Abstract: A method for providing additional information by an electrical apparatus, the method including: extracting at least one keyword from input source data; detecting context information corresponding to a user to whom the additional information is to be provided; determining at least one keyword corresponding to an object of interest of the user from among the extracted at least one keyword based on the detected context information; acquiring additional information corresponding to the determined at least one keyword; and outputting the acquired additional information.

Abstract: Nonvolatile memory devices include a string of nonvolatile memory cells on a substrate. This string of nonvolatile memory cells includes a first vertical stack of nonvolatile memory cells on the substrate and a string selection transistor on the first vertical stack of nonvolatile memory cells. A second vertical stack of nonvolatile memory cells is also provided on the substrate and a ground selection transistor is provided on the second vertical stack of nonvolatile memory cells. This second vertical stack of nonvolatile memory cells is provided adjacent the first vertical stack of nonvolatile memory cells. A conjunction doped semiconductor region is provided in the substrate. This conjunction doped region electrically connects the first vertical stack of nonvolatile memory cells in series with the second vertical stack of nonvolatile memory cells so that these stacks can operate as a single NAND-type string of memory cells.

Abstract: A method for adjusting a beam pattern in a beam pattern adjusting apparatus in a communication system supporting a Beam Division Multiple Access (BDMA) scheme is provided. The method includes determining whether a Voltage Standing Wave Ratio (VSWR) value for each antenna included in an antenna array included in the beam pattern adjusting apparatus is greater than or equal to a threshold VSWR value, if it is determined that an antenna of the antenna array has a VSWR value that is greater than or equal to the threshold VSWR, detecting whether each of the antenna elements is operable, and if it is determined that at least one of the antennas is inoperable, adjusting a beam pattern of at least one of the antennas that is operable.

Abstract: A mobile communication terminal includes a display module to display image data on an image display area, an input module to generate touch data according to a touch input in a touch area, and a storage module to store the touch data associated with the image data. A data input method includes displaying image data on an image display area, generating touch data according to a touch input in a touch area, associating the touch data with the image data, and storing the touch data associated with the image data.

Abstract: Provided are a supply pipe and a pipe system that may simultaneously accumulate a plurality of thermal energies having different temperatures in a thermal energy network based on bilateral heat trade. The supply pipe is driven by an operation system, supplies a thermal energy to a user or a heat source, and includes an external pipe, at least two internal pipes that are disposed inside the external pipe and accumulate a thermal energy having a predetermined temperature, and a filler that fills the external pipe inside which the at least two internal pipes are disposed, wherein the at least two internal pipes have thermal energies having different temperatures.

Abstract: A semiconductor device is disclosed including a through electrode. The semiconductor device may include a first semiconductor chip including a transceiver circuit formed on a first surface, a first coupling conductive pattern which is formed on a second surface opposite the first surface, and a through electrode which connects the transceiver circuit and the first coupling conductive pattern. There may be a transceiver located on a second semiconductor chip and including a second coupling conductive pattern facing the first coupling conductive pattern which communicates wirelessly with the first coupling conductive pattern.

Abstract: A device packaging method and a device package using the same may be provided. The device packaging method includes forming a package sacrificial layer by applying a first material on a substrate on which a device has been formed; forming a package cap by applying a second material on the package sacrificial layer; generating gas molecules from the package sacrificial layer by applying external stimuli such as light or heat to the package sacrificial layer; and heating the gas molecule and forming a cavity between the device and the package cap.

Abstract: A beamforming method is provided. The beamforming method includes determining different beams for pieces of user equipment based on channel information fed back from the pieces of user equipment, predicting beam qualities of the pieces of user equipment for the beams, determining whether the beam qualities satisfy Quality of Service (QoS) for the pieces of user equipment, generating a wide nulling beam by applying wide nulling to a second beam having a side lobe acting as interference against one first beam, when the beam quality of the first beam does not satisfy the QoS; predicting beam qualities for the beams including the wide nulling beam instead of the second beam, and simultaneously communicating with the user equipment through the beams including the wide nulling beam instead of the second beam, when the beam qualities for the beams including the wide nulling beam instead of the second beam satisfy the QoS.

Abstract: Disclosed herein is a low-cost digital predistortion apparatus using envelope detection feedback. The low-cost digital predistortion apparatus includes a digital predistortion unit and an envelope detection feedback unit. The digital predistortion unit converts the output of a predistorter into analog signals, frequency-modulates the analog signals into a pass band signal, and amplifies the frequency-modulated signal via a power amplifier. The envelope detection feedback unit converts the difference between the input and output of the power amplifier of the digital predistortion unit and the output of the power amplifier into baseband signals, respectively, converts the baseband signals into digital signals, estimates the nonlinear distortion characteristic output of the power amplifier, calculates a predistortion parameter that is used to compensate for the estimated nonlinear distortion characteristic output of the power amplifier.

Abstract: A display apparatus with at least two light guide plates, each including a light incident surface and a light exiting surface, the light guide plates being spaced apart from each other so as to form a gap therebetween. The display apparatus also has a light source disposed adjacent to at least one side portion of the light guide plates to emit light to the light incident surface, a display panel positioned to receive light from the light exiting surfaces to facilitate display of an image, and a diffusion member. The diffusion member covers the gap, so as to diffuse light directed toward the display panel.

