Abstract: The present invention relates to a bumper back beam being equipped with a fiber composite reinforcing material with hollow section inside and a bumper having the same. The bumper back beam comprise a body formed with a synthetic resin, and a fiber composite reinforcing material with hollow section that is fastened inside the body, wherein the bumper back beam, as being built inside a bumper cover, reduces impact coming in from outside. A bumper back beam according to the present invention comprised as described above has high reliability, by having excellent ability to absorb impact energy because cracks almost do not occur during collision since it not only provides satisfactory strength and stiffness but also has high elongation with synthetic resin and fiber composite reinforcing materials generating synergies, and especially by having excellent impact resistance since fiber composite reinforcing materials take the shape of a hollow section.

Abstract: A multi-chip package may include a package substrate, an interposer chip, a first semiconductor chip, a thermal dissipation structure and a second semiconductor chip. The interposer chip may be mounted on the package substrate. The first semiconductor chip may be mounted on the interposer chip. The first semiconductor chip may have a size smaller than that of the interposer chip. The thermal dissipation structure may be arranged on the interposer chip to surround the first semiconductor chip. The thermal dissipation structure may transfer heat in the first semiconductor chip to the interposer chip. The second semiconductor chip may be mounted on the first semiconductor chip. Thus, the heat in the first semiconductor chip may be effectively transferred to the interposer chip through the thermal dissipation line.

Abstract: A method for enhancing a data communication throughput associated with an in-vehicle telematics system includes receiving a communication request from the in-vehicle telematics system to perform at least one of a data upload to the Internet and a data download from the Internet, and verifying availability of one or more mobile devices within the vehicle. The maximum capability of a mobile network interface for each of the one or more available mobile devices within the vehicle is determined. When the communication request is for uploading data to the Internet, the data is fragmented into data fragments and distributed to the available mobile devices, whereas when the communication request is for downloading data from the Internet, it is determined for each mobile device which fragment of data is to be downloaded and from which server, and the respective determined fragments are received from each mobile device.

Abstract: The present invention relates to an adhesive film for a touch panel, and to a touch panel. The adhesive film has superior heat resistance, optical characteristics, wettability, cuttability, anti-warpage characteristics and chemical resistance, and exhibits superior durability when applied to a touch panel.

Abstract: A semiconductor package includes a substrate, a semiconductor chip located on a top surface of the substrate, signal lines formed on the top surface of the substrate and configured to allow different types of signals to input/output thereto/therefrom, a ground line unit formed on the top surface of the substrate and configured to divide the signal lines into signal lines to/from which the same types of signals are input/output to be isolated from one another, barrier walls configured to contact the ground line unit, and a heat dissipation unit disposed on the semiconductor chip, wherein the ground line unit includes diagonal ground lines located in diagonal directions of the substrate about the semiconductor chip, and the heat dissipation unit includes a thermal interface material (TIM) located on a top surface of the semiconductor chip, and a heat dissipation plate configured to cover the TIM and the substrate.

Abstract: A method for performing communication in a multi-stage beam forming system includes determining statistical channel information which indicates a priority of analog beams transmitted by a base station, configuring an adaptive code book for digital beam forming, based on the statistical channel information and analog beams which the base station uses in actual communication among the analog beams, and performing communication with the base station through the digital beam forming based on the adaptive code book. A terminal includes a channel estimator configured to perform channel estimation for analog beams transmitted from a base station, a controller configure to determine statistical channel information indicating a priority of the analog beams, and configure an adaptive code book for digital beam forming based on the statistical channel information and analog beams that the base station uses in actual communication among the analog beams, and a communication unit.

Abstract: The present invention relates to a data management system and a data management method for data communications. The system and method can reduce load of a data control device, minimize costs for interworking and costs such as time and technologies needed for product commercialization, and enhance stability and extensibility of the product by adding a data management device between the data control device and a plurality of peripheral devices and controls the data control device to use a single unified standard protocol in order to control the plurality of peripheral devices.

Abstract: The present invention relates to a system and method of data management for controlling a plurality of peripheral devices. In an example embodiment, a data management device for managing data communications between a data control device and the plurality of peripheral devices is added between them, and the data management device controls the plurality of peripheral devices by grouping them according to their characteristics, whereby various protocols can be integrated into minimized optimal protocols by the grouping, and the data control device can reduce technical and temporal overheads due to detection and control of the plurality of peripheral devices.

Abstract: A semiconductor chip including a substrate, a first data pad arranged on the substrate, and a first control/address pad arranged on the substrate, wherein the first data pad is arranged in an edge region of the substrate, and the first control/address pad is arranged in a center region of the substrate.

