parallel to the top surface of the substrate and intersects the active pattern. The gate capping pattern covers a top surface of the gate electrode and extends in a direction crossing the top surface of the substrate to cover a first sidewall of the gate electrode. The gate spacer covers a second sidewall of the gate electrode. The first sidewall and the second sidewall are opposite to each other in the second direction.

Abstract: An electronic component package includes first and second wiring parts including insulating layers, conductive patterns formed in the insulating layers, and conductive vias penetrating through the insulating layers, to be connected to the conductive patterns, respectively; a frame disposed between the first and second wiring parts and having conductive connection parts electrically connecting one or more through-holes with the first and second wiring parts and an electronic component disposed to be surrounded by the through-hole, to thereby be connected to the first wiring part, wherein the conductive patterns formed to be adjacent to the electronic component among the conductive patterns of the first wiring part are embedded in the insulating layer of the first wiring part.

Abstract: A display device includes a scan line extending primarily in a first direction, disposed on a substrate, and transmitting a scan signal, a data line extending primarily in a second direction intersecting the first direction and transmitting a data signal, a driving voltage line extending primarily in the second direction and transmitting a driving voltage, a plurality of transistors including first and second transistors, wherein the second transistor is connected to the scan line and the data line, and the first transistor is connected to the second transistor, a light emitting element connected to the plurality of transistors, and a storage capacitor disposed between the substrate and an active pattern of the first transistor, the storage capacitor including a first electrode disposed on the substrate and a second electrode at least partially overlapping the first electrode. A first insulating layer is disposed between the first and second electrodes.

Abstract: A nanowire can include a first semiconductor portion, a second portion including a quantum structure disposed on the first portion, and a second semiconductor portion disposed on the second portion opposite the first portion. The quantum structure can include one or more quantum core structures and a quantum core shell disposed about the one or more quantum core structures. The one or more quantum core structures can include one or more quantum disks, quantum arch-shaped forms, quantum wells, quantum dots within quantum wells or combinations thereof.

Abstract: The clipping device includes a connecting portion which is moved while being connected to a wire of the endoscope and has a body broken when tension more than a set value is applied thereto, a body portion which includes a first inside path portion through which the connecting portion moves and has a magnetic force, a cap portion which is located on a side of the body portion, includes a second inside path portion connected to the first inside path portion, and guides movement of the connecting portion, a clipping portion which is connected to the connecting portion protruding through the cap portion and contracts due to movement of the connecting portion to grip body tissue, and a connector which connects the body portion to the cap portion and includes a material biodegradable in a human body.

Abstract: An aspect of the present specification relates to a fermented fruit product that has an outstanding taste and flavor with a content of Ca2+ ions in an amount of 100 ppm or higher on the basis of the total weight thereof. The scope of the invention includes a composition including the same and a method thereof. In a particular embodiment, the fruit comprises an apple. The fermented fruit product has an outstanding taste and flavor and exhibits an excellent effect of enhancing the absorption of calcium into the body or through the skin.

Abstract: An electronic apparatus, including an emissive display configured to provide a first image having a first image quality; a transparent display disposed on the emissive display and configured to provide a second image having a second image quality; and a controller configured to control the emissive display to provide the first image in according to first mode and control the transparent display to provide the second image according to a second mode.

Abstract: A method of receiving a packet in a wireless local area network system includes receiving, from an access point (AP), a packet comprising a data field and a first signal field including a first field, a second field, and a third field, wherein the packet is generated for a single receiving station or a plurality of receiving stations; and processing the packet based on the first signal field, wherein the first field indicates a group ID of the single receiving station or the plurality of receiving stations and whether the packet is generated based on a single user transmission scheme or a multi user transmission scheme, wherein, for the single user transmission scheme, at least one pre-determined value of the first field is used to indicate that the packet is generated based on the single user transmission scheme.

Abstract: The present invention relates to a ligand compound, a catalyst system for olefin oligomerization, and a method for oligomerizing olefins using the same. The ligand compound according to the present invention has a structure in which a substituent is substituted in the trans form, and thereby when used for olefin oligomerization, the activity of the catalyst used and the selectivity of 1-hexene and 1-octene can be increased.

