Abstract: A broadcast receiving apparatus which displays broadcast program listing information is disclosed. The broadcast receiving apparatus includes an EPG processor which configures an EPG screen displaying broadcast programs listing information as a plurality of icons, and a display unit which displays the EPG screen configured by the EPG processor. Accordingly, a user can select desired broadcast program quickly and easily.

Abstract: A stack type semiconductor chip package includes a first wafer mold, a protection substrate, and a second wafer mold that are stacked in a wafer level process. The first wafer mold includes a first chip having first pads and a first mold layer encapsulating the first chip. The protection substrate is placed on the first wafer mold, is mechanically bonded with the first wafer mold using a first adhesive layer, and includes wiring layers facing the first pads. The second wafer mold is placed under the first wafer mold, is mechanically bonded with the first wafer mold using a second adhesive layer, and includes a second chip having second pads, and a second mold layer encapsulating the second chip. First vias electrically connect the wiring layers of the protection substrate with the second pads. Second vias electrically connect the wiring layers of the protection substrate with external connection terminals.

Abstract: A broadcast receiving apparatus and a broadcast receiving method in which specific broadcast channels are distinguished, displayed and automatically tuned are provided. The broadcast receiving apparatus includes a broadcast receiver which tunes to a broadcast channel, a display information generator which generates display information to be displayed on one field of a display, and a controller which controls the display information generator to generate a list, in which specific broadcast channels are displayed differently from other broadcast channels among tunable broadcast channels and shown as display information, and controls the broadcast receiver to automatically tune to the specific broadcast channels from among the tunable broadcast channels.

Abstract: Provided is a double waveguide electroabsorption modulator, in which two spot size converters are integrated between first and second optical waveguides, thereby reducing an insertion loss between an optical fiber and an optical modulator while favorably operating even in high input optical power. Therefore, the electroabsorption modulator can stably operate in higher input optical power while reducing an optical coupling loss and an optical confinement factor (OCF).

Abstract: In one aspect, a bump electrode of a semiconductor device is formed by providing a substrate including a pad electrode, forming a seed layer over the pad electrode, and forming a mask layer over the seed layer which includes an opening aligned over the pad electrode. A barrier plating layer is electroplated within the opening over the seed layer, and a bump plating layer is electroplated over the barrier plating layer. The mask layer is removed, and the seed layer is etched using the bump plating layer as a mask.

Abstract: A semiconductor package includes a semiconductor chip operatively attached to a conductive lead of a film circuit substrate by an indium-containing solder material and a silver-containing bump electrode, where the solder material is interposed between the conductive lead and the bump electrode.

Abstract: The image sensor package includes: an image sensor chip including an image sensing unit which is positioned in an upper central portion thereof and including a plurality of chip bonding pads formed around the image sensing; a transparent board including a lower surface on which a first line electrically connected to the chip bonding pads is formed and the transparent board being arranged with the image sensor chip so that the lower surface faces the image sensing unit; and a plurality of second lines connected to the first line and extending along sidewalls of the image sensor chip to be exposed under a lower surface of the image sensor chip.

Abstract: Provided are an enhanced structure of a coplanar waveguide that is a kind of transmission line used for optical communication for radio frequency (RF), and an optical communication module employing the same. While having a basic structure including a conductive strip and ground strips at both sides of the conductive strip on a dielectric substrate, the coplanar waveguide has the structure in which metal patterns of a portion of the conductive strip located around points where an RF propagation direction is changed and of a portion of an inside ground strip are removed to make electrical lengths of an outside ground strip and the inside ground strip similar each other. Using the coplanar waveguide, it is possible to fabricate an optical module that has an optimized RF characteristic and also can freely change an RF propagation direction of several tens GHz, without an additional process.

Abstract: A method for manufacturing a tape wiring board in accordance with the present invention may employ an imprinting process in forming a wiring pattern thereby reducing the number of processes for manufacturing a tape wiring board and allowing the manufacturing process to proceed in a single production line. Therefore, the manufacturing time and cost may be reduced. A profile of the wiring pattern may be determined by the shape of an impression pattern of a mold. This may establish the top width of inner and outer leads and incorporate fine pad pitch. Although ILB and OLB process may use an NCP, connection reliability may be established due to the soft and elastic wiring pattern.

Abstract: Provided is a semiconductor optical modulator device in which a resistor for impedance matching is integrated in a device in order to improve performance and to reduce cost during the fabrication of an ultra high speed optical modulator module. A doped layer in an epitaxial layer of the optical modulator device is used as a resistor for impedance matching. According to this method, it is possible to more easily realize an optical device compared with optical device fabrication processes in which additional resistors are used in the outside and the inside of the device for impedance matching.

