Patents by Inventor Yong Liu

Yong Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • View-upload decoupled peer-to-peer video distribution systems and methods
    Patent number: 7970932
    Abstract: View-upload decoupled (“VUD”) peer-to-peer (P2P) video distribution is provided, in which each peer is assigned to one or more channels to upload, with the assignments made independent of what the peer is viewing. For each assigned channel, the peer distributes (that is, uploads) the channel. This effectively creates semi-permanent distribution swarms for each channel, which are formed by peers responsible for uploading that channel. This can minimize problems associated with channel churn because peers may remain in their assigned distribution groups even if they switch channels. To minimize cross-channel overhead associated with VUD P2P video distribution, substream swarming, in which a peer in a distribution swarm only downloads a small portion of the video stream, called a substream, and uploads the substream to multiple viewers, may be provided.
    Type: Grant
    Filed: December 16, 2008
    Date of Patent: June 28, 2011
    Assignee: Polytechnic Institute of New York University
    Inventors: Yong Liu, Keith W. Ross
  • STATION-TO-STATION SECURITY ASSOCIATIONS IN PERSONAL BASIC SERVICE SETS
    Publication number: 20110154039
    Abstract: A personal basic service set (PBSS) includes a first device configured to communicate in the PBSS and a second device configured to communicate in the PBSS. The first device is configured to establish a robust security network association (RSNA) with the second device (i) without associating with a PBSS control point (PCP) and (ii) without associating with the second device.
    Type: Application
    Filed: December 13, 2010
    Publication date: June 23, 2011
    Inventors: Yong Liu, Paul A. Lambert
  • SEMICONDUCTOR DIE PACKAGE INCLUDING IC DRIVER AND BRIDGE
    Publication number: 20110140255
    Abstract: A semiconductor die package. Embodiments of the semiconductor die package are usable in backlight circuitry. Systems in packages may include a bridge circuit or a part thereof, and a integrated circuit die, such as a driver die, encapsulated by a molding material or other package. The bridge circuit may be stacked on opposing surfaces of a leadframe.
    Type: Application
    Filed: February 24, 2011
    Publication date: June 16, 2011
    Inventors: Yong Liu, Jiangyuan Zhang, Qiuxiao Qian
  • TESTING CIRCUIT BOARD
    Publication number: 20110140974
    Abstract: An exemplary testing circuit board is used for testing an antenna performance and includes a signal circuit layer, a base layer electrically connected to the signal circuit layer, and a test unit. The signal circuit layer can transmit test signals from the antenna. The base layer is fixed with the signal circuit layer and used as a ground section to shield the test signals. The test unit is electrically connected to the signal circuit layer and the base layer and includes a signal inception port. The signal inception port is positioned on the signal circuit layer and protrudes from the base layer, and the signal inception port is capable of receiving the test signals and transmitting the test signals to the signal circuit layer.
    Type: Application
    Filed: April 7, 2010
    Publication date: June 16, 2011
    Applicants: SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD., FIH (HONG KONG) LIMITED
    Inventors: YING YANG, YAN-FENG YANG, LING-YU HUANG, LONG-YONG LIU, GUO-MIN LUO
  • Apparatus and method for setting multi-path
    Patent number: 7961710
    Abstract: A method and apparatus is provided for setting multiple paths between wireless nodes of an ad-hoc network including a source node, a relay node and a destination node that receives a message from the source node via the relay node. The multi-path setting method and apparatus includes receiving previous hop address information, and determining whether a wireless node that receives the previous hop address information is included in an insulating region, based on the previous hop address information.
