Abstract: A circuit board is provided including a core insulation film having a thickness and including a first surface and an opposite second surface, an upper stack structure and a lower stack structure. The upper stack structure has a thickness and has an upper conductive pattern having a thickness and an overlying upper insulation film stacked on the first surface of the core insulation film. The lower stack structure has a thickness and has a lower conductive pattern having a thickness and an overlying lower insulation film stacked on the second surface of the core insulation film. A ratio P of a sum of the thicknesses of the upper conductive pattern and the lower conductive pattern to a sum of the thicknesses of the core insulation film, the upper stack structure and the lower stack structure is in a range from about 0.05 to about 0.2.

Abstract: A method for preparing tetrazole methanesulfonic acid salts includes an acylation reaction using a novel 4-iodine-4H-chromene-2-carbothionic acid S-benzothiazole-2-yl ester. The method is advantageous that it can shorten a reaction time and improve safety as compared to conventional methods, and can prepare high-purity tetrazole methanesulfonic acid salts at a high yield rate without using a column chromatography method.

Abstract: A stacked package structure is provided. The stacked package structure includes a stacked package including a lower semiconductor package, an upper semiconductor package disposed on the lower semiconductor package and spaced a predetermined distance apart from the lower semiconductor package, an inter-package connecting portion electrically connecting the lower semiconductor package and the upper semiconductor package while supporting a space therebetween, and an insulation layer disposed at least outside the inter-package connecting portion and filling the space between the lower semiconductor package and the upper semiconductor package, and an electromagnetic shielding layer surrounding lateral and top surfaces of the stacked package.

Abstract: A hierarchical motion prediction apparatus and method. The hierarchical motion prediction method splits a current frame and a reference frame into pixel groups, changes a pixel location of each pixel group, and selects one pixel, and thus resolutions of the current frame and reference frame are reduced. A motion vector of a down-sampled current block is obtained based on a down-sampled current frame and reference frame, and is expanded to a motion vector of an original resolution based on a down sampling rate.

Abstract: A hybrid winding method for thermoplastic plastic-continuous fiber hybrid composite and a high pressure vessel using the same and a method for manufacturing the same is presented A hybrid winding method for thermoplastic plastic-continuous fiber hybrid composite in accordance with the present invention comprises mixing and supplying a thermoplastic plastic-carbon continuous fiber hybrid composite and a thermoplastic plastic-glass continuous fiber hybrid composite; applying tension to hybrid supplied hybrid composites; winding hybrid supplied hybrid composites along an outer circumference surface of a mandrel; and applying heat to hybrid wound hybrid composites

Abstract: An apparatus for manipulating surface near-field light resulting from light emitted from a light source that passes through a scattering layer is disclosed. Also, a method of finding a phase of incident light to cause constructive interference at a target spot using light scattering to manipulate the surface near-field.

Abstract: A continuous carbon fiber reinforced thermoplastic plastic composite having excellent impregnation properties and a method for manufacturing the same is provided. A continuous carbon fiber reinforced thermoplastic plastic composite in accordance with the present invention comprises a continuous carbon fiber impregnated in thermoplastic resin, and the continuous carbon fiber is a continuous carbon fiber has the width of 4 times to 8 times as wide as the initial fiber bundle.

Abstract: A three-dimensional semiconductor device comprises active patterns arranged two-dimensionally on a substrate, electrodes arranged three-dimensionally between the active patterns, and memory regions arranged three-dimensionally at intersecting points defined by the active patterns and the electrodes. Each of the active patterns is used as a common current path for an electrical connection to two different memory regions that are formed at the same height from the substrate.

Abstract: A semiconductor package includes a substrate, a semiconductor chip located on a top surface of the substrate, signal lines formed on the top surface of the substrate and configured to allow different types of signals to input/output thereto/therefrom, a ground line unit formed on the top surface of the substrate and configured to divide the signal lines into signal lines to/from which the same types of signals are input/output to be isolated from one another, barrier walls configured to contact the ground line unit, and a heat dissipation unit disposed on the semiconductor chip, wherein the ground line unit includes diagonal ground lines located in diagonal directions of the substrate about the semiconductor chip, and the heat dissipation unit includes a thermal interface material (TIM) located on a top surface of the semiconductor chip, and a heat dissipation plate configured to cover the TIM and the substrate.

Abstract: Provided is a rescue request signal processing device connected with a repeater and including a signal detector configured to detect identification information of a wireless communication terminal from an uplink signal outputted from the wireless communication terminal; a signal strength information generator configured to generate strength information of the uplink signal of the wireless communication terminal when the detected identification information of the wireless communication terminal is identical with identification information of a wireless communication terminal included in a request signal for location information transmitted from a location information requesting device; and a transmitter configured to transmit the strength information of the uplink signal and at least one of location information and identification information of the repeater to a location information server.

Abstract: A method and apparatus for operating an analog beam is provided. The apparatus includes a hybrid beam-forming structure having a small number of digital chains provided in a digital stage and a signal is transmitted and received in a Time Division Multiple Access (TDMA) scheme. The apparatus includes an analog beam-forming operating unit configured to change the analog beam for a counterpart device for which use of a next frame is to be permitted, upon receiving a request for using the next frame from at least one of multiple devices that transmit and receive signals in units of frames and a communication unit configured to transmit information indicating that the analog beam is changed to permit the use of the next frame by the counterpart device to the multiple devices.

