Abstract: A digital-imaging based code symbol reading system which automatically detects hand-induced vibration when the user attempts to read one or more 1D and/or 2D code symbols on an object, and controls system operation in order to reduce motion blur in digital images captured by the hand-supportable system, whether operated in a snap-shot or video image capture mode. An accelerometer sensor is used to automatically detect hand/system acceleration in a vector space during system operation. In a first embodiment, digital image capture is initiated when the user manually depresses a trigger switch, and decode processed only when the measured acceleration of the hand-supportable housing is below predetermined acceleration threshold levels. In another embodiment, digital image capture is initiated when an object is automatically detected in the field of view of the system, and decode processed only when the measured acceleration of the hand-supportable housing is below predetermined acceleration threshold levels.

Abstract: A multi-stage laser beam despeckling device including a first laser beam despeckling module for optically multiplexing an input laser beam into a temporal/spatial coherence-reduced output laser beam; and a second laser beam despeckling module, optically coupled to the first laser beam despeckling module, for receiving the temporal/spatial coherence-reduced as an input laser beam to the second despeckling module and producing a further temporal/spatial coherence-reduced output laser beam.

Abstract: A method and apparatus are described including receiving buffer maps of neighbor peers, measuring serving rates from the neighbor peers, measuring serving rates to the neighbor peers, requesting a unit of data from one of the neighbor peers responsive to information in the buffer maps of the neighbor peers at a rate responsive to the serving rate from the one of the neighbor peers, receiving incoming requests for units of data, sorting the incoming requests into a plurality of queues, selecting one of the incoming requests to serve responsive to the serving rates to the neighbor peers corresponding to the incoming request, updating the queues and selecting a new neighbor peer.

Abstract: Disclosed are molded ultra-thin semiconductor die packages, systems that incorporate such packages, and methods of making such packages. An exemplary package comprises a leadframe having an aperture formed between the leadframe's first and second surfaces, and a plurality of leads disposed adjacent to the aperture. The package further comprises a semiconductor disposed in the aperture of the leadframe with its top surface substantially flush with the leadframe's first surface, and at least one gap between at least one side surface of the semiconductor die and at least one lead of the leadframe. A body of electrically insulating material is disposed in the at least one gap. A plurality of conductive members interconnect leads of the leadframe with conductive regions on the die's top surface, with at least one conductive member having a portion disposed over at least a portion of the body of insulating material.

Abstract: The invention relates to illumination, especially to a grid for illumination apparatus. This invention provides a grid (100) for attenuating electromagnetic radiation from a light source. The grid comprises a plurality of baffles (110), each baffle being electro conductive, wherein the plurality of baffles are configured to form a plurality of cells (120), each cell being formed as a waveguide so as to attenuate the electromagnetic radiation from the light source. In this way, the electromagnetic radiation from the light source can be reduced or prevented so as to decrease the danger to users.

Abstract: A buck converter module includes a high side (HS) die having source, drain, and gate bonding pads on a front side of the HS die, a low side (LS) die having a first section thereof with a plurality of through silicon vias (TSVs) extending from a back side to a front side of the LS die, the LS die having source, drain, and gate bonding pads located on a front side of a second section separate from the first section, the drain bonding pad electrically connected to the back side of the LS die in the second section. The HS die and the LS die are bonded together such that the source bonding pad of the HS die is electrically connected to the back side of the LS die, and each of the drain and gate bonding pads are electrically connected to separate TSVs in the LS die.

Abstract: A process of operating a computer system to create a subcircuit model of an N/P configurable extended drain MOS transistor in which the subcircuit model includes an npn bipolar transistor and a pnp bipolar transistor which correspond to current paths through n-channel drift lanes and p-channel drift lanes during dual mode operation. A process of operating a computer system to simulate the behavior of an electronic circuit including a N/P configurable extended drain MOS transistor in which a subcircuit model of the N/P configurable extended drain MOS transistor includes an npn bipolar transistor and a pnp bipolar transistor which correspond to current paths through n-channel drift lanes and p-channel drift lanes during dual mode operation. A computer readable medium storing an electronic circuit simulation program that generates a simulation output of the behavior of an electronic circuit including a N/P configurable extended drain MOS transistor.

Abstract: A multiple-chip package has top and bottom pre-molded leadframes formed prior to the flip-chip attachment of semiconductor die to the leadframes. After die attachment, underfill is used to encase all but one surface of the die, and the top and bottom leadframes are joined together by solder bump balls with the exposed surfaces of the semiconductor dice proximate to each other.

Abstract: This document discusses, among other things, apparatus and methods for an IC package including first and a second discrete components fabricated into a semiconductor substrate. The first and second discrete components can be adjacent to one another in the semiconductor substrate, and an integrated circuit die can be mounted on the semiconductor substrate and coupled to the first and second discrete components.

Abstract: In a method of determining an available channel bandwidth in a communication system, wherein the communication system utilizes i) a set of component channels for transmitting data streams and ii) a set of access control channels, and wherein each of at least some of the access control channels partially overlaps, in frequency, at least one of the component channels, whether a primary channel of the access control channels is idle is determined. The primary channel partially overlaps, in frequency, at least a first one of the component channels. That a composite channel includes one or more of the component channels is determined based at least on a determination of whether the primary channel is idle. A signal is caused to be transmitted via the composite channel after determining that the composite channel includes one or more of the component channels.

