Abstract: A digital image capturing and processing system including a system housing having an imaging window; illumination and imaging stations for generating and projecting illumination and imaging planes or zones through the imaging window, and into a 3D imaging volume definable relative to the imaging window, for digital imaging an object passing through the 3D imaging volume, and generating digital linear images of the object as the object intersects the illumination and imaging planes or zones during system operation. A digital image processor processes the digital images and automatically recognizes graphical intelligence (e.g. bar code symbols, alphanumeric characters etc) graphically represented in the digital images.

Abstract: An apparatus and method for testing large area substrates is described. The large area substrates include patterns of displays and contact points electrically coupled to the displays on the large area substrate. The apparatus includes a prober assembly that is movable relative to the large area substrate and/or the contact points, and may be configured to test various patterns of displays and contact points on various large area substrates. The prober assembly is also configured to test fractional sections of the large area substrate positioned on a testing table, and the prober assembly may be configured for different display and contact point patterns without removing the prober assembly from the testing table.

Abstract: A planar laser illumination module (PLIM) including: (i) a laser illumination source driven preferably by high frequency modulated (HFM) diode current drive circuitry; (ii) a beam collimating optics disposed beyond the laser illumination source; (ii) an optical beam multiplexer (OMUX) device disposed beyond the collimating optics; and (iv) a planarizing-type illumination lens array disposed beyond the OMUX device, and arranged for generating a plurality of substantially planar coherence-reduced laser illumination beams (PLIBs) that form a composite substantially planar laser illumination beam (PLIB) having substantially reduced spatial/temporal coherence.

Abstract: A method includes generating a first data unit to be transmitted during a first time period, including generating a field that specifies a first number of beamforming training data units that can be communicated during a first training session; processing a second data unit received during a second time period, including determining whether the first training session was accepted based on a first field of the second data unit, and determining a second number of beamforming training data units that can be communicated during a second training session based on a second field of the second data unit; and if the first training session was accepted, causing the specified first number of beamforming training data units to be communicated during the first training session.

Abstract: A method of driving a plurality of visible and invisible laser diodes so as to produce an illumination beam having a dynamically managed ratio of visible to invisible (IR) spectral energy/power during object illumination and imaging operations. The method involves supplying a plurality of visible laser and invisible laser diodes with a predetermined/default values of diode drive currents so as to illuminate the object with a spectral mixture of illumination during object illumination and imaging operations. One or more digital images of the illuminated object are captured and the image contrast quality thereof is measured, in real-time, so as to generate feedback or control data.

Abstract: A laser beam despeckling device including a laser diode for producing a laser beam having a central characteristic wavelength. The device includes diode current drive circuitry for producing a diode drive current to drive said laser diode and produce said laser beam. High frequency modulation (HFM) circuitry modulates the diode drive current at a sufficiently high frequency to cause said laser diode to produce spectral side-band components about the central characteristic wavelength, and reducing the coherence as well as coherence length of the laser beam. An optical beam multiplexing (OMUX) module is provided for receiving the laser beam as input beam, a generating as output, a plurality of laser beam components that are recombined to produce a composite laser beam having substantially reduced coherence for use in illumination applications where a substantial reduction in speckle pattern noise is achieved.

Abstract: Disclosed are packages for optocouplers and methods of making the same. An exemplary optocoupler comprises a substrate having a first surface and a second surface, a plurality of optoelectronic dice for one or more optocouplers disposed on the substrate's first surface, and a plurality of optoelectronic dice for one or more optocouplers disposed on the substrate's second surface. The substrate may comprise a pre-molded leadframe, and electrical connections between optoelectronic dice on opposite surfaces of the substrate may be made via one or more leads of the leadframe.

Abstract: A semiconductor die package. The semiconductor die package includes a leadframe structure, a first semiconductor die comprising a first surface attached to a first side of the leadframe structure, and a second semiconductor die attached to a second side of the leadframe structure. The second semiconductor die comprises an integrated circuit die. A housing material is formed over at least a portion of the leadframe structure, the first semiconductor die, and the second semiconductor die. An exterior surface of the molding material is substantially coplanar with the first surface of the semiconductor die.

Abstract: A semiconductor die package. It includes a substrate having a first surface and a second surface, a first semiconductor die having its front surface facing the first surface of the substrate, a conductive adhesive disposed between the first semiconductor die and the first surface of the substrate, and a second semiconductor die located on the first semiconductor die. The front surface of second semiconductor die faces away from the first semiconductor die, and the back surface faces toward the first semiconductor die. A plurality of conductive structures electrically couple regions at the front surface of the second semiconductor die to conductive regions at the first surface of the substrate.