Abstract: An image sensor package may include a transparent substrate, an image sensor chip having a sensing region disposed over the transparent substrate, a resin protection dam disposed between the image sensor chip and the transparent substrate inside a wiring pattern, the resin protection dam having an aperture formed to expose a sensing region of the image sensor chip and defining a cavity between the sensing region and the transparent substrate, a resin filled on the transparent substrate outside the resin protection dam, and a black matrix pattern disposed on each side of the transparent substrate and configured to block excess transmission of light.

Abstract: A method for manufacturing a tape wiring board in accordance with the present invention may employ an imprinting process in forming a wiring pattern, thereby reducing the number of processes for manufacturing a tape wiring board and allowing the manufacturing process to proceed in a single production line. Therefore, the manufacturing time and cost may be reduced. A profile of the wiring pattern may be determined by the shape of an impression pattern of a mold. This may establish the top width of inner and outer leads and incorporate fine pad pitch. Although ILB and OLB process may use an NCP, connection reliability may be established due to the soft and elastic wiring pattern.

Abstract: A method and an apparatus for providing a user interface which implements screen conversion by channel change in a three-dimensional view, are provided. The method includes receiving a signal for converting a screen into a screen of a first channel, calculating the relationship according to a channel order between the first channel and a second channel that is currently being broadcasted, outputting a portion of broadcasting images of the first channel to a region where broadcasting images of the second channel are output, according to the calculated result, and outputting all the broadcasting images of the first channel.

Abstract: Example embodiments of the present invention relate to an alloy solder and a semiconductor device using the alloy solder. Other example embodiments relate to an alloy solder capable of increasing reliability of a junction between a semiconductor chip and a substrate. According to still other example embodiments of the present invention, there may be a tin-bismuth (Sn—Bi) family alloy solder between a semiconductor chip and a substrate, and a semiconductor device using the alloy solder. The semiconductor device may include a semiconductor chip formed with a plurality of gold (Au) bumps, a substrate having metal wirings connected to the gold (Au) bumps, and a junction including a tin-bismuth (Sn—Bi) family alloy solder interposed between and connecting the gold (Au) bump and the metal wiring.

Abstract: A display apparatus and a search method are provided. The display apparatus includes a user selection unit which adjusts a search speed and a search function for searching contents information; a signal processor unit which processes a signal to be displayed on a display unit; and a controller which controls the signal processor unit such that when the search function is selected, at least one of the contents information is displayed in a region of the display unit, and the number of contents information is adjusted based on the search speed. The method includes receiving a selection signal for selecting a search function for searching a plurality of contents information; adjusting a search speed of the contents information; displaying at least one of the contents information; and adjusting a number of the displayed contents information based on the search speed when the search function is selected.

Abstract: A circuit film having film bumps is provided for a film package. An IC chip is mechanically joined and electrically coupled to the circuit film through the film bumps instead of conventional chip bumps. In a fabrication method, a base film is partially etched by a laser to create an etched area that defines raised portion relatively raised from the etched area. Then a circuit pattern is selectively formed on the base film, partly running over the raised portions. The raised portion and the overlying circuit pattern constitute the film bumps having a height not greater than the height of the circuit film.

Abstract: An apparatus and method for providing a three-dimensional graphic user interface includes a control module which creates a three-dimensional interface space having a predetermined plane and an axis perpendicular to the plane, and a plurality of objects presented in the space, and a user interface module which presents a plurality of object groups including the plurality of objects in the space, and moves an object group including a selected object among the plurality of presented object groups along the axis.

Abstract: A circuit film having film bumps is provided for a film package. An IC chip is mechanically joined and electrically coupled to the circuit film through the film bumps instead of conventional chip bumps. In a fabrication method, a base film is partially etched by a laser to create an etched area that defines raised portion relatively raised from the etched area. Then a circuit pattern is selectively formed on the base film, partly running over the raised portions. The raised portion and the overlying circuit pattern constitute the film bumps having a height not greater than the height of the circuit film.

Abstract: A wafer-level-chip-scale package and related method of fabrication are disclosed. The wafer-level-chip-scale package comprises a semiconductor substrate comprising an integrated circuit, a conductive ball disposed on the semiconductor substrate and electrically connected to the integrated circuit, and a protective portion formed from an insulating material and disposed on bottom and side surfaces of the semiconductor substrate.

Abstract: Provided are a semiconductor package having a semiconductor chip, a rear surface of which is molded, and a method of fabricating the semiconductor package. The semiconductor package includes a semiconductor chip including a wafer and a metal pad formed on a front surface of the wafer; a solder ball formed on a front surface of the wafer, and electrically connected to the metal pad; and a reinforcing member formed on a rear surface of the wafer. The reinforcing member is formed of an epoxy molding compound, and the reinforcing member protrudes at least 5 ?m from side surfaces of the semiconductor chip.