Abstract: In a method of determining a set of communication channels for a first basic service set from at least i) a first set of channels and ii) a second set of channels, wherein each of at least some of the channels in the second set of channels partially overlaps, in frequency, at least one of the channels in the first set of channels, whether the second set of channels is being utilized by a second basic service set is determined. That the set of communication channels for the first basic service set includes either i) the first set of channels or ii) the second set of channels is determined based at least on a determination of whether the second set of channels is being utilized by the second basic service set.

Abstract: The Multi-Link Aircraft Cellular System makes use of multiple physically separated antennas mounted on the aircraft, as well as the use of additional optional signal isolation and optimization techniques to improve the call handling capacity of the Air-To-Ground cellular communications network. These additional techniques can include polarization domain and ground antenna pattern shaping (in azimuth, in elevation, or in both planes). Further, if code domain separation is added, dramatic increases in capacity are realized. Thus, the Air-To-Ground cellular communications network can increase its capacity on a per aircraft basis by sharing its traffic load among more than one cell or sector and by making use of multiple physically separated antennas mounted on the aircraft, as well as the use of additional optional signal isolation and optimization techniques.

Abstract: An electromagnetic interference (EMI) and/or electromagnetic radiation shield is formed by forming a conductive layer (34, 46) over an encapsulant (32). The conductive layer includes a combination of a conductive glue (38, 48, 52) and a metal paint (36, 50). A wire loop (30) is coupled to the conductive layer and a leadframe (10).

Abstract: A molded, leadless packaged semiconductor multichip module includes 100 has four mosfets 10, 12, 14, 16 for a full bridge circuit. The mosfets may include two N-channel and two P-channel devices or four mosfets of the same type, but four N-channel are preferred. In module 100 there are two leadframes 30, 40 for assembling the mosfets. In particular, the two N-channel and two P-channel devices are disposed between two leadframes and encapsulated in an electrically insulating molding compound 84. The resulting package has four upper heat sinks 44.1-44.4 that are exposed in the molding compound 84 for transferring heat from the mosfets to the ambient environment. No wire bonds are required. This can significantly reduce the on resistance, RDSON. The top or source-drain lead frame 30 may be soldered to the sources and gates of the bridge mosfets.

Abstract: A ventilator including an inspiration flow control unit and an expiration flow control unit coupled to the inspiration flow control unit. The ventilator also includes a nasal intermittent mandatory ventilation (NIMV) control system coupled to the inspiration flow control unit and the expiration flow control unit. The NIMV control system is configured to automatically and simultaneously adjust an inspiration flow and an expiration flow. A pressure of the inspiration flow is increased from a baseline pressure to a control pressure. A pressure of the expiration flow is returned to the baseline pressure.

Abstract: Systems and techniques relating to wireless communications are described.

Abstract: Systems and techniques relating to wireless communications are described. A described technique includes monitoring a group of wireless channels that are useable by at least a first wireless communication device for wireless communications, receiving one or more beacon signals from one or more second wireless communication devices, identifying, within the group of wireless channels, one or more primary channels on which the one or more beacon signals are received, estimating a traffic load for the one or more identified primary channels, determining, based on the estimated traffic load, whether to use as a primary channel for the first wireless communication device, a channel of the one or more identified primary channels or a channel of the group of wireless channels that is separate from the one or more identified primary channels; and selecting the primary channel for the first wireless communication device based on a result of the determining.

Abstract: In a method for link adaptation in a network, a link quality metric corresponding to a wireless communications link between a first communication device and a second communication device is determined. A communication frame having a header is generated. The header includes i) a first subfield of a control field to specify a modulation and coding scheme for use via the wireless communications link, and ii) a second subfield of the control field that includes the link quality metric. The communication frame is transmitted.

Abstract: A molded leadless package (MLP) semiconductor device includes a heat spreader with a single connecting projection extending from an edge of a cap of the heat spreader to a leadframe. The heat spreader can include additional projections on its edges that act as heat collectors and help to secure the spreader in the MLP. The connecting projection is attached to a lead of the leadframe so that heat gathered by the cap can be transferred through the connecting projection to the lead and to a printed circuit board to which the lead is connected. In embodiments, the heat spreader includes a central heat collector projection from the cap toward the die, preferably in the form of a solid cylinder, that enhances heat collection and transfer to the cap. The cap can include fins projecting from its top surface to facilitate radiant and convection cooling.

Abstract: A semiconductor package assembly including a molded leadless package (MLP) having an exposed top emitter pad and an exposed bottom source pad. A folded heat sink is attached to the exposed top emitter pad of the MLP by a soft solder attach process. The folded heat sink has a planar member generally coextensive in size with the MLP and in electrical and thermal contact with the top emitter pad of the MLP, and also has one or more leads extending generally perpendicularly to the planar member in a direction towards the lower surface of the MLP. These heat sink leads may provide the emitter connection to a printed circuit (PC) board.