Abstract: A stacked package structure is provided. The stacked package structure includes a stacked package including a lower semiconductor package, an upper semiconductor package disposed on the lower semiconductor package and spaced a predetermined distance apart from the lower semiconductor package, an inter-package connecting portion electrically connecting the lower semiconductor package and the upper semiconductor package while supporting a space therebetween, and an insulation layer disposed at least outside the inter-package connecting portion and filling the space between the lower semiconductor package and the upper semiconductor package, and an electromagnetic shielding layer surrounding lateral and top surfaces of the stacked package.

Abstract: The present invention relates to a glycosylated immunoglobulin or a fragment thereof, in which an immunoglobulin variant, comprising one or more amino acid modifications selected from the group consisting of M160N, A195N, T243N, E265N, Y299T, F331T and Q346N, is additionally glycosylated, and a gene encoding the same.

Abstract: An embedded chip-on-chip package includes a printed circuit board having a recessed semiconductor chip mounting unit constituted by a recess in the printed circuit board and a circuit pattern at the bottom of the recess, a first semiconductor chip embedded in the recessed semiconductor chip mounting unit and electrically connected to the circuit pattern at the bottom of the recess, and a second semiconductor chip mounted to the recessed semiconductor chip mounting unit and electrically connected to the first semiconductor chip and the printed circuit board independently of each other.

Abstract: There is disclosed a Long Term Evolution (LTE) cell detecting apparatus in a multi-cell environment that may efficiently detect an LTE cell even in a multi-cell environment where interference occurs between adjacent cells.

Abstract: A method of controlling an interpretation apparatus is provided. The control method includes collecting a voice of a speaker in a first language in order to generate voice data, extracting voice attribution information of the speaker from the generated voice data, and transmitting to an external apparatus text data in which the voice of the speaker included in the generated voice data is translated in a second language, together with the extracted voice attribute information. The text data translated in the second language is generated by recognizing the voice of the speaker included in the generated voice data, converting the recognized voice of the speaker into the text data, and translating the converted text data in the second language.

Abstract: A method of compressing In-phase/Quadrature (I/Q) data transmitted and received between a Digital Unit (DU) and a Radio Unit (RU) in a Cloud Radio Access Network (CRAN) structure is disclosed. The method includes (a) calculating a minimum value DiMSB among meaningless higher-order bit digits Di,jMSB with respect to each of j-th I/Q samples having a predetermined resolution among i-th unit blocks that are units of compression, and (b) transmitting each of the samples after each of the samples is converted into a binary number and DiMSB number of higher-order bits, excluding a sign bit, are removed.

Abstract: An automatic stamping apparatus includes a conveyor for conveying a stamping object, a stamper for stamping a pattern and two-dimensional bar code information on the stamping object, a reader for reading the pattern and the two-dimensional bar code information, and an information processor for determining a pattern and two-dimensional bar code information to be stamped on the stamping object, controlling the stamper based on the determined pattern and two-dimensional bar code information, receiving the stamped pattern and two-dimensional bar code information of the stamping object read by the reader, comparing the received stamped pattern and two-dimensional bar code information with a pattern and two-dimensional bar code information to be stamped on the stamping object, thus verifying the accuracy of the stamping.

Abstract: Disclosed is a battery pack case assembly for an electric or hybrid vehicle. The battery pack case assembly includes a case body and a cover. The case body receives a battery pack, and the cover is coupled to the case body. The case body is formed of a plastic composite in which a long fiber or a blend of a long fiber and a continuous fiber is used as a reinforcing fiber in a plastic matrix. A separate reinforced member is bonded to both side bracket parts for coupling to a vehicle body, and is formed of a plastic composite in which a long fiber, a continuous, or a blend of a long fiber and a continuous fiber is used as the reinforcing fiber in the plastic matrix.

Abstract: Disclosed is a sealing film for electronic paper having a multilayered structure. The multilayered film for electronic paper comprising a layered structure according to the present invention comprises: (a) a sealing layer formed with a material comprising a UV curable polymer resin composition or a UV transmitting polymer resin composition; and (b) a tack-free adhesive layer formed with a material comprising a UV curable polymer resin. The sealing film has excellent sealing properties and is tack-free at room temperature, and thus it is possible to minimize freezing of electrostatic particles inside a microcup sticking to the surface of a sealing material during manipulation thereof.

Abstract: A semiconductor memory device comprises a memory cell array comprising a plurality of memory cells, and a filling command determiner that receives a command signal and an address signal and determines whether the command signal corresponds to a filling command. Upon determining that the command signal corresponds to a filling command, the filling command determiner connects a first source voltage to a bitline and connects a second source voltage to a complementary bitline corresponding to the bitline. The bitline is connected to a selected memory cell corresponding to the address signal.

Abstract: It is provided a power supply device and a power acquisition device for an electromagnetic induction-powered electric vehicle that increase a power transfer efficiency by maximizing a lateral deviation tolerance and by minimizing a gap between the power acquisition device and the power supply device while preventing the power acquisition device from colliding with an obstacle present on a road and being damaged by the collision.