    Type: Grant
    Filed: February 13, 2007
    Date of Patent: June 14, 2011
    Assignees: Samsung Electronics Co., Ltd., The Research Foundation of the City University of New York
    Inventors: Ji-Hoon Lee, Xuhui Hu, Yong Liu, Myung-Jong Lee
  • Frame Padding For Wireless Communications
    Publication number: 20110134900
    Abstract: Systems and techniques relating to wireless communications are described. A described technique includes obtaining data for a transmission to a wireless communication device(s), including one or more medium access control (MAC) data units that encapsulate data in a physical (PHY) frame, determining a length of a MAC layer pad based on a number of symbols associated with the PHY frame, including, in response to the length of the MAC layer pad being greater than zero, the MAC layer pad in the PHY frame after the one or more MAC data units, determining a length of a PHY layer pad based on remaining available bits in the PHY frame, including, in response to the length of the PHY layer pad being greater than zero, the PHY layer pad in the frame after the MAC layer pad, and transmitting the PHY frame to the wireless communication device(s).
    Type: Application
    Filed: December 9, 2010
    Publication date: June 9, 2011
    Inventors: Yong Liu, Harish Ramamurthy, Ken Kinwah Ho, Raja Banerjea, Hongyuan Zhang
  • Wireless Communication Signaling for Aggregate Data Units
    Publication number: 20110134816
    Abstract: Systems and techniques relating to wireless communications are described. A described technique includes obtaining data for a transmission to a wireless communication device. The wireless communication device can be configured to process incoming transmissions based on an aggregate data unit format that specifies signaling for aggregating multiple medium access control (MAC) data units. The technique includes, in a physical (PHY) frame, an aggregate data unit that is based on the data and the aggregate data unit format, the aggregate data unit including a single MAC data unit. The technique includes, in the PHY frame, an indication to signal that the MAC data unit in the aggregate data unit is singular and to cause the wireless communication device to accept the aggregate data unit without a corresponding block acknowledgement agreement.
    Type: Application
    Filed: December 9, 2010
    Publication date: June 9, 2011
    Inventors: Yong Liu, Harish Ramamurthy, Ken Kinwah Ho, Raja Banerjea, Hongyuan Zhang
  • Tunnel-type digital imaging-based self-checkout system for use in retail point-of-sale environments
    Patent number: 7954719
    Abstract: A tunnel-type digital imaging-based self-checkout system capable of generating and projecting coplanar illumination and imaging planes into a 3D imaging volume within a tunnel structure. The tunnel structure is supported above a package conveyor in a retail POS environment, and employs automatic package identification, profiling and tracking techniques during self-checkout operations.
    Type: Grant
    Filed: September 12, 2007
    Date of Patent: June 7, 2011
    Assignee: Metrologic Instruments, Inc.
    Inventors: Xiaoxun Zhu, Anatoly Kotlarsky, Tao Xian, Timothy Good, Jie Ren, Yong Liu, Konstantin Yakovlev, John Gardner, Steven Essinger, Patrick Giordano, Sean Kearney, Xi Tao, JiBin Liu, Ming Zhuo, Duane Ellis, C. Harry Knowles
  • Method and Apparatus for Sounding Multiple Stations
    Publication number: 20110128929
    Abstract: One or more stations to provide sounding feedback in response to a training signal sequence are determined, and a schedule for the one or more stations to provide sounding feedback is determined based on capabilities of the one or more stations to transmit sounding feedback at a defined time period after an end of the training signal sequence. A communication frame is generated that includes i) an indication of a request for the plurality of stations to provide sounding feedback corresponding to the training signal sequence, and ii) an indication of when the one or more stations are to transmit sounding feedback. The communication frame is transmitted along with the training sequence.
    Type: Application
    Filed: December 2, 2010
    Publication date: June 2, 2011
    Inventors: Yong Liu, Hongyuan Zhang, Raja Banerjea, Harish Ramamurthy, Sudhir Srinivasa
  • Method and Apparatus for Sounding Multiple Stations
    Publication number: 20110128947
    Abstract: A plurality of stations to provide sounding feedback in response to a training signal sequence is determined, and a communication frame is generated that includes i) an indication of a request for the plurality of stations to provide sounding feedback corresponding to the training signal sequence, and ii) information indicative of when each of the plurality of stations should transmit sounding feedback, and iii) sounding feedback parameters. The communication frame is transmitted along with the training sequence.