Abstract: A fast 4D construction schedule simulation systems based on object behaviors according to the present invention may comprise an object library storage for storing object data, a behavior library storage for storing behaviors according to object types of the object data, an instance behavior value input section for inputting behavior values of an instance created from the object data to be modeled, a modeling section for modelling the instance using the object data, the behaviors and the behavior values and a display for displaying a behavior of the modeled instance.

Abstract: According to the present invention, a digital pre-distortion device and method for use in a dynamic spectrum allocation system, which uses a breadband frequency range, such as a cognitive radio (CR) system, are implemented. Also, while as conventional pre-distortion device only enable the linearization of a signal of a fundamental frequency band, the digital pre-distortion device and method according to the present invention enable not only the linearization of a basic signal on frequency fc, but also simultaneously enable the elimination of harmonic signals on the high frequencies of 2fc, 3fc, 4fc, etc. The digital pre-distortion device for a broadband power amplifier according to a preferred embodiment of the present invention comprises: a nonlinear power amplifier; an equivalent amplifier model estimator; N pre-distorters; and a coefficient extractor for extracting the coefficients of the N pre-distorters.

Abstract: A semiconductor device can include a first substrate and conductive patterns on the first substrate, where the conductive patterns are disposed in stacks vertically extending from the substrate. An active pillar can be on the first substrate vertically extend from the first substrate throughthe conductive patterns to provide vertical string transistors on the first substrate. A second substrate can be on the conductive patterns and the active pillar opposite the first substrate. A peripheral circuit transistor can be on the second substrate opposite the first substrate, where the peripheral circuit transistor can be adjacent to and overlap an uppermost pattern of the conductive patterns.

Abstract: A display apparatus including: a camera configured to photograph a first user of the display apparatus; a communication interface configured to communicate with an external apparatus of a second user; a display configured to display an image of a visual communication between the first user and the second user; and a controller configured to generate information regarding a change in a position of a face of the first user from an image of the first user photographed by the camera during the visual communication, and configured to transmit the information regarding the change in the position of the face of the first user to the external device so that the face of the first user having the changed position is displayed on the external apparatus.

Abstract: Disclosed is a battery pack case assembly for an electric or hybrid vehicle and a method for manufacturing the same. The battery pack case assembly includes a case body and a cover. The case body receives a battery pack, and the cover is coupled to the case body. The case body is formed of a plastic composite in which a long fiber or a blend of a long fiber and a continuous fiber is used as a reinforcing fiber in a plastic matrix. A separate reinforced member is bonded to both side bracket parts for coupling to a vehicle body, and is formed of a plastic composite in which a long fiber, a continuous, or a blend of a long fiber and a continuous fiber is used as the reinforcing fiber in the plastic matrix.

Abstract: The present invention relates to an adhesive composition, to an adhesive sheet, and to a touch panel. The present invention provides an adhesive composition, particularly an adhesive composition for a touch panel, which is prepared without using a low molecular weight polymer as an additive. The adhesive composition, the adhesive sheet, and the touch panel of the present invention exhibit superior heat resistance in a hardening process, a printed circuit board assembly process, or the like, and have superior physical properties such as optical characteristics, wettability, cuttability, workability, anti-curling properties, and durability.

Abstract: A liquid crystal display device and a method of driving the same are provided for one or more embodiments. The liquid crystal display device includes: a liquid crystal panel including a plurality of display blocks and displaying an image in response to image signals; a plurality of light-emitting blocks emitting light to the liquid crystal panel and corresponding to the plurality of display blocks; a first look-up table including a normalized value obtained by normalizing an initial duty ratio corresponding to the brightness of the image to a maximum duty ratio corresponding to the maximum brightness of the image; and a timing controller receiving the normalized value corresponding to each of the light-emitting blocks from the first look-up table and using the normalized value to provide an optical data signal corresponding to each of the light-emitting blocks.

Abstract: A semiconductor package stack, comprising: a lower semiconductor package including a lower semiconductor chip mounted on a lower package board; an upper semiconductor package stacked on the lower semiconductor package and including an upper semiconductor chip mounted on an upper package board, wherein the upper package board includes an opening configured to expose a lower surface of the upper semiconductor chip; and a first heat slug disposed within the opening, contacting the lower surface of the upper semiconductor chip, and contacting an upper surface of the lower semiconductor chip.

Abstract: There is disclosed a base station apparatus having a cloud radio access network (CRAN) structure. The base station apparatus includes a digital unit (DU) that includes a baseband processing unit for processing signals of a baseband, a Fast Fourier Transform (FFT) operation unit that converts baseband signals of a time domain into signals of a frequency domain, an Inverse FFT (IFFT) operation unit that converts signals of a frequency domain into signals of a time domain, and a radio unit (RU) that processes radio signals with respect to a terminal, and transmits and receives the processed signals, wherein the FFT operation unit and the IFFT operation unit are provided in the RU to reduce an amount of transmission and reception data between the DU and the RU.