Abstract: A semiconductor device comprises a magneto-resistive device capable of performing multiple functions with low power. The semiconductor device comprises a cell transistor in which a first impurity region and a second impurity region are respectively arranged on both sides of a channel region in a channel direction, a source line connected to the first impurity region of the cell transistor, and the magneto-resistive device connected to the second impurity region of the cell transistor. The first impurity region and the second impurity region are asymmetrical about a center of the cell transistor in the channel direction with respect to at least one of a shape and an impurity concentration distribution.

Abstract: A resistive memory apparatus includes a memory cell array having a plurality of memory cells and a first ground switch. The plurality of memory cells are arranged in a plurality of rows and a plurality of columns, and each memory cell in a first column of the plurality of memory cells is connected between a first bitline and a first source line. The first ground switch is connected in parallel with the first source line, and the first ground switch is configured to selectively provide a first current path from the first bitline to ground through a selected memory cell in the first column of the plurality of memory cells and the first source line, the current path traversing only a portion of the first source line.

Abstract: A magnetic random-access memory (MRAM) device and a semiconductor package include a magnetic shielding layer that may suppress at least one of magnetic orientation errors and deterioration of magnetic tunnel junction (MTJ) structures due to external magnetic fields. A semiconductor device includes: a MRAM chip including a MRAM; and a magnetic shielding layer including an upper shielding layer and a via shielding layer. The upper shielding layer is on a top surface of the MRAM chip, and the via shielding layer extends from the upper shielding layer and passes through the MRAM chip.

Abstract: A resistive memory device includes a memory cell array that includes a plurality of memory layers stacked in a vertical direction. Each of the plurality of memory layers includes a plurality of memory cells disposed in regions where a plurality of first lines and a plurality of second lines cross each other. A bad region management unit defines as a bad region a first memory layer including a bad cell from among the plurality of memory cells and at least one second memory layer.

Abstract: A memory device includes a memory cell array having multiple memory cells arranged respectively in regions where first signal lines cross second signal lines. The memory device further includes a decoder having multiple line selection switch units connected respectively to the of first signal lines. Each of the multiple line selection switch units applies a bias voltage to a first signal line corresponding to each of the multiple line selection switch units in response selectively to a first switching signal and a second switching signal, voltage levels of which are different from each other in activated states.

Abstract: In operating a resistive memory device including a number of memory cells, a write pulse is applied to each of the plurality of memory cells such that each of the memory cells has a target resistance state between a first reference resistance and a second reference resistance higher than the first reference resistance. The resistance of each of the memory cells is read by applying a verify pulse to each of the plurality of memory cells. A verify write current pulse is applied to each of the memory cells that has resistance higher than the second reference resistance, and a verify write voltage pulse is applied to each of the memory cells that has resistance lower than the first reference resistance.

Abstract: Provided are a resistive memory device and a method of the resistive memory device. The method of operating the resistive memory device includes performing a pre-read operation on memory cells in response to a write command; performing an erase operation on one or more first memory cells on which a reset write operation is to be performed, determined based on a result of comparing pre-read data from the pre-read operation with write data; and performing set-direction programming on at least some memory cells from among the erased one or more first memory cells and on one or more second memory cells on which a set write operation is to be performed.

Abstract: A method of operating a memory device, which includes of memory cells respectively arranged in regions where first signal lines and second lines cross each other, includes determining a plurality of pulses so that each of the plurality of pulses that are sequentially applied to a selected memory cell among the plurality of memory cells is changed according to a number of times of executing programming loops. In response to the change of the plurality of pulses, at least one of a first inhibit voltage and a second inhibit voltage is determined so that a voltage level of at least one of the first and second inhibit voltages that are respectively applied to unselected first and second signal lines connected to unselected memory cells among the plurality of memory cells is changed according to the number of times of executing the programming loops.

Abstract: A method for operating a memory device includes sensing a temperature of the resistive memory device, setting a level of a set voltage or current for writing to a memory cell based on the temperature, setting a level of a reset voltage for reset writing to the memory cell based on the temperature, and performing a write operation on the memory cell based on the level of the set voltage or current and the level of the reset voltage. The memory device may be a resistive memory device.

Abstract: A resistive memory device includes a memory cell array that has a plurality of resistive memory cells that are arranged respectively on regions where a plurality of first signal lines and a plurality of second signal lines cross each other. A write circuit is connected to a selected first signal line that is connected to a selected memory cell from among the plurality of memory cells, and provides pulses to the selected memory cell. A voltage detector detects a node voltage at a connection node between the selected first signal line and the write circuit. A voltage generation circuit generates a first inhibit voltage and a second inhibit voltage that are applied respectively to unselected first and second signal lines connected to unselected memory cells from among the plurality of memory cells, and changes a voltage level of the second inhibit voltage based on the node voltage that is detected.

