Abstract: Provided are a novel polyamide polymer obtained by polymerizing monomers including aromatic diamine substituted with a nitrile group and an amide group and an aromatic dibasic acid compound, a spinning dope comprising the same, and a polyamide molded article. A fiber obtained using the novel polyamide polymer according to the present invention, particularly, a fiber obtained by spinning the polymer according to the present invention may have high strength and high elasticity, such that the fiber may be applied to various industrial fields.

Abstract: There is provided a wearable pointing device comprising: a body; and a finger-mounted portion coupled to the body, wherein the body comprises: a coordinate input interface configured to sense a touch and movement of a second finger thereon to generate a cursor movement signal; a first button interface disposed on the first face of the body and adjacent to the coordinate input interface, wherein the first button interface is configured to generate a pop-up signal in a response to a pressure input thereto by the second finger; and a scroll input interface disposed on the first face of the body and adjacent to the coordinate input interface, wherein the scroll input interface is configured to generate a screen scrolling signal in a response to a pressure input thereto by the second finger.

Abstract: A semiconductor package having a structure in which a decoupling capacitor is disposed to be adjacent with a semiconductor chip using a vertical chip interconnection (VCI) to improve power integrity. The semiconductor package includes a semiconductor substrate including a first finger pad and a second finger pad, a semiconductor chip mounted on the semiconductor substrate and including a first chip pad and a second chip pad, a bonding tape electrically connecting the first finger pad and the first chip pad, and a bonding wire electrically connecting the second finger pad and the second chip pad. Here, the bonding tape is formed to make contact with a sidewall of the semiconductor chip in a vertical direction of the semiconductor chip.

Abstract: The present disclosure provides an engine structure for a vehicle. The engine structure includes: an intake port, a port plate provided in the single flow path of the intake port, and an injector. The port plate is longitudinally parallel to the flow path of the intake port so as to divide the flow path of the intake port into upper and lower flow paths, and the port plate includes an extension portion formed on part of a downstream end of the port plate such that the extension portion of the downstream end of the port plate extends longer than other portion of the downstream end of the port plate. In particular, the injector is provided in the intake port, and sprays fuel beyond the extension portion so as to inhibit the fuel from adhering to the port plate.

Abstract: A diaphragm valve for a vehicle includes: a diaphragm chamber having an upper chamber and a lower chamber divided by a diaphragm and communicating with a valve inlet and a valve outlet. The upper chamber has a nipple in which a fluid flows or from which a fluid is discharged, and the lower chamber has a chamber opening port at a lower end thereof. A valve rod is coupled to the diaphragm and extends toward the valve outlet. A valve head is provided at a position corresponding to an end W of the valve rod and has a wider cross sectional area than the valve rod. The valve head closes the valve outlet when the valve is closed, and closes the chamber opening port when the valve is open.

Abstract: A beamforming method is provided. The beamforming method includes determining different beams for pieces of user equipment based on channel information fed back from the pieces of user equipment, predicting beam qualities of the pieces of user equipment for the beams, determining whether the beam qualities satisfy Quality of Service (QoS) for the pieces of user equipment, generating a wide nulling beam by applying wide nulling to a second beam having a side lobe acting as interference against one first beam, when the beam quality of the first beam does not satisfy the QoS; predicting beam qualities for the beams including the wide nulling beam instead of the second beam, and simultaneously communicating with the user equipment through the beams including the wide nulling beam instead of the second beam, when the beam qualities for the beams including the wide nulling beam instead of the second beam satisfy the QoS.

Abstract: A semiconductor device including a common delay circuit configured to delay an input signal in response to a delay control code to output a first delayed input signal and a second delayed input signal; a first delay circuit configured to delay the first delayed input signal in response to the delay control code and to output a first output signal; and a second delay circuit configured to delay the second delayed input signal in response to the delay control code and to output a second output signal.

Abstract: A housing type golf simulation apparatus and features the housing that the internal space is available having front, rear, upper and left/right side; monitor installation section which is provided backward in the rear side direction from the said front housing so that the monitor can be seated in the said front housing; golf simulation computer which is provided in the said internal space; and the monitor to be seated in the said monitor installation section. Thus, it is advantageous to implement various additional functions in the housing while installing, managing and moving the entire golf simulation apparatus in an integrated module.

Abstract: Semiconductor packages, module substrates and semiconductor package modules having the same are provided. The semiconductor package module includes a module substrate provided with a plurality of signal wires on an upper surface thereof, a package substrate disposed on the module substrate, a semiconductor chip disposed on one surface of the package substrate, and a plurality of external connection terminals disposed on another surface of the package substrate.

Abstract: The present invention discloses a method for improving solar energy conversion efficiency using metal oxide photocatalysts having an energy band of core-shell structure for ultraviolet (UV) ray and visible light absorption, comprising a first process of forming a nanoparticle thin film layer; a second process of preparing a core-shell metal oxide on metal oxide nanoparticles by a plasma reaction under a hydrogen and nitrogen gas atmosphere, and a third process of depositing a transition metal on surfaces of core-shell metal oxide nanoparticles to produce a photocatalyst for energy conversion. A great amount of oxygen vacancies is formed in a shell region by the core-shell metal oxide to achieve effects of improving transfer ability of electron-hole pairs excited by light, and extending a wavelength range of absorbable light to a visible light region by changing a band-gap structure.