Abstract: An antenna module includes a fan-out semiconductor package including an IC, an encapsulant encapsulating at least a portion of the IC, a core member having a first side surface facing the IC or the encapsulant, and a connection member including at least one wiring layer electrically connected to the IC and the core member and at least one insulating layer; and an antenna package including a plurality of first directional antenna members configured to transmit or receive a first RF signal. The fan-out semiconductor package further includes at least one second directional antenna member disposed on a second side surface of the core member opposing the first side surface of the core member, stood up from a position electrically connected to at least one wiring layer, and configured to transmit or receive a second RF signal.

Abstract: Provided are a nanostructure network and a method of fabricating the same. The nanostructure network includes nanostructures having a poly-crystalline structure formed by self-assembly of the nanostructures. The method includes preparing a nanostructure solution in which nanostructures are dispersed in a first solvent, forming a nanostructure ink by adding the nanostructure solution into a second solvent having a viscosity higher than that of the first solvent, coating a surface of a substrate with the nanostructure ink, and forming a nanostructure network by evaporating the first solvent and the second solvent included in the nanostructure ink coated on the substrate.

Abstract: The fan-out sensor package includes: a core member having a through-hole; an integrated circuit (IC) for a sensor disposed in the through-hole and having a first surface having a sensor region and first connection pads disposed thereon, a second surface opposing the first surface and having second connection pads disposed thereon, and through-silicon vias (TSVs) penetrating between the first and second surfaces and electrically connecting the first and second connection pads to each other; an encapsulant covering the core member and the second surface of the IC for a sensor and filling at least portions of the through-hole; a redistribution layer disposed on the encapsulant; and vias penetrating through at least portions of the encapsulant and electrically connecting the redistribution layer and the second connection pads to each other.

Abstract: A fan-out semiconductor package includes: a first connection member having a through-hole and having a passive component disposed in the first connection member; a semiconductor chip disposed in the through-hole of the first connection member and having an active surface having connection pads disposed therein and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the first connection member and the inactive surface of the semiconductor chip; and a second connection member disposed on the first connection member and the active surface of the semiconductor chip. The first connection member and the second connection member include, respectively, redistribution layers electrically connected to the connection pads of the semiconductor chip, and the passive component is electrically connected to the connection pads of the semiconductor chip through the redistribution layer of the second connection member.

Abstract: A fan-out semiconductor package module includes: a structure including a wiring member including wiring patterns, one or more first passive components disposed on the wiring member and electrically connected to the wiring pattern, and a first encapsulant encapsulating at least portions of each of the one or more first passive components, and having a first through-hole penetrating through the wiring member and the first encapsulant; a semiconductor chip disposed in the first through-hole of the structure and having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface; a second encapsulant encapsulating at least portions of the semiconductor chip and filling at least portions of the first through-hole; and a connection member disposed on the structure and the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pads and the wiring patterns.

Abstract: A vehicle motor control system and method. The vehicle motor control system includes a measurement unit configured to measure a motor speed of a vehicle and a pressure applied to an accelerator pedal, a determination unit configured to compare the measured motor speed with a predetermined reference speed to determine whether the vehicle is running at low or high speed and compare the pressure applied to the accelerator pedal with a predetermined reference pressure to determine whether the pressure applied to the accelerator pedal is greater than or equal to the predetermined reference pressure, and a control unit configured to control a change in the number of coil-winding turns by changing a connection mode between the motor and an inverter according to a result of the determination of the determination unit.

Abstract: The present disclosure generally relates to nanoparticles comprising a substantially hydrophobic acid, a basic therapeutic agent having a protonatable nitrogen, and a polymer. Other aspects include methods of making and using such nanoparticles.

Abstract: An electronic apparatus according to various embodiments of the present disclosure may comprise: a sensor unit for sensing the movement of the electronic apparatus; a communication unit for communicating with an external apparatus; an input unit for receiving a user input; an output unit for providing information to a user; and a control unit for outputting a message inducing a particular action to the user through the output unit on the basis of medical information of the user and the movement of the electronic apparatus, or controlling the communication unit to transmit information related to the electronic apparatus to an external apparatus.

Abstract: A composite antenna substrate and semiconductor package module includes: a fan-out semiconductor package including a semiconductor chip, an encapsulant encapsulating at least portions of the semiconductor chip, and a connection member including a redistribution layer electrically connected to connection pads; and an antenna substrate including an antenna member including antenna patterns, ground patterns, and feed lines, and a wiring member disposed below the antenna member and including wiring layers including feeding patterns electrically connected to the feed lines.