Abstract: A display apparatus and a user interface display method of the display apparatus are provided. The display apparatus classifies menu items of a service menu or an OSD menu according to the frequency of use of the menu items, generates icons corresponding to the classified menu items, and displays the icons on a screen using a user interface. Accordingly, the user can display a user interface on the screen in a preferable manner, and easily find and utilize a desired menu item.

Abstract: A text entry method and a display apparatus applying the same are provided. In the text entry method, one emoticon is selected from an emoticon set, and a text string corresponding to the selected emoticon is then entered. Therefore, it is possible for a user to enter text more conveniently.

Abstract: A broadcast receiver and a method for processing a digital caption using the same. A broadcast receiver receives a broadcast signal containing digital caption information, searches for an explanation of terminology to be explained if terminology in the digital caption information is included in a list of terminology to be explained, and displays the explanation found for the terminology to be explained on a screen.

Abstract: A stack type semiconductor chip package includes a first wafer mold, a protection substrate, and a second wafer mold that are stacked in a wafer level process. The first wafer mold includes a first chip having first pads and a first mold layer encapsulating the first chip. The protection substrate is placed on the first wafer mold, is mechanically bonded with the first wafer mold using a first adhesive layer, and includes wiring layers facing the first pads. The second wafer mold is placed under the first wafer mold, is mechanically bonded with the first wafer mold using a second adhesive layer, and includes a second chip having second pads, and a second mold layer encapsulating the second chip. First vias electrically connect the wiring layers of the protection substrate with the second pads. Second vias electrically connect the wiring layers of the protection substrate with external connection terminals.

Abstract: An on-screen-display (OSD) item displaying method and a display apparatus applying the OSD item displaying method. In the method an OSD menu containing a plurality of OSD items is displayed on an OSD menu display area, and when an event occurs, an event OSD item associated with the event may be displayed using the OSD menu display area and a content display area. Therefore, the display apparatus can selectively display the OSD menu on the content display area, which enables a user to more easily recognize important information.

Abstract: A method for providing widgets and a TV using the same are disclosed. The method for providing widgets includes searching for widgets related to a certain keyword or a broadcast program among widgets provided by a plurality of content providers, and displaying the searched widgets on a widget search list classified according to content provider. A user can thereby search for and use the widgets provided from various content providers more easily.

Abstract: There are provided a video processing apparatus, a video processing system, and an information providing method in the video processing apparatus. The video processing apparatus includes: a communication part performing communication with a service providing server providing broadcasting services; a video processing part performing video processing with respect to the broadcasting services; an output part outputting information on the broadcasting services; and a controller controlling the communication part, the output part and the video processing part to transmit user information and viewing information with respect to the video processing apparatus to the service providing server, to receive recommendation information based on the user information and the viewing information from the service providing server, and to output the received recommendation information, respectively.

Abstract: A stack type semiconductor chip package includes a first wafer mold, a protection substrate, and a second wafer mold that are stacked in a wafer level process. The first wafer mold includes a first chip having first pads and a first mold layer encapsulating the first chip. The protection substrate is placed on the first wafer mold, is mechanically bonded with the first wafer mold using a first adhesive layer, and includes wiring layers facing the first pads. The second wafer mold is placed under the first wafer mold, is mechanically bonded with the first wafer mold using a second adhesive layer, and includes a second chip having second pads, and a second mold layer encapsulating the second chip. First vias electrically connect the wiring layers of the protection substrate with the second pads. Second vias electrically connect the wiring layers of the protection substrate with external connection terminals.

Abstract: Provided are an image processing apparatus and an image processing method thereof. The image processing apparatus includes: an information reader which collects information related to a search word; and a controller which selects a favorite broadcast depending on a viewing pattern and provides the information reader with the search word corresponding to the favorite broadcast.

Abstract: A camera module, a method of manufacturing the same, and an electronic system having the same are provided. The camera module includes an image sensor chip having an active plane and a backside, a ground wiring extending from a sidewall of the image sensor chip to the backside, a lens structure having a light detector with at least one lens stacked on the active plane, and a conductive housing extending to the ground wiring along with an outer wall of the lens structure excluding the light detector.

Abstract: A method for configuring a video apparatus, and a video apparatus and a server are provided. The video apparatus transmits video apparatus information and content information to an external server, receives setting information corresponding to the video apparatus information and content information from the external server, and thereby configures the video apparatus. Therefore, it is possible for a user to configure the video apparatus to be more optimally suited to the video apparatus and content to be played back.