Abstract: A display device includes a display panel configured to display an image corresponding to image data input thereto and be divided into a plurality of display blocks, a backlight unit configured to supply light to the display panel and including a light guide panel and a main light source module which supplies light to the light guide panel, and a luminance boosting unit configured to supply boosted light to the plurality of display blocks based on the image data and including a plurality of light source modules arranged to correspond to the plurality of display blocks, respectively.

Abstract: Disclosed is a duplex calorimeter which may measure a duplex calorific value using one device in a thermal energy network based on a duplex heat transaction.

Abstract: Disclosed is a sealing film for electronic paper having a multilayered structure. The multilayered film for electronic paper comprising a layered structure according to the present invention comprises: (a) a sealing layer formed with a material comprising a UV curable polymer resin composition or a UV transmitting polymer resin composition; and (b) a tack-free adhesive layer formed with a material comprising a UV curable polymer resin. The sealing film has excellent sealing properties and is tack-free at room temperature, and thus it is possible to minimize freezing of electrostatic particles inside a microcup sticking to the surface of a sealing material during manipulation thereof.

Abstract: A semiconductor package stack may include a lower semiconductor package and an upper semiconductor package stacked on a lower package board. The upper semiconductor package may include an upper semiconductor chip mounted on an upper package board with an opening configured to expose a lower surface of the upper semiconductor chip and a first heat slug disposed within the opening, contacting the lower surface of the upper semiconductor chip, and contacting an upper surface of a lower semiconductor chip.

Abstract: Long Term Evolution (LTE) cell detecting apparatus includes a secondary synchronization signal (SSS) reference signal generating unit for generating reference signals of all SSSs included in a specific subframe, a memory for storing a reference phase difference sequence with respect to the reference signal of the SSS generated, a Fast Fourier Transform (FFT) operation unit for performing an FFT operation with respect to a received radio signal to output a primary synchronization signal (PSS) and an SSS, a time synchronization acquisition unit for acquiring LTE time synchronization by the PSS output from the FFT operation unit, and a cell detection unit for detecting an LTE cell by the time synchronization information acquired by the time synchronization acquisition unit and a correlation between a phase difference sequence of a received SSS output from the FFT operation unit and the reference phase difference sequence stored in the memory.

Abstract: In a vertical-type memory device and a method of manufacturing the vertical-type memory device, the vertical memory device includes an insulation layer pattern of a linear shape provided on a substrate, pillar-shaped single-crystalline semiconductor patterns provided on both sidewalls of the insulation layer pattern and transistors provided on a sidewall of each of the single-crystalline semiconductor patterns. The transistors are arranged in a vertical direction of the single-crystalline semiconductor pattern, and thus the memory device may be highly integrated.

Abstract: Disclosed is a device for recognizing a dot pattern, including: a dot pattern recognizing unit configured to recognize a first dot pattern and a second dot pattern on a recording medium, on which a dot pattern is formed; a location information extracting unit configured to extract first location information from the first dot pattern, and extract second location information from the second dot pattern; a communication unit configured to transmit the first location information and the second location information to the content executing device; and a controller configured to control the dot pattern recognizing unit, the location information extracting unit, and the communication unit, in which the first dot pattern is a dot pattern recognized when the device is spaced apart from the recording medium, and the second dot pattern is a dot pattern recognized when the device is in contact with the recording medium.

Abstract: A semiconductor package having a structure in which a decoupling capacitor is disposed to be adjacent with a semiconductor chip using a vertical chip interconnection (VCI) to improve power integrity. The semiconductor package includes a semiconductor substrate including a first finger pad and a second finger pad, a semiconductor chip mounted on the semiconductor substrate and including a first chip pad and a second chip pad, a bonding tape electrically connecting the first finger pad and the first chip pad, and a bonding wire electrically connecting the second finger pad and the second chip pad. Here, the bonding tape is formed to make contact with a sidewall of the semiconductor chip in a vertical direction of the semiconductor chip.

Abstract: A organic light emitting diode display including an organic light emitting display panel displaying an image, and a lower passivation film attached to a bottom of the organic light emitting panel and including a polymer resin and an antistatic agent, wherein the lower passivation film includes a plurality of stress adjustment patterns disposed to be adjacent to each other wherein decreasing the bending interval between the bending stress adjustment patterns formed at the lower passivation film processed with the antistatic agent and attached at the position corresponding to the bending portion of the organic light emitting panel, thereby selectively minimizes the stress of the bending portion of the organic light emitting panel, therefore, asymmetry of strains of the bending portions of the organic light emitting display panel can be prevented to remove a picture abnormality, and static electricity may be prevented.

Abstract: An approach is provided for a light source module and a display device including the same. The light source module includes two first light source packages configured to emit light of a first color, one or more second light source packages disposed between the two first light source packages, and a plurality of third light source packages disposed between the two first light source packages and alternately arranged with the one or more second light source packages. The one or more second light source packages are configured to emit light of the first color and the plurality of third light source packages are configured to emit light of a second color. An intensity of light emitted from each of the one or more second light source packages is approximately twice an intensity of light emitted from each of the two first light source packages.