    Type: Application
    Filed: December 2, 2010
    Publication date: June 2, 2011
    Inventors: Yong Liu, Hongyuan Zhang, Raja Banerjea, Harish Ramamurthy, Sudhir Srinivasa
  • Semiconductor die packages with multiple integrated substrates, systems using the same, and methods using the same
    Patent number: 7952204
    Abstract: An exemplary semiconductor die package is disclosed having one or more semiconductor dice disposed on a first substrate, one or more packaged electrical components disposed on a second substrate that is electrical coupled to the first substrate, and an electrically insulating material disposed over portions of the substrates. The first substrate may hold power-handling devices and may be specially constructed to dissipation heat and to facilitate fast and inexpensive manufacturing. The second substrate may hold packaged components of control circuitry for the power-handling devices, and may be specially constructed to enable fast and inexpensive wiring design and fast and inexpensive component assembly. The first substrate may be used with different designs of the second substrate.
    Type: Grant
    Filed: April 14, 2008
    Date of Patent: May 31, 2011
    Assignee: Fairchild Semiconductor Corporation
    Inventors: Yumin Liu, Hua Yang, Yong Liu, Tiburcio A. Maldo
  • MICROELECTROMECHANICAL SYSTEMS MICROPHONE PACKAGING SYSTEMS
    Publication number: 20110121413
    Abstract: This document discusses, among other things, a conductive frame, a silicon die coupled to the conductive frame, the silicon die including a vibratory diaphragm, the die having a silicon die top opposite a silicon die bottom, with a silicon die port extending through the silicon die to the vibratory diaphragm, with a silicon die terminal in electrical communication with the conductive frame and an insulator affixed to the conductive frame and the silicon die, with the insulator extending through interstices in the conductive frame to a conductive frame bottom of the conductive frame, and around an exterior of the silicon die to the silicon die top, with the insulator physically affixed to the silicon die and to the conductive frame, with the silicon die port exposed and with a conductive frame terminal disposed at the conductive frame bottom in electrical communication with the silicon die terminal.
    Type: Application
    Filed: November 16, 2010
    Publication date: May 26, 2011
    Inventors: Howard Allen, Luke England, Douglas Alan Hawks, Yong Liu, Stephen Martin
  • Multi-Channel Wireless Communications
    Publication number: 20110116401
    Abstract: Systems and techniques relating to wireless communications are described. A described technique includes monitoring wireless communication channels, including a first channel and a second channel, to produce a monitoring output, determining a first transmission period for the first channel, determining a second transmission period for the second channel, transmitting, based on the first transmission period, a first packet on the first channel to cause one or more wireless communication devices to set a transmission protection period for the first channel and the second channel based on a reception of the first packet, transmitting, based on the second transmission period, a second packet on the second channel, and monitoring, after the end of the first transmission period, for one or more acknowledgements. An end of the second transmission period can be aligned with an end of the first transmission period.
    Type: Application
    Filed: November 12, 2010
    Publication date: May 19, 2011
    Inventors: Raja Banerjea, Yong Liu, Hongyuan Zhang, Harish Ramamurthy, Sudhir Srinivasa
  • Phosphating solution and method for conversion treating surface of magnesium alloy workpiece
    Patent number: 7942983
    Abstract: An exemplary phosphating solution is used for conversion treating a surface of a magnesium alloy workpiece. The phosphating solution includes: 2.89 gram/liter to 8.67 gram/liter of phosphoric acid, 0.3 gram/liter to 1.0 gram/liter of carbamide, 0.39 gram/liter to 1.56 gram/liter of nitric acid, 6 gram/liter to 30 gram/liter of manganese dihydrogen phosphate, and 0.2 gram/liter to 0.6 gram/liter of tannin. A method for conversion treating a surface of a magnesium alloy workpiece is also provided.
    Type: Grant
    Filed: July 3, 2008
    Date of Patent: May 17, 2011
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Sheng-En Hsu, Yong Liu, Fei-Xiang Li, Zhao Jin
  • OPTOCOUPLER DEVICES
    Publication number: 20110108747
    Abstract: Optocoupler devices and methods for making and using such devices are described. The optocoupler devices contain a light emitting component (a light emitting diode [LED]) and a light receiving component (a phototransistor [PT]) device that are embedded within the substrate, rather than being attached to the surface of the pre-molded substrate. Such a configuration eliminates the bond wires that are often used when the LED and PT are attached on the substrate, improves the electrical performance, and allows the final optocoupler package to be made smaller and thinner. Other embodiments are described.