Abstract: A memory device and a method of operating the memory device are provided for performing a read-retry operation. The method of operating the memory device includes starting a read-retry mode, reading data of multiple cell regions using different read conditions, and setting a final read condition for the cell regions according to results of data determination operations on data read from the cell regions.

Abstract: A method of operating a resistive memory device including a plurality of memory cells comprises determining whether to perform a refresh operation on memory cells in a memory cell array; determining a resistance state of each of at least some of the memory cells; and performing a re-writing operation on a first memory cell having a resistance state from among a plurality of resistance states that is equal to or less than a critical resistance level.

Abstract: Methods of operating a memory device include; applying a first set write voltage to a selected first signal line connected to a selected memory cell, applying a first inhibition voltage to non-selected first signal lines connected to non-selected memory cells, and controlling a first voltage of a selected second signal line connected to the selected memory cell to be less than the first set write voltage, and a difference between the first inhibition voltage and the first voltage is less than a threshold voltage of the selection element.

Abstract: A resistive memory device includes a memory cell array that has a plurality of resistive memory cells that are arranged respectively on regions where a plurality of first signal lines and a plurality of second signal lines cross each other. A write circuit is connected to a selected first signal line that is connected to a selected memory cell from among the plurality of memory cells, and provides pulses to the selected memory cell. A voltage detector detects a node voltage at a connection node between the selected first signal line and the write circuit. A voltage generation circuit generates a first inhibit voltage and a second inhibit voltage that are applied respectively to unselected first and second signal lines connected to unselected memory cells from among the plurality of memory cells, and changes a voltage level of the second inhibit voltage based on the node voltage that is detected.

Abstract: A method of operating a memory device includes determining a value of an operating current flowing through a selected first signal line, to which a selection voltage is applied, from among a plurality of first signal lines; dividing an array of memory cells into n blocks, n being an integer greater than 1, based on the value of the operating current; and applying inhibit voltages having different voltage levels corresponding to the n blocks to unselected ones of second signal lines included in the n blocks. Each of the unselected second signal lines is a pathway through which leakage current may potentially flow due to the operating current flowing through the selected first signal line and a memory cell addressed by the unselected second signal line and the selected first signal line.

Abstract: A memory device includes a memory cell array having multiple memory cells arranged respectively in regions where first signal lines cross second signal lines. The memory device further includes a decoder having multiple line selection switch units connected respectively to the of first signal lines. Each of the multiple line selection switch units applies a bias voltage to a first signal line corresponding to each of the multiple line selection switch units in response selectively to a first switching signal and a second switching signal, voltage levels of which are different from each other in activated states.

Abstract: A semiconductor device comprises a magneto-resistive device capable of performing multiple functions with low power. The semiconductor device comprises a cell transistor in which a first impurity region and a second impurity region are respectively arranged on both sides of a channel region in a channel direction, a source line connected to the first impurity region of the cell transistor, and the magneto-resistive device connected to the second impurity region of the cell transistor. The first impurity region and the second impurity region are asymmetrical about a center of the cell transistor in the channel direction with respect to at least one of a shape and an impurity concentration distribution.

Abstract: A magnetic memory device includes first and second magnetic memory cells coupled to first and second bit lines, respectively. The first and second magnetic memory cells respectively include a pinned magnetic layer, a free magnetic layer, and a tunnel insulating layer therebetween. Respective stacking orders of the pinned magnetic layer, the tunnel insulating layer, and the free magnetic layer are different in the first and second magnetic memory cells. The magnetic memory device further includes at least one transistor that is configured to couple the first and second magnetic memory cells to a common source line. Related methods of operation are also discussed.

Abstract: A magnetic memory device includes word lines, bit lines intersecting the word lines, magnetic memory elements disposed at intersections between the word lines and the bit lines, and selection transistors connected to the word lines. The magnetic memory elements share a word line among the plurality of word lines and also share a selection transistor connected to the word line that is shared among the selection transistors. Related systems and operating methods are also described.

Abstract: A method for operating a memory device includes sensing a change in temperature of the memory device, adjusting a level of a reference current for a read operation, and reading data from memory cells of the memory device based on the adjusted level of the reference current. The level of the reference current is adjusted from a reference value to a first value when the temperature of the memory device increases and is adjusted from the reference value to a second value when the temperature of the memory device decreases. A difference between the reference value and the first value is different from a difference the reference value and the second value.