Abstract: One embodiment exemplarily described herein can be characterized as an image sensor including a substrate having a front surface and a rear surface; a photoelectric converting portion on the front surface of the substrate; a through via extending through the substrate, wherein the through via is electrically connected to the photoelectric converting portion; an external connection terminal on the rear surface of the substrate, wherein the external connection terminal is connected to the through via; and a light shading layer formed on a portion of the rear surface of the substrate, wherein the light shading layer is substantially opaque with respect to an external light. In some embodiments, the portion of the rear surface of the substrate on which the light shading layer is formed is not overlapped by the through via or the external connection terminal.

Abstract: A wafer-level-chip-scale package and related method of fabrication are disclosed. The wafer-level-chip-scale package comprises a semiconductor substrate comprising an integrated circuit, a conductive ball disposed on the semiconductor substrate and electrically connected to the integrated circuit, and a protective portion formed from an insulating material and disposed on bottom and side surfaces of the semiconductor substrate.

Abstract: Example embodiments of the present invention relate to an alloy solder and a semiconductor device using the alloy solder. Other example embodiments relate to an alloy solder capable of increasing reliability of a junction between a semiconductor chip and a substrate. According to still In still other example embodiments of the present invention, there may be a tin-bismuth (Sn—Bi) family alloy solder between a semiconductor chip and a substrate, and a semiconductor device using the alloy solder. The semiconductor device may include a semiconductor chip formed with a plurality of gold bumps, a substrate having metal wirings connected to the gold bumps, and a junction including a tin-bismuth family alloy solder interposed between and connecting the gold bump and the metal wiring.

Abstract: A display apparatus which has a display unit, the display apparatus includes: a communication unit which receives contents from an external server; a UI (user interface) generator which generates UI information; and a controller which controls the UI generator to display the UI information about setting an initial screen of the contents supplied by the external server on the display unit if the display apparatus is connected to the external server.

Abstract: Provided are camera modules capable of effectively shielding electromagnetic (EM) waves and methods of fabricating the same. A method of fabricating a camera module includes, preparing a first wafer including an array of lens units. Then, a second wafer including an array of image sensor CSPs (chip-scale packages) is prepared. Each of the image sensor CSPs includes an image sensor chip corresponding to one of the lens units. The first wafer is stacked on the second wafer. The first wafer and the second wafer are cut to form a trench exposing the top surface of the image sensor chip at the interface between adjacent lens units. The trench is filled with a first material used for forming a housing. The first material and the image sensor chip are cut at the interface between the adjacent lens units.

Abstract: A camera module includes an image sensor chip, a lens structure, a transparent substrate, an adhesive portion, and a light blocking layer. The image sensor chip includes a light receiving area and a circuit area. The lens structure is positioned on the image sensor chip and configured to allow light to enter the image sensor chip. The transparent substrate is positioned between the image sensor chip and the lens structure, the transparent substrate allowing light from the lens structure to enter the light receiving area. The adhesive portion attaches the image sensor chip and the transparent substrate, and covers the circuit area. The light blocking layer is attached to the transparent substrate to block light from entering the circuit area.

Abstract: A method of manufacturing a semiconductor device includes forming a diffusion barrier layer on a substrate, and forming at least two features on the substrate such that the diffusion barrier layer is respectively disposed between each feature and the substrate and contacts the at least two features. A first impurity region of the substrate contains impurities of a first type, a second impurity region of the substrate contains impurities of a second type, different from the first type, a first feature of the at least two features is in the first impurity region, and a second feature of the at least two features is in the second impurity region, such that the second feature is electrically isolated from first feature by the different impurity regions.

Abstract: An image sensor package, a method of manufacturing the same, and an image sensor module including the image sensor package are provided. In the image sensor package, an image sensor chip is installed onto a depression of a transmissive substrate. An adhesive bonds the image sensor chip to the transmissive substrate and seals an Active Pixel Sensor (APS) on the image sensor chip, protecting it from fine particle contamination. An IR cutting film is disposed on the transmissive substrate to minimize the height of the image sensor package. The image sensor package is electrically connected to external connection pads in the depression. Consequently, the image sensor package has a minimum height, is not susceptible to particle contamination, and does not require expensive alignment processes during manufacturing.

Abstract: A wafer-level-chip-scale package and related method of fabrication are disclosed. The wafer-level-chip-scale package comprises a semiconductor substrate comprising an integrated circuit, a conductive ball disposed on the semiconductor substrate and electrically connected to the integrated circuit, and a protective portion formed from an insulating material and disposed on bottom and side surfaces of the semiconductor substrate.