    Type: Application
    Filed: November 12, 2009
    Publication date: May 12, 2011
    Inventor: Yong Liu
  • Power Saving in a Communication Device
    Publication number: 20110103280
    Abstract: A method in a communication device for processing a received data unit includes determining whether the communication device is an intended receiver based on the received data unit, determining whether the received data unit includes an exclusive use indication, where the exclusive use indication indicates that a plurality of data units are transmitted only to the at least one intended receiver during a time period, where each of the plurality of data units has at least a respective physical layer (PHY) preamble, and determining a time interval during which the communication device need not listen for incoming data units using (i) a result of determining whether the received data unit includes an exclusive use indication and (ii) a result of determining whether the communication device is an intended receiver.
    Type: Application
    Filed: November 2, 2010
    Publication date: May 5, 2011
    Inventors: Yong Liu, Hongyuan Zhang
  • Die scale strain gauge
    Patent number: 7934430
    Abstract: A chip with resistive, metallic strain gauges distributed on surfaces on and buried within the chip. Also, vertically arranged vias and vertical thin film resistive strain gauges are described. The resistive strain gauges can be multiplexed wherein strain can be measured across the topology of the chip in each of the top, bottom and buried layers and any vertical strain. The resistive strain gauges may be in serpentine patterns and may be arranged on via or on vertical edges of grooves that extend from an upper or lower surface of the chip to buried layers. In this fashion, the distributed strain gauges may be used to map the strain throughout the body of a chip. A Kelvin bridge may be used to measure the strain, but other such measuring techniques and devices may be used.
    Type: Grant
    Filed: November 1, 2007
    Date of Patent: May 3, 2011
    Assignee: Fairchild Semiconductor Corporation
    Inventors: Scott Irving, Yong Liu, Timwah Luk
  • NUMBER OF STREAMS INDICATION FOR WLAN
    Publication number: 20110096796
    Abstract: In a method for generating a preamble of a data unit for transmission via a communication channel, an indication of a first number of spatial or space-time streams is included in a first field of the preamble. The first number of spatial or space-time streams corresponds to transmission of the data unit to a first receiver. One or more training sequences are included in a second field of the preamble. The preamble is formatted such that the first field of the preamble will be transmitted prior to the second field of the preamble being transmitted.
    Type: Application
    Filed: October 22, 2010
    Publication date: April 28, 2011
    Inventors: HONGYUAN ZHANG, Raja Banerjea, Yong Liu, Mao Yu
  • TRAINING SEQUENCE INDICATION FOR WLAN
    Publication number: 20110096797
    Abstract: In a method for generating a preamble of a data unit for transmission via a multiple input, multiple output (MIMO) communication channel, a first field of the preamble is generated. The first field provides a plurality of indicators to a plurality of receivers. Each one of the plurality of indicators indicates a set of a plurality of training sequences that corresponds to transmission of the data unit to a corresponding one of the plurality of receivers. The plurality of training sequences is included in a second field of the preamble. The preamble is formatted such that the first field of the preamble will be transmitted prior to the second field of the preamble being transmitted.
    Type: Application
    Filed: October 22, 2010
    Publication date: April 28, 2011
    Inventors: Hongyuan Zhang, Raja Banerjea, Yong Liu, Mao Yu
  • Miniaturized Magnetic Resonance Systems and Methods
    Publication number: 20110091987
    Abstract: The present application describes devices, systems, and techniques related to a chip-based, miniaturized NMR diagnostic platform for rapid, quantitative and multi-channeled detection of biological targets.
    Type: Application
    Filed: October 6, 2008
    Publication date: April 21, 2011
    Inventors: Ralph Weissleder, Hakho Lee, Donhee Ham, Nan Sun, Yong Liu