Abstract: A device for optically multiplexing a laser beam, having a glass plate construction with an input surface and an output surface, and bearing reflective and semi-reflective coatings arranged so as to optically multiplex an input laser beam entering the input surface, into multiple spatial-coherence reduced output laser beams exiting from the output surface. Through such optical multiplexing, and recombination, the coherence of the resulting laser beam is substantially reduced, as is the power of speckle pattern noise observed at an image detection array detecting an image of an object illuminated by said laser beam.

Abstract: A wireless electronic-ink display device supported in packaging, and employing a power switching mechanism which operates to prevent leakage, drainage or discharge of the electro-chemical battery until a change in predetermined state of configuration occurs. The wireless electronic-ink based display device comprises (i) a power source module with an electro-chemical battery, (ii) a power management module for managing the power levels within the wireless electronic-ink display device, and (iii) a power switching module, arranged between the power source module and the power management module, and automatically responsive to a change in at least one predefined state of device configuration, to prevent leakage, drainage or discharge of the electrochemical battery until a change in predetermined state of configuration occurs.

Abstract: A data routing method and system, the data routing method including: locating a destination node using a destination locating packet; establishing a preliminary route including anchor nodes based on a route where the destination locating packet is transmitted to the destination node; determining a link cost between neighbor nodes of each of the anchor nodes, and also between the anchor nodes and the neighbor nodes of each of the anchor nodes; generating minimum cost information with respect to a route consuming a minimum cost from the destination node to a source node using the link cost; and forming a data route from the destination node to the source node using the minimum cost information.

Abstract: A multichip module buck converter 10 has a high side power mosfet 12, a low side power mosfet 22 and a pre-molded leadframe 40 between the two mosfets for connecting the source of mosfet 12 to the drain of mosfet 22. Clips 14, 16, 18 and 26 carry the source, gate and drain terminals of the mosfet from planes parallel but spaced apart to a common plane.

Abstract: Disclosed in this specification is a multiphase buck converter package and process for forming such package. The package includes at least four dies and at least nine parallel leads. The dies are electrically connected through a plurality of die attach pads, thus eliminating the need for wirebonding.

Abstract: A semiconductor die package. Embodiments of the package can include a substrate with solid conductive pins disposed throughout. A semiconductor die can be attached to a surface of the substrate. Electrical connection to the semiconductor die can be provided by the solid conductive pins.

Abstract: A method includes generating a first data unit to be transmitted during a first time period to one or several stations assumed to be beamformed, including determining a time interval that separates the first time period from a second time period, such that a second data unit is transmitted during the second time period to one or several stations assumed to be beamformed, and generating a parameter indicative of the time interval, such that the first data unit includes the parameter.

Abstract: In one form a stackable electrical device package has a first plurality of traces, the electrical device bonded to at least some of the first plurality of traces, a second plurality of vertical posts attached to the first plurality of traces, and encapsulation material enclosing the electrical device and sides of the first plurality of traces and the second plurality of vertical posts such that bottoms of the first plurality of traces are exposed on the bottom of the semiconductor package, and tops of the vertical posts are exposed on the top of the semiconductor package.

Abstract: View-upload decoupled (“VUD”) peer-to-peer (P2P) video distribution is provided, in which each peer is assigned to one or more channels to upload, with the assignments made independent of what the peer is viewing. For each assigned channel, the peer distributes (that is, uploads) the channel. This effectively creates semi-permanent distribution swarms for each channel, which are formed by peers responsible for uploading that channel. This can minimize problems associated with channel churn because peers may remain in their assigned distribution groups even if they switch channels. To minimize cross-channel overhead associated with VUD P2P video distribution, substream swarming, in which a peer in a distribution swarm only downloads a small portion of the video stream, called a substream, and uploads the substream to multiple viewers, may be provided.

Abstract: A laser machining system comprises a laser configured to generate a laser output for forming a molten pool on a substrate, a nozzle configured to supply a growth material to the molten pool for depositing the material on the substrate, and an optical unit configured to capture a plurality of grayscale images comprising temperature data during the laser deposition process, wherein the grayscale images correspond to respective ones of a plurality of radiation beams with different desired wavelengths. Further, the laser machining system comprises an image-processing unit configured to process the grayscale images to retrieve the temperature data according to linear relationships between temperatures in the laser deposition process and the corresponding grayscales of the respective images. A laser machining method is also presented.

Abstract: A digital image capturing and processing system for illuminating objects using automatic object detection and spectral-mixing illumination technique. The system comprises an area-type illumination and imaging module for projecting a coextensive area-type illumination and imaging field (i.e. zone) into a 3D imaging volume during object illumination and imaging operations. The area-type illumination and imaging module includes a spectral-mixing based illumination subsystem for producing a first field of visible illumination from an array of visible LEDs, and producing a second field of invisible illumination from an array of infrared (IR) LEDs, wherein the first and second fields of illumination spatially overlap and intermix with each other and produce a composite illumination field that is at least substantially coextensive with the FOV of the image sensing array.