Abstract: A photomask including monitoring marks is disclosed. In one aspect, the photomask includes a transparent substrate, a mask pattern formed on an upper surface of the transparent substrate, and a monitoring mark having a line width pattern shared with the mask pattern. The monitoring mark is configured to receive a laser beam so as to measure a power state of the laser beam.

Abstract: Disclosed is a method for improving solar energy conversion efficiency of a metal oxide semiconductor photocatalyst, which includes rapidly performing hydrogenation and nitrogenation of a metal oxide semiconductor material through an H2/N2 mixed gas plasma treatment in a single process at room temperature, so as to enhance photocatalytic energy conversion efficiency. Specifically, disclosed is a treatment technique in which a plasma ball formed by controlling a mixing ratio of hydrogen gas to nitrogen gas in a range of 1:1 to 1:3 contacts with a surface of a metal oxide material, such that a great amount of oxygen vacancy and nitrogen elements are introduced in the surface of the metal oxide material to improve electron-hole pairs transfer ability thereof and decrease a size of the band-gap. A catalyst including the metal oxide material directly converts the solar energy into a compound by photocatalytic hydrogen generation and CO2 conversion.

Abstract: Provided is a semiconductor package including a semiconductor chip having one surface on which chip pads are formed, and a redistribution structure formed on the one surface of the semiconductor chip. The redistribution structure includes a redistribution layer connected to the chip pads and a redistribution insulating layer interposed between the semiconductor chip and the redistribution layer. The redistribution insulating layer includes a first insulating portion having a first dielectric constant and a second insulating portion having a second dielectric constant that is different from the first dielectric constant. The first insulating portion and the second insulating portion are connected to each other in a horizontal direction.

Abstract: A stacked package structure is provided. The stacked package structure includes a stacked package including a lower semiconductor package, an upper semiconductor package disposed on the lower semiconductor package and spaced a predetermined distance apart from the lower semiconductor package, an inter-package connecting portion electrically connecting the lower semiconductor package and the upper semiconductor package while supporting a space therebetween, and an insulation layer disposed at least outside the inter-package connecting portion and filling the space between the lower semiconductor package and the upper semiconductor package, and an electromagnetic shielding layer surrounding lateral and top surfaces of the stacked package.

Abstract: A semiconductor device, a semiconductor package, and an electronic device are provided. The electronic device includes a first semiconductor package disposed on a circuit substrate. A second semiconductor package is provided on the circuit substrate and spaced apart from the first semiconductor package. An insulating electromagnetic shielding structure is provided on the top and the lateral surfaces of the first semiconductor package. A conductive electromagnetic shielding structure is provided on the circuit substrate to cover the first and second semiconductor packages and the insulating electromagnetic shielding structure.

Abstract: An apparatus circulates a coolant in a turbocharger, which includes a first coolant line for supplying the coolant to the turbocharger from a water pump and configured to form a first flow resistance member to increase flow resistance to the coolant flowing through the first coolant line.

Abstract: A semiconductor chip including a substrate, a first data pad arranged on the substrate, and a first control/address pad arranged on the substrate, wherein the first data pad is arranged in an edge region of the substrate, and the first control/address pad is arranged in a center region of the substrate.

Abstract: Provided is a semiconductor package including a semiconductor chip having one surface on which chip pads are formed, and a redistribution structure formed on the one surface of the semiconductor chip. The redistribution structure includes a redistribution layer connected to the chip pads and a redistribution insulating layer interposed between the semiconductor chip and the redistribution layer. The redistribution insulating layer includes a first insulating portion having a first dielectric constant and a second insulating portion having a second dielectric constant that is different from the first dielectric constant. The first insulating portion and the second insulating portion are connected to each other in a horizontal direction.

Abstract: A method for adjusting a beam pattern in a beam pattern adjusting apparatus in a communication system supporting a Beam Division Multiple Access (BDMA) scheme is provided. The method includes determining whether a Voltage Standing Wave Ratio (VSWR) value for each antenna included in an antenna array included in the beam pattern adjusting apparatus is greater than or equal to a threshold VSWR value, if it is determined that an antenna of the antenna array has a VSWR value that is greater than or equal to the threshold VSWR, detecting whether each of the antenna elements is operable, and if it is determined that at least one of the antennas is inoperable, adjusting a beam pattern of at least one of the antennas that is operable.

Abstract: A method for receiving a signal by using M multiple beams in a multi-antenna system including N antenna elements, is provided in and embodiment of the present application. The method includes setting, by M beams, a beam direction for the M beams and a modulation frequency for frequency modulation of a beam response and generating the M beams according to the beam direction and the modulation frequency set by the beams. M beam responses are generated for a receiving signal by using the generated M beams and the generated M beam responses are frequency modulated by using the modulation frequency set by the beams. The frequency-modulated M beam responses are band-pass filtered so as to separate the M beam responses and the separated M beam responses are